Contact: Dan Green
847-790-5371
FOR IMMEDIATE RELEASE
IPC FLEXES EDUCATIONAL MUSCLE AT FLEX CONFERENCE
Northbrook, IL 05/18/99
Workshops and a two-day tabletop exhibit have been added to the agenda for IPC's
Fifth Annual National Conference on Flexible Circuits. Taking place June 8-10, 1999,
at the Holiday Inn Denver International Airport in Denver, Colorado, this event
provides an unparalleled educational opportunity for anyone using, designing or
manufacturing flexible circuits.
Three workshops are being held from 8:30 a.m. to 4:00 p.m. on Tuesday, June 8. Bill
Jacobi, Jacobi and Associates, and Thomas Stearns, Brander International Consultants,
will give those not familiar with flexible technology an opportunity to learn the
basics in their course, Flex Circuit Fundamentals.
Russel Griffith, Tyco Printed Circuit Group, will present the electrical, mechanical
and material properties of flex that designers need to understand in his session,
Principles of Flex Circuit Design.
In Flex as and Advanced Packaging Medium, industry leaders Ken Gilleo, Poly-Flex
Circuits, and Joe Fjelstad, Tessera, cover the special characteristics of flex when
used with chip scale, BGA and flip chip packages.
The two-day conference begins on Tuesday, June 9, with a keynote presentation by Walt
Hinton, chief strategist for Storage Technology. This year's conference focuses on
laser processing technologies that are used to create extremely fine features and
small diameter blind and buried vias. Also being featured are new material
constructions that provide reliable, low-cost substrates.
"Laser is a major player, not only in microvia formation, but also in other areas of
high density flexible circuit manufacturing," says John Riley, IPC educational
director. "The technologies being discussed at this conference will be commonplace in
the industry in the next few years."
The following presentations highlight the nearly 25 that will be made during the
two-day conference:
* Fine Pitch Flex for Medical Applications, Bill Burdick, GE Corporation Research -
GE has developed a fine pitch flex interconnect technology, utilizing micro-vias for
GE, military and commercial applications. Relative to fine pitch flex interconnect,
Burdick will review this technology.
* Highly Dimensional Stable Polyimide film APICAL(tm) HP and its Applications,
Hiroyuki Furutani, Kaneka Corporation - Plasma display and multi-layer PWB
applications rely on the development of precise circuits with high-dimensiopnal
stability and heat resistance. APICAL(tm) HP has been successfully developed as the
appropriate base film for this trend, and in his presentation, Furutani will discuss
the properties of APICAL(tm) HP.
* Laser Beam Drilling of Flexible Circuits Based on Polysiloxane, Sabine Kellerman,
Bavarian Laser Center Ltd. - Polysiloxane foils are a new dielectric material with a
high usage temperature as well as a high thermal conductivity for flexible circuits.
In this presentation, Kellerman will explain how different sensors are used to detect
reflected Nd:YAG laser light (directed or scattered) and the plasma plume can lead to
an increase in process reliability and an optimization of processed time.
Attendees at this year's conference are also going to have the opportunity to give
their feedback on a recently released industry standard. Some concerns have been
raised about tables used in IPC-6013, Qualification and Performance Specification for
Flexible Printed Boards and its recently published appendix. IPC wants industry
feedback to help decide what steps should be taken to improve IPC-6013.
For information on attending IPC's 5th Annual National Conference on Flexible
Circuits, contact John Riley at (847) 790-5308, e-mail [log in to unmask], or visit
www.ipc.org.
IPC is a US-based trade association dedicated to the competitive excellence and
financial success of its nearly 2,600 member companies which represent all facets of
the electronic interconnection industry, including design, printed wiring board
manufacturing and electronics assembly. As a member-driven organization and leading
source for industry standards, training, market research and public policy advocacy,
IPC supports programs to meet the needs of a $26 billion US industry employing more
than 250,000 people.
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TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
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