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January 1997


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Table of Contents:

"Tinning house" (5 messages)
"Wet" Soldermask (1 message)
3D Stereoscopes (2 messages)
55110E (1 message)
<No subject> (1 message)
<none> (4 messages)
Ablebond??? (1 message)
Absorption mechanism of PTH (2 messages)
ACF vs Soldering (1 message)
Adhesive applicatiion equipment on flex rigid boards (1 message)
Adhesive applicatiion equipment on flex rigid boards. (6 messages)
ADMIN: IPC Chat (5 messages)
ADMIN: IPCchat - good news (1 message)
ADMIN: IPCchat session announcement (2 messages)
ADMIN: TechNet problem (1 message)
ADMIN: What is Eric's Number (1 message)
Alumina Oxide Surface Prep (2 messages)
Aluminum oxide scrubbers (1 message)
ANSI/IPC-R-700c (1 message)
Area Code Change 310---->>>> 562 (1 message)
Aspect Ratio (1 message)
Aspect Ratios (4 messages)
Aspect Ratios -Reply (2 messages)
ASS:Wave Solder Board Support (1 message)
ASSEM: Copper Choride problem (6 messages)
ASSEM: Re: JEDEC Info. (1 message)
Assem: under stencil cleaner (2 messages)
Assembly (3 messages)
Assembly: ESD (3 messages)
Assembly: ESD -Reply (1 message)
ASSM: Top fillet formation (1 message)
ASSY (3 messages)
ASSY : Ionic Contamination on FR2 (5 messages)
ASSY : pretinning of fine-pitch devices (3 messages)
ASSY: adhesive pads (1 message)
ASSY: Desiccant Quantity for 15 Year Storage of VMEs (2 messages)
ASSY: Fine Pitch Solder Joint Inspection Method? (6 messages)
ASSY: Florida Cirtech (WS120 and WS130) (1 message)
ASSY: IR Reflow of Thru-Hole Components (7 messages)
ASSY: J-STD-001 vs. IPC-A-610 (3 messages)
ASSY: Jumpers and cuts (3 messages)
ASSY: Low Tin Level in Wave Solder (10 messages)
ASSY: Manix Component Counter (or similar) (2 messages)
ASSY: Manix Mfg Component Counter (or similar) (1 message)
ASSY: Moire Interferometry (2 messages)
ASSY: MTBF for Components, relating to ESD (1 message)
ASSY: OSP coatings (5 messages)
ASSY: Pre-tinning of Gold Leads (5 messages)
Assy: Press Fit (2 messages)
assy: Press In (1 message)
Assy: Rigid Flex (2 messages)
ASSY: Solder Paste Process Control (1 message)
Assy: Solder Skip (3 messages)
ASSY: thermocouple adhesive (6 messages)
ASSY: TSOP with Alloy 42 lead frame field failures (3 messages)
ASSY: TSOP/PLCC reliability (1 message)
ASSY:J-STD-001 vs. IPC-A-610 (1 message)
ASSY:Mil-std 55110?? (3 messages)
ASSY:solder paste qual (1 message)
Assy:TopLine (9 messages)
AW: Re: dielectrics for dif materials (1 message)
backfilling holes at press (1 message)
BGA :ASSY/REWORK (3 messages)
BGA's machines (1 message)
blanks boards (1 message)
Breakaway holes (1 message)
Breakaway holes and V-groove scoring (1 message)
Buried Capacitance / Resistance (3 messages)
Call for Speakers in London (1 message)
Can somebody give me some advice? (2 messages)
CIMS (1 message)
Circo Flex (1 message)
cleaners for RMA flux (5 messages)
Compressors (2 messages)
Conductive foam (5 messages)
conformal coating help (6 messages)
Conformal Coating Suppli (1 message)
Conformal Coating Supplier (1 message)
conformal coating vendor request (2 messages)
Connector placement (2 messages)
Contact pads (1 message)
Controlled Impedance (5 messages)
controlled impedance p.c.b's (2 messages)
convection rates (4 messages)
Copper (2 messages)
Copper scopping in solder (1 message)
Creep Rupture testing on BGA (1 message)
current carrying capacity (2 messages)
current in screened silver circuits (4 messages)
defect ppm data (1 message)
Depanelising Ceramic Substrate (1 message)
DES- Gerber formats? (1 message)
DES/FAB:switchpad contacts (2 messages)
DES: Ag polmer via holes (1 message)
DES: Ag polmer via holes - contact (1 message)
DES: Heat Rise Calculations For Flex Part II (1 message)
DES: Internodal Capacitance & Inductance (1 message)
DES: package style ? (1 message)
Des: temp rise (current) (1 message)
DES: trace layout (4 messages)
Design issues (current carrying variables) (3 messages)
Design Standards for BGA (6 messages)
Dielectric Constant of FR-4 and Getek (1 message)
dielectrics for dif materials (3 messages)
Direct metallization (1 message)
Direct metallization for MIL grade PCBs. (2 messages)
direct plating (1 message)
Dispenser for solder preforms (1 message)
DOC:IEC Component value code (6 messages)
Drill Spindle Runout (2 messages)
Dry Film Solder Mask (2 messages)
Dry Film Soldermask (2 messages)
dynamic spindle runout (1 message)
E-Mail addresses (6 messages)
Edmund Scientific Catalog (2 messages)
Effects of temp on growth rate of tin oxide and Cu-Sn IM (1 message)
Effects of temp on growth rate of tin oxide and Cu-Sn IMC (1 message)
Employment (1 message)
Entek Plus Cu-106A (3 messages)
epoxy screening 0603's (2 messages)
epoxy vs. solder paste (2 messages)
Exposed circuits (4 messages)
Exposed circuits -Reply (1 message)
Fab (6 messages)
FAB - Defective units on panelized PWBs (3 messages)
FAB - Matte masks (1 message)
FAB -Reply (2 messages)
FAB Clear LPI (1 message)
fab SM questions (2 messages)
FAB-Dish downs in copper circuits (4 messages)
FAB: (3 messages)
FAB: Carbon Ink vs. Gold Contact Fingers (2 messages)
FAB: Ceramic Alternative (1 message)
FAB: Clean before solder mask (2 messages)
FAB: Clear LPISM (2 messages)
FAB: Core Filling (1 message)
FAB: CU/Invar/Cu suppliers (1 message)
FAB: CU/Invar/Cu suppliers -Reply (2 messages)
