Hi Ted,
There can not be any "documentation or references that link the number of
cycles of air to air thermal shock to the thermal oven cycling" for solder
joints, because solder joint failures occurring from these loading conditions
come from different loading mechanisms and are therefore not typically
relatable.Bare board testing is relatable if thermal equilibrium is
achievedin thermalshockand T-shock is not too extreme.
On top of this, even thermal oven cycles of -65 degrees C to +125 degrees C,
produces failures in solder joints by confounding multiple damage mechanisms,
and it therefore also can ot be related to more typical functional use
environments.
I would suggest you take a look at IPC-SM-785, Guidelines for Accelerated
Reliability Testing, for some more detailed information.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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