Soda Strawing....back in my day....Hehehe...meant a
small air pocket located along the trace edge(s) under
the soldermask (or flex covercoat). When parts were
wet processed or fluxed with, or followed by heat,
the corrosive chemistry(s) would wick up along the
traces and create problems. This is more prevalent
with overplated traces and dryfilm soldermasks.
SIC values can be really high because the solutions
can leach out during SIC testing. Issues like that
could result in a latent failure of the copper
conductors under the soldermasks (covercoats).
With the advent of LPI Soldermask I haven't heard
about this for a LONG....LONG time.
Good Luck.
Groovy
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