FAB: Cupric chloride regeneration with sodium chlorate (2 messages)
FAB: Deburr (1 message)
Fab: Drill Entry Questions (1 message)
FAB: Electrolytic plating propogation rate testers (2 messages)
FAB: Embedded High Density (1 message)
FAB: exposed copper? (1 message)
Fab: Extended Material Cure Cycles (2 messages)
Fab: Finish LPI thickness on circuits (7 messages)
FAB: Hole filling (1 message)
FAB: Horizontal versus vertical etching (5 messages)
FAB: Immersion tin coating (1 message)
fab: immersion tin coatings (5 messages)
FAB: IPC Printed Circuits Expo (4 messages)
FAB: Panelization Software (1 message)
FAB: Plating distribution/ATE/AOI (1 message)
FAB: prepreg fill (1 message)
FAB: Rick Taormino; diazo film and LPI solder mask (1 message)
FAB: Supplier: Job Opportunities Posting (1 message)
Fab: To Equipment Mfr's & Field Serv Org's (1 message)
FAB: Woven Kevlar (1 message)
FAB:ASS: Solder Balling Resist Trials (1 message)
FAB:ASS: Solder Finish Symposium, UK (1 message)
FAB:ASSY: Solder ball free solder resist ?? (1 message)
FAB:Cedal ADDARA PRESS LAMINATOR (2 messages)
FAB:cross grain construction (4 messages)
FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING (1 message)
FAB:Roller swelling (3 messages)
Fabrication (1 message)
Fabrication of Large Printed Circuit Boards (3 messages)
Fabrication of Printed Circuit Boards (5 messages)
fiducial recognition problems (3 messages)
Filling clearance holes in thick metal innerlayer planes (1 message)
final cleaning of pwb's (1 message)
Flex (2 messages)
flexible circuit (1 message)
Flexible Soldermask (2 messages)
Floating waste water treatment sludge (7 messages)
Flying Probe Testers, Another voice heard! (1 message)
FOOTPRINT PQFP208 (2 messages)
FR4 moisture absorption rate (1 message)
FR4 processing and properties (1 message)
Freezing electroless tin: oxide, IMC, whiskers, and pest (2 messages)
Fuji Tape leaf covers (1 message)
FW: 55110E (3 messages)
FW: ASSY: IR Reflow of Thru-Hole Components (1 message)
FW: FAB - Defective units on panelized PWBs (1 message)
FW: Fabrication of Printed Circuit Boards (1 message)
FW: FW: lab facilities for SEM testing (1 message)
FW: GEN: ISO and Calibration (1 message)
FW: Gold as Etch Resist (1 message)
FW: ISO and calibration (1 message)
FW: Manufacturing Engineer Seeking Employment. (1 message)
FW: ORC EXPOSURE MACHINE (1 message)
FW: Panelization Software (fwd) (1 message)
Fw: Who is Tom Bresnan? Son of Victor Johansen, perhaps? (1 message)
Fwd: GEN: Condor Nonsense (1 message)
Fwd: Re: Who is Tom Bresnan? (1 message)
GEN- ISO and Calibration (1 message)
GEN: Book Review (2 messages)
GEN: Book Review for Flex (1 message)
GEN: CMI After Etch (1 message)
GEN: Condor Nonsense (2 messages)
GEN: Condor Nonsense -Reply (1 message)
GEN: Electrowinning Units (2 messages)
GEN: Electrowinning Units (Long) (1 message)
GEN: ISO and Calibration (5 messages)
GEN: Lead Coplanarity Spec?? (5 messages)
Gen: Looking for Bachi Inc. and Meteor Inc. (2 messages)
Gen: Obsoleted Military Documents (1 message)
GEN: PWB Contract Manufacturers (1 message)
GEN: Shelf life for components... (4 messages)
GEN: Vision Engineering; Just gotta vent (2 messages)
GEN: Where in the world is Ralph Hersey? (4 messages)
GEN: Where in the world is Ralph Hersey? -Reply (1 message)
Gold as Etch Resist (6 messages)
Gold wiring bonding (2 messages)
handling silver halide wastes (1 message)
heat capacity (2 messages)
Hooray for Bob Mesick! (1 message)
how much force to apply on pcb? (1 message)
Hull Cell criteria (4 messages)
I found them !! (1 message)
IEC 1112 (2 messages)
IEC 249-2-9-FVO-EP-CP (2 messages)
IEEE WEBSITE? (3 messages)
ImageFlex (2 messages)
immersion tin (3 messages)
Immersion Tin coatings (1 message)
Info: AT Brackets - GLOBE? (4 messages)
Inner Layer Core Prep (1 message)
IPC Chart on Hi Density Interconnect (1 message)
IPC Chat (3 messages)
IPC CHAT -Reply (1 message)
IPC Convention, San Jose, CA March '97 (1 message)
IPC Convention, San Jose, CA March '97 (fwd) (1 message)
IPC Printed Cts Expo (1 message)
IPC Source for PWB Products/Services (1 message)
IPC-D-356 (4 messages)
IPC-D-356 and IPC356A (1 message)
IPC-D-356 Netlist Testing (1 message)
IPC-RB-276 (1 message)
IPC-RB-276 is OBSOLETE! (2 messages)
IPC-RB-276 is OBSOLETE! -Reply (5 messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply (4 messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply -Reply (1 message)
IPC-SM-840 (4 messages)
ipc356 netlist (1 message)
IPCchat (1 message)
IPCchat session announcement (4 messages)
Is the use of Masking Tape an ESD Event ?? (3 messages)
JEDEC Info. (1 message)
Job listing (1 message)
LA, Calif meeting (1 message)
lab facilities for SEM testing (5 messages)
Labs (1 message)
Laser via source (5 messages)
lifed pads (2 messages)
Manufacturing Engineer Seeking Employment. (2 messages)
Marking (11 messages)
Marking -Reply (1 message)
marking ink (1 message)
Masking Tape and ESD Damage (2 messages)
measuring paste height (10 messages)
melf's (3 messages)
melf's, J-STD-001, IPC-610 (5 messages)
MIL Std. -2000- ??? (2 messages)
missing components (3 messages)
Mixed Tech Assy (1 message)
MTBF/ESD/EOS (1 message)
Need HELP with Mydata machines (4 messages)
Nepcon West'97 (3 messages)
New Substrate Materials for P-BGA (3 messages)
Ni Resins for Gold Plating (3 messages)
No clean Fluxes (1 message)
No messages (1 message)
NO MORE RULE MESSAGES! (1 message)
