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May 1999

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Subject:
From:
Jeff Hempton <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Jeff Hempton" <[log in to unmask]>
Date:
Tue, 18 May 1999 10:00:44 -0400
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     Ioan,
       The Component vendor data sheets are good for just the things you
     mentioned: Max temp component can withstand, and max slope (rise &
     fall) the component can withstand. The best total profile information
     will come from your solder paste vendor. They will provide a total
     "recommended best" profile for their paste. some like a "knee" in the
     soak zone, but many newer formulations no longer need the knee. This
     is good since the more you reduce the soak time requirements, the
     faster your profile (and thru-put!!). Anyway, call yer local paste
     vendor for theie recommendations. If you compare paste vendors
     profiles, they are all getting to be close to the same anymore. I use
     the same reflow profiles on 3 different vendors NC pastes, and they
     all perform very well. The "Profiling Basics" still hold true for most
     good paste formulations.
     Good luck and regards,
     Jeff Hempton
     United Technology Electronic Controls.


______________________________ Forward Header __________________________________
Subject: [TN] Reflow profile
Author:  "Tempea; Ioan" <[log in to unmask]> at Internet
Date:    5/18/1999 9:35 AM


Hi everybody,

I saw a lot of discussions around problems that show on finished assemblies.
This includes splashing, voiding, opens.
In the end all this comes to one Big Daddy, that is reflow profiling.

My question is: does anybody know a place in the cyber world (I'd rather go
for this) or in the vast SMT libraries where a reference profile is shown
and all the steps are thoroughly explained?
You know, that kind of profile I see in the data sheets every time we get a
new component. The only problem is these ones are very slim, they only say
this is the soak area, if you are below line you get splattering or voiding,
if you are above you burn the board, try to be under 215C for the top of
component, slope 2-4C, etc.

Me, I need to know what happens in each area, what are the ranges of the
temperatures and slopes, if one changes one parameter, like temperature or
time, what will happen and so on.

By the way, I'm using a convection reflow oven and, for the brothers in
Europe, I'm located in Montreal, Canada.

Regards,   Ioan

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