Hi everybody,

I saw a lot of discussions around problems that show on finished assemblies.
This includes splashing, voiding, opens.
In the end all this comes to one Big Daddy, that is reflow profiling.

My question is: does anybody know a place in the cyber world (I'd rather go
for this) or in the vast SMT libraries where a reference profile is shown
and all the steps are thoroughly explained?
You know, that kind of profile I see in the data sheets every time we get a
new component. The only problem is these ones are very slim, they only say
this is the soak area, if you are below line you get splattering or voiding,
if you are above you burn the board, try to be under 215C for the top of
component, slope 2-4C, etc.

Me, I need to know what happens in each area, what are the ranges of the
temperatures and slopes, if one changes one parameter, like temperature or
time, what will happen and so on.

By the way, I'm using a convection reflow oven and, for the brothers in
Europe, I'm located in Montreal, Canada.

Regards,   Ioan

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