NO SUBJECT (1 message)
Off topic subject - do not read for technical info. (1 message)
offset stripline (1 message)
Optimizing for Fine Pitch Devices in SMT (2 messages)
ORC exposure machine (2 messages)
other forums (2 messages)
package style ? (6 messages)
Paper Phenolic Assemblies (1 message)
paraCHAT (2 messages)
PEM Reliability (2 messages)
Phone request (3 messages)
Photo-initiation (7 messages)
Phototool dimensional stability (5 messages)
Plasma (5 messages)
Plastic Package Hemeticity (1 message)
plastic package hermeticity (7 messages)
Plotter manufacturers for PCB (1 message)
Post Baking Process (6 messages)
pqfp208 footprint land pattern (1 message)
Probimer 74 (1 message)
Proto-type Quick Turn Boards (5 messages)
Proto-type Quick Turn Boards -Reply (3 messages)
Proto-type Quick Turn Boards -Reply -Reply (1 message)
PWB manufacturing question? (1 message)
qualification plan for BGA soldering process. (4 messages)
qualification plan for BGA soldering process. -Reply (1 message)
Query (1 message)
Quick Turn Boards (1 message)
Raw card MFG process (2 messages)
Re : Re: Woven Kevlar (2 messages)
RE dielectric values for dif (2 messages)
Re Re:Solder blow-out in soldered PTH assemblies (1 message)
Re [2]: lifed pads (1 message)
Re: Aspect Ratios (1 message)
Re: FAB-Dish downs in copper circuits (1 message)
Re:Post Baking Process - Bravo! (1 message)
Reflow of Through-hole (2 messages)
Reflow Soldering of PTH Connectors (4 messages)
Reliability issues and failure modes of Plastic packages (1 message)
Reliability Testing (3 messages)
removing RMA flux (6 messages)
Repeat: Retinning (2 messages)
Resource Planning and Execution Systems Meeting (1 message)
reverse pulse plating system (6 messages)
reverse pulse plating system -Reply (2 messages)
Re[2]: ASSY: J-STD-001 vs. IPC-A-610 (1 message)
Re[2]: ASSY: thermocouple adhesive (1 message)
Re[2]: E-Mail addresses (1 message)
Re[2]: FAB: Horizontal versus vertical etching (1 message)
Re[2]: Laser via source (1 message)
Re[2]: Ni Resins for Gold Plating (1 message)
Re[2]: Post Baking Process (2 messages)
Re[2]: Stripping photo resist problem (1 message)
Re[3]: FAB-Dish downs in copper circuits (1 message)
Rigid Laminate stabilty (2 messages)
Roku Roku Sangyo, Ltd. (1 message)
ROLLER SWELLING (1 message)
Rule: Re: offset stripline (2 messages)
Rule: Re[2]: ASSY: IR Reflow of Thru-Hole Components -Reply (1 message)
science fair (1 message)
screen ink (1 message)
SEM LabTest and Analysis Facilities (1 message)
Shelf Life of Fused Tin/Lead Coated PWBs (1 message)
Shelf Life of Solderable Finishes (1 message)
signup of Joe Dickson (1 message)
Silver Halide Film Development (5 messages)
Silver Halide Film Development (Waste Mgmnt) (1 message)
Silver Halide Film Development -Reply (1 message)
SM version of a through-hole cap (5 messages)
Software (4 messages)
solder blow-out in soldered PTH assemblies (2 messages)
Solder Joint Reliability & Standards (3 messages)
Solder Mask Peel Off (4 messages)
Solder Mask Peel Off - 2 (1 message)
Solder pallets (1 message)
Solder Paste Plastic or Eutectic (1 message)
Solder purification (copper removal) (2 messages)
Solder Resist Plugs (3 messages)
Solder Resist Plugs II (2 messages)
Soldering Profiles (6 messages)
Soldermask Peeling (3 messages)
Soldermask Peeling -Reply (1 message)
SOT23 leadframe alloy (2 messages)
Space Qualified Solder Mask (2 messages)
Space Qualified Solder Mask -Reply (1 message)
Spot peel-soldermask (3 messages)
Sputtering (1 message)
Standard Time Data (2 messages)
Stripping photo resist problem (6 messages)
Subj: Center Support Wire (3 messages)
substrate material (2 messages)
Substrate Materials. (1 message)
Surface Leakage Testing (2 messages)
Surface Mount Test Points (2 messages)
technet (1 message)
TechNet-d Digest V97 #30 (1 message)
temp profile (4 messages)
temp rise (current) (1 message)
Temperature profile (2 messages)
Tenting Process (2 messages)
Terra Universal Dessicant Chambers (1 message)
Test house for ipc tm-650 tests (1 message)
Test temperature range (6 messages)
Test temperature range / SM reliability (1 message)
TEST: Re: Test temperature range (2 messages)
thanks (1 message)
Thanks for Proto-Type house leads (1 message)
The shape of test probes for SMD (4 messages)
Thermal relief gap width (3 messages)
Thermal relief gap width -Reply (1 message)
Thermal sensitive sheet (3 messages)
Thermal sensitive sheets (1 message)
Time to train operators: J-STD-001 and LRNC flux (5 messages)
Tin Coatings (4 messages)
Tom's Apology (1 message)
Trace Damage from Breakaway Holes (6 messages)
Trace Damage from Breakaway Holes -Reply (1 message)
Transmission test (1 message)
TSOP placement (1 message)
Unidentified subject! (9 messages)
Unidentified subject! (Cu balance) (1 message)
unsubscribe (1 message)
Use of standards to ensure solder connection reliability (1 message)
Use of the term "alumina" (1 message)
Vacuum frames (1 message)
vias (5 messages)
VP precision (1 message)
Washing Stencils (3 messages)
WAVE SOLDERING SMT ICS (6 messages)
Whatever happened to ?? (2 messages)
White soldermask (8 messages)
Who is Tom Bresnan? (3 messages)
Woven Kevlar (1 message)
WS-609 paste clean and SM part for filter capacitor (2 messages)
Xray technology (2 messages)
XRF Plating thickness measurement (2 messages)
[2] ASSY: IR Reflow of Thru-Hole Components (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

Re:

Bob Mesick <[log in to unmask]>

Fri, 31 Jan 1997 10:51:38 -0800 (PST)

103 lines

New Thread

"Tinning house"

"Tinning house"

DAVY.J.G- <[log in to unmask]>

Thu, 23 Jan 1997 10:14:20 -0500

45 lines

"Tinning house"

DAVY.J.G- <[log in to unmask]>

Thu, 23 Jan 1997 11:04:08 -0500

42 lines

Re: "Tinning house"

[log in to unmask]

Thu, 23 Jan 1997 22:11:44 -0500 (EST)

42 lines

Re[2]: "Tinning house"

ddhillma <[log in to unmask]>

Fri, 24 Jan 97 05:09:43 cst

99 lines

Re[2]: "Tinning house"

mkwoka01 <[log in to unmask]>

Fri, 24 Jan 1997 09:18:07 -0500

91 lines

New Thread

"Wet" Soldermask

"Wet" Soldermask

Greg Hirneisen <[log in to unmask]>

Mon, 06 Jan 1997 10:06:12 -0500

56 lines

New Thread

3D Stereoscopes

3D Stereoscopes

[log in to unmask]

Wed, 8 Jan 1997 10:52:17 -0600

47 lines

Re: 3D Stereoscopes

[log in to unmask]

Wed, 8 Jan 1997 18:21:49 -0500

62 lines

New Thread

55110E

55110E

Baker,Kelly <[log in to unmask]>

Mon, 27 Jan 1997 06:29:09 -0500

43 lines

New Thread

<No subject>

<No subject>

John Riley <[log in to unmask]>

Thu, 9 Jan 1997 13:20:23 -0600 (CST)

72 lines

New Thread

<none>

Re: <none>

Sherman Banks <[log in to unmask]>

14 Jan 97 06:36:12 PST

49 lines

Re: <none>

Ava Fung <[log in to unmask]>

30 Jan 97 09:50:00 PST

83 lines

Re: <none>

Sherman Banks <[log in to unmask]>

31 Jan 97 08:11:55 PST

46 lines

Re: <none>

Ava Fung <[log in to unmask]>

31 Jan 97 16:15:58 PST

53 lines

New Thread

Ablebond???

Re: Ablebond???

[log in to unmask]

Thu, 2 Jan 1997 13:19:27 -0500

53 lines

New Thread

Absorption mechanism of PTH

Absorption mechanism of PTH

No Name <[log in to unmask]>

Sat, 4 Jan 1997 22:13:42 -0600 (CST)

66 lines

Re: Absorption mechanism of PTH

[log in to unmask]

Sun, 5 Jan 1997 22:17:34 -0500

128 lines

New Thread

ACF vs Soldering

ACF vs Soldering

aposeiko <[log in to unmask]>

Fri, 17 Jan 1997 14:57:21 -0800

42 lines

New Thread

Adhesive applicatiion equipment on flex rigid boards

Re:Adhesive applicatiion equipment on flex rigid boards

David Anderson <[log in to unmask]>

Thu, 09 Jan 1997 16:16:13 -0600

46 lines

New Thread

Adhesive applicatiion equipment on flex rigid boards.

Adhesive applicatiion equipment on flex rigid boards.

Steve Sekanina <[log in to unmask]>

Thu, 9 Jan 1997 15:07:51 +0000

43 lines

Re: Adhesive applicatiion equipment on flex rigid boards.

[log in to unmask]

Thu, 09 Jan 97 13:22:26 PST

59 lines

Re: Adhesive applicatiion equipment on flex rigid boards.

Paul Stolar <[log in to unmask]>

Thu, 09 Jan 97 15:57:19 CDT

59 lines

Re: Adhesive applicatiion equipment on flex rigid boards.

Michael Barmuta <[log in to unmask]>

Thu, 9 Jan 1997 14:29:03 -0800

78 lines

Adhesive applicatiion equipment on flex rigid boards.

[log in to unmask]

Fri, 10 Jan 97 09:23:46 EST

69 lines

Adhesive applicatiion equipment on flex rigid boards.

Steve Sekanina <[log in to unmask]>

Thu, 9 Jan 1997 15:07:51 +0000

54 lines

New Thread

ADMIN: IPC Chat

ADMIN: IPC Chat

[log in to unmask]

Fri, 10 Jan 1997 17:08:18 -0600 (CST)

81 lines

Re: ADMIN: IPC Chat

[log in to unmask]

Sat, 11 Jan 1997 00:19:25 -0500 (EST)

38 lines

Re: ADMIN: IPC Chat

jseeger <[log in to unmask]>

Tue, 14 Jan 1997 14:56:13 -0500

85 lines

ADMIN: IPC Chat

[log in to unmask]

Tue, 14 Jan 1997 16:28:19 -0600 (CST)

70 lines

ADMIN: IPC Chat

[log in to unmask]

Thu, 16 Jan 1997 14:21:10 -0600 (CST)

477 lines

New Thread

ADMIN: IPCchat - good news

ADMIN: IPCchat - good news

[log in to unmask]

Thu, 16 Jan 1997 15:25:51 -0600 (CST)

62 lines

New Thread

ADMIN: IPCchat session announcement

ADMIN: IPCchat session announcement

[log in to unmask]

Fri, 24 Jan 1997 18:24:07 -0600 (CST)

92 lines

ADMIN: IPCchat session announcement

[log in to unmask]

Fri, 24 Jan 1997 18:24:07 -0600 (CST)

92 lines

New Thread

ADMIN: TechNet problem

ADMIN: TechNet problem

[log in to unmask]

Fri, 31 Jan 1997 11:54:40 -0600 (CST)

66 lines

New Thread

ADMIN: What is Eric's Number

ADMIN: What is Eric's Number

Melinda Robinson <[log in to unmask]>

Wed, 22 Jan 1997 17:20:42 -0600 (CST)

52 lines

New Thread

Alumina Oxide Surface Prep

Alumina Oxide Surface Prep

[log in to unmask]

Thu, 2 Jan 1997 19:01:31 -0500

42 lines

Re: Alumina Oxide Surface Prep

[log in to unmask]

Thu, 2 Jan 1997 23:31:54 -0500

52 lines

New Thread

Aluminum oxide scrubbers

Aluminum oxide scrubbers

[log in to unmask]

Tue, 7 Jan 1997 13:08:45 -0500

50 lines

New Thread

ANSI/IPC-R-700c

ANSI/IPC-R-700c

Richard Boerdner <[log in to unmask]>

Fri, 24 Jan 1997 16:52:50 +0000

39 lines

New Thread

Area Code Change 310---->>>> 562

Area Code Change 310---->>>> 562

Bernard Kessler & Associates LTD <[log in to unmask]>

Tue, 28 Jan 97 18:19 EST

86 lines

New Thread

Aspect Ratio

Aspect Ratio

Dan Lorinser <[log in to unmask]>

Mon, 06 Jan 1997 10:28:07 -0600

43 lines

New Thread

Aspect Ratios

RE: Aspect Ratios

Wander, Nicholas G RV <[log in to unmask]>

Thu, 02 Jan 97 13:29:00 CST

142 lines

RE: Aspect Ratios

Wander, Nicholas G RV <[log in to unmask]>

Thu, 02 Jan 97 14:53:00 CST

98 lines

Re[2]: Aspect Ratios

[log in to unmask][log in to unmask]

Fri, 03 Jan 97 09:47:41 EST

162 lines

Re: Aspect Ratios

[log in to unmask]

Fri, 3 Jan 1997 13:57:41 -0600

130 lines

New Thread

Aspect Ratios -Reply

RE: Aspect Ratios -Reply

Dan Lorinser <[log in to unmask]>

Fri, 03 Jan 1997 08:32:30 -0600

168 lines

RE: Aspect Ratios -Reply

Wander, Nicholas G RV <[log in to unmask]>

Fri, 03 Jan 97 10:27:00 CST

140 lines

New Thread

ASS:Wave Solder Board Support

ASS:Wave Solder Board Support

Bob Willis <[log in to unmask]>

10 Jan 97 10:39:05 EST

99 lines

New Thread

ASSEM: Copper Choride problem

ASSEM: Copper Choride problem

YAP CHOW LAN <[log in to unmask]>

Wed, 8 Jan 1997 16:00:07 +0800

51 lines

Re: ASSEM: Copper Choride problem

ddsulliv <[log in to unmask]>

Wed, 08 Jan 97 16:25:22 cst

118 lines

Re: ASSEM: Copper Choride problem

[log in to unmask]

Wed, 8 Jan 1997 18:14:51 -0500

70 lines

Re: ASSEM: Copper Choride problem

D. Rooke <[log in to unmask]>

Wed, 8 Jan 1997 21:35:17 -0500 (EST)

96 lines

Re: ASSEM: Copper Choride problem

[log in to unmask]

Thu, 9 Jan 1997 21:27:12 -0500 (EST)

38 lines

Re: ASSEM: Copper Choride problem

Steve Mikell <[log in to unmask]>

Fri, 10 Jan 1997 00:39:00 -0600 (CST)

82 lines

New Thread

ASSEM: Re: JEDEC Info.

ASSEM: Re: JEDEC Info.

Mike Buetow <[log in to unmask]>

Thu, 30 Jan 1997 10:43:30 -0600 (CST)

79 lines

New Thread

Assem: under stencil cleaner

Assem: under stencil cleaner

[log in to unmask]

Tue, 14 Jan 1997 17:03:22 +1200

58 lines

RE: Assem: under stencil cleaner

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 14 Jan 1997 07:53:00 -0500 (EST)

63 lines

New Thread

Assembly

RE: Assembly

Jack W. Bryant <[log in to unmask]>

Mon, 20 Jan 1997 07:27:34 -0500

43 lines

RE: Assembly

Jerry Cupples <[log in to unmask]>

Mon, 20 Jan 1997 09:38:26 -0600

60 lines

RE: Assembly

Jan Satterfield <[log in to unmask]>

Mon, 20 Jan 97 9:10

83 lines

New Thread

Assembly: ESD

Assembly: ESD

ddhillma <[log in to unmask]>

Fri, 31 Jan 97 08:58:37 cst

48 lines

RE: Assembly: ESD

Darrell Bonzo <[log in to unmask]>

Fri, 31 Jan 97 15:47

80 lines

Re: Assembly: ESD

Hollandsworth, Ron <[log in to unmask]>

Fri, 31 Jan 97 16:24:04 EST

88 lines

New Thread

Assembly: ESD -Reply

Assembly: ESD -Reply

David Anderson <[log in to unmask]>

Fri, 31 Jan 1997 14:17:05 -0600

37 lines

New Thread

ASSM: Top fillet formation

Re[2]: ASSM: Top fillet formation

Aric Parr <[log in to unmask]>

02 Jan 97 15:59:25 -0500

146 lines

New Thread

ASSY

ASSY

Mike Cussen <[log in to unmask]>

Tue, 14 Jan 97 11:37 EST

42 lines

Re: ASSY

[log in to unmask]

Tue, 14 Jan 1997 23:00:10 -0500 (EST)

50 lines

Re: ASSY

[log in to unmask]

Tue, 14 Jan 1997 23:00:10 -0500 (EST)

144 lines

New Thread

ASSY : Ionic Contamination on FR2

ASSY : Ionic Contamination on FR2

John Barton <[log in to unmask]>

Fri, 10 Jan 1997 10:14:54 +0000 (WET)

50 lines

RE: ASSY : Ionic Contamination on FR2

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Fri, 10 Jan 97 17:25:15 EST

59 lines

Re: ASSY : Ionic Contamination on FR2

[log in to unmask]

Sat, 11 Jan 1997 00:20:58 -0500 (EST)

44 lines

Re: ASSY : Ionic Contamination on FR2

John Barton <[log in to unmask]>

Mon, 20 Jan 1997 10:23:54 +0000 (WET)

64 lines

Re: ASSY : Ionic Contamination on FR2

John Barton <[log in to unmask]>

Fri, 24 Jan 1997 12:36:39 +0000 (WET)

91 lines

New Thread

ASSY : pretinning of fine-pitch devices

ASSY : pretinning of fine-pitch devices

D. Terstegge <[log in to unmask]>

Tue, 14 Jan 1997 21:05:22 +0100

56 lines

Re: ASSY : pretinning of fine-pitch devices

[log in to unmask]

Wed, 15 Jan 1997 05:51:14 -0500

80 lines

Re: ASSY : pretinning of fine-pitch devices

ddhillma <[log in to unmask]>

Wed, 15 Jan 97 07:45:45 cst

89 lines

New Thread

ASSY: adhesive pads

ASSY: adhesive pads

D. Terstegge <[log in to unmask]>

Thu, 16 Jan 1997 20:39:16 +0100

51 lines

New Thread

ASSY: Desiccant Quantity for 15 Year Storage of VMEs

ASSY: Desiccant Quantity for 15 Year Storage of VMEs

James W Baker <[log in to unmask]>

13 Jan 1997 15:07:47 -0700

85 lines

RE: ASSY: Desiccant Quantity for 15 Year Storage of VMEs

DAVY.J.G- <[log in to unmask]>

Thu, 16 Jan 1997 17:04:37 -0500

97 lines

New Thread

ASSY: Fine Pitch Solder Joint Inspection Method?

ASSY: Fine Pitch Solder Joint Inspection Method?

[log in to unmask]

Mon, 13 Jan 97 18:51:27

90 lines

Re: ASSY: Fine Pitch Solder Joint Inspection Method?

Pat McGuine <[log in to unmask]>

Tue, 14 Jan 1997 07:28:43 -0600

142 lines

RE: ASSY: Fine Pitch Solder Joint Inspection Method?

Max Bernhardt <[log in to unmask]>

Tue, 14 Jan 1997 07:22:00 -0600

142 lines

Re: ASSY: Fine Pitch Solder Joint Inspection Method?

[log in to unmask]

Tue, 14 Jan 1997 23:00:14 -0500 (EST)

40 lines

RE: ASSY: Fine Pitch Solder Joint Inspection Method?

Max Bernhardt <[log in to unmask]>

Tue, 21 Jan 1997 08:21:00 -0600

175 lines

RE: ASSY: Fine Pitch Solder Joint Inspection Method?

Jerry Cupples <[log in to unmask]>

Tue, 21 Jan 1997 12:43:09 -0600

131 lines

New Thread

ASSY: Florida Cirtech (WS120 and WS130)

ASSY: Florida Cirtech (WS120 and WS130)

[log in to unmask]

Wed, 29 Jan 1997 14:14:07 -0600

45 lines

New Thread

ASSY: IR Reflow of Thru-Hole Components

ASSY: IR Reflow of Thru-Hole Components

Thad McMillan <[log in to unmask]>

9 Jan 97 17:11 CST

126 lines

Re: ASSY: IR Reflow of Thru-Hole Components

Pratap Singh <[log in to unmask]>

Thu, 09 Jan 1997 19:56:01 -0800

164 lines

Re: ASSY: IR Reflow of Thru-Hole Components

Bob Willis <[log in to unmask]>

10 Jan 97 10:56:31 EST

218 lines

Re: ASSY: IR Reflow of Thru-Hole Components

Chris Messner <[log in to unmask]>

10 Jan 97 09:13:29 -0500

171 lines

Re[2]: ASSY: IR Reflow of Thru-Hole Components

[log in to unmask]

Fri, 10 Jan 1997 10:27:14 -0600

231 lines

Re: ASSY: IR Reflow of Thru-Hole Components

DAVY.J.G- <[log in to unmask]>

Mon, 13 Jan 1997 10:19:54 -0500

306 lines

Re: ASSY: IR Reflow of Thru-Hole Components

Pratap Singh <[log in to unmask]>

Mon, 13 Jan 1997 20:38:50 -0800

244 lines

New Thread

ASSY: J-STD-001 vs. IPC-A-610

ASSY: J-STD-001 vs. IPC-A-610

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 10 Jan 1997 10:19:00 -0500 (EST)

65 lines

Re: ASSY: J-STD-001 vs. IPC-A-610

George Franck Jr <[log in to unmask]>

Fri, 10 Jan 1997 13:48:04 -0500

133 lines

Re[2]: ASSY: J-STD-001 vs. IPC-A-610

[log in to unmask]

Fri, 10 Jan 97 14:36:55

81 lines

New Thread

ASSY: Jumpers and cuts

ASSY: Jumpers and cuts

MTTC <[log in to unmask]>

Thu, 16 Jan 1997 09:30:35 -0800 (PST)

54 lines

RE: ASSY: Jumpers and cuts

Jan Satterfield <[log in to unmask]>

Thu, 16 Jan 97 14:36

78 lines

RE: ASSY: Jumpers and cuts

MTTC <[log in to unmask]>

Thu, 16 Jan 1997 14:33:38 -0800 (PST)

70 lines

New Thread

ASSY: Low Tin Level in Wave Solder

ASSY: Low Tin Level in Wave Solder

[log in to unmask]

Fri, 03 Jan 97 08:41:11

92 lines

Re: ASSY: Low Tin Level in Wave Solder

Jerry Cupples <[log in to unmask]>

Fri, 3 Jan 1997 15:05:33 -0600

76 lines

Re: ASSY: Low Tin Level in Wave Solder

ddhillma <[log in to unmask]>

Fri, 03 Jan 97 14:56:51 cst

134 lines

RE:ASSY: Low Tin Level in Wave Solder

DAVY.J.G- <[log in to unmask]>

Fri, 3 Jan 1997 16:37:37 -0500

99 lines

re:ASSY: Low Tin Level in Wave Solder

[log in to unmask]

Friday, 3 January 1997 5:08pm ET

130 lines

Re: ASSY: Low Tin Level in Wave Solder

rmosebar <[log in to unmask]>

Fri, 03 Jan 97 14:27:34 PST

129 lines

Re: ASSY: Low Tin Level in Wave Solder

Aric Parr <[log in to unmask]>

03 Jan 97 16:32:11 -0500

135 lines

Re: ASSY: Low Tin Level in Wave Solder

[log in to unmask]

Sat, 4 Jan 1997 14:15:00 -0500

80 lines

Re: ASSY: Low Tin Level in Wave Solder

Paul Gould <[log in to unmask]>

Sun, 5 Jan 1997 13:24:17 +0000

40 lines

Re: ASSY: Low Tin Level in Wave Solder

[log in to unmask]

Tue, 07 Jan 97 09:06:41 EST

149 lines

New Thread

ASSY: Manix Component Counter (or similar)

ASSY: Manix Component Counter (or similar)

[log in to unmask]

Fri, 24 Jan 1997 11:58:47 -0600

52 lines

ASSY: Manix Component Counter (or similar)

[log in to unmask]

Fri, 24 Jan 1997 17:07:32 -0600

66 lines

New Thread

ASSY: Manix Mfg Component Counter (or similar)

ASSY: Manix Mfg Component Counter (or similar)

[log in to unmask]

Tue, 28 Jan 1997 10:24:39 -0600

56 lines

New Thread

ASSY: Moire Interferometry

ASSY: Moire Interferometry

Randy Reed <[log in to unmask]>

Mon, 20 Jan 97 13:37:25 PST

42 lines

Re: ASSY: Moire Interferometry

Phil Yates <[log in to unmask]>

Tue, 21 Jan 1997 08:48:49 -0600

70 lines

New Thread

ASSY: MTBF for Components, relating to ESD

ASSY: MTBF for Components, relating to ESD

[log in to unmask]

Thu, 2 Jan 1997 11:18:22 -0600

56 lines

New Thread

ASSY: OSP coatings

ASSY: OSP coatings

[log in to unmask]

Mon, 13 Jan 97 18:38:29

54 lines

Re: ASSY: OSP coatings

[log in to unmask]

Mon, 13 Jan 1997 11:43:24 -0600

93 lines

RE: ASSY: OSP coatings

Ng-CSN007 Shirley <[log in to unmask]>

14 Jan 1997 08:46:58 U

108 lines

RE: ASSY: OSP coatings

Michael Barmuta <[log in to unmask]>

Tue, 14 Jan 1997 15:41:55 -0800

150 lines

Re[2]: ASSY: OSP coatings

BrianWada <[log in to unmask]>

Wed, 15 Jan 97 17:46:12 PST

172 lines

New Thread

ASSY: Pre-tinning of Gold Leads

ASSY: Pre-tinning of Gold Leads

Rajan, Sanjay <[log in to unmask]>

Tue, 14 Jan 97 14:45:00 EST

54 lines

Re: ASSY: Pre-tinning of Gold Leads

ddhillma <[log in to unmask]>

Wed, 15 Jan 97 07:23:46 cst

100 lines

RE: ASSY: Pre-tinning of Gold Leads

Max Bernhardt <[log in to unmask]>

Wed, 15 Jan 1997 07:33:00 -0600

93 lines

RE: ASSY: Pre-tinning of Gold Leads

Gary Peterson <[log in to unmask]>

Wed, 15 Jan 1997 10:41:42 -0700

56 lines

Re[2]: ASSY: Pre-tinning of Gold Leads

ddhillma <[log in to unmask]>

Wed, 15 Jan 97 11:54:39 cst

124 lines

New Thread

Assy: Press Fit

Assy: Press Fit

Yuen, Mike <[log in to unmask]>

Fri, 17 Jan 97 10:16:00 CST

40 lines

Assy: Press Fit

Gary Peterson <[log in to unmask]>

Fri, 17 Jan 1997 11:04:49 -0700

66 lines

New Thread

assy: Press In

assy: Press In

[log in to unmask]

Thu, 23 Jan 97 19:36:33 PST

46 lines

New Thread

Assy: Rigid Flex

Assy: Rigid Flex

Marshall Andrews <[log in to unmask]>

Thu, 23 Jan 1997 14:18:12 -0600

46 lines

Re: Assy: Rigid Flex

[log in to unmask]

Fri, 24 Jan 97 08:12:20 EST

76 lines

New Thread

ASSY: Solder Paste Process Control

ASSY: Solder Paste Process Control

Jack Crawford <[log in to unmask]>

Wed, 22 Jan 1997 09:00:30 -0500

56 lines

New Thread

Assy: Solder Skip

Assy: Solder Skip

Poh Kong Hui <[log in to unmask]>

Thu, 16 Jan 1997 21:01:25 +0800

49 lines

Re: Assy: Solder Skip

Aric Parr <[log in to unmask]>

16 Jan 97 11:01:28 -0500

84 lines

Re: Assy: Solder Skip

ddhillma <[log in to unmask]>

Thu, 16 Jan 97 13:13:25 cst

78 lines

New Thread

ASSY: thermocouple adhesive

ASSY: thermocouple adhesive

Foster, Donald C. <[log in to unmask]>

Thu, 09 Jan 97 12:32:00 MST

43 lines

Re: ASSY: thermocouple adhesive

[log in to unmask]

Fri, 10 Jan 1997 09:19:50 -0500

66 lines

Re: ASSY: thermocouple adhesive

Bob Willis <[log in to unmask]>

10 Jan 97 10:53:06 EST

43 lines

RE: ASSY: thermocouple adhesive

John Guy <[log in to unmask]>

Fri, 10 Jan 1997 13:48:24 -0500

72 lines

Re[2]: ASSY: thermocouple adhesive

Allen Hertz <[log in to unmask]>

Fri, 10 Jan 1997 14:17:42 -0500 (EST)

83 lines

RE: ASSY: thermocouple adhesive

Chilcote, Jim (AZ75) <[log in to unmask]>

10 Jan 1997 16:38:41 -0600

70 lines

New Thread

ASSY: TSOP with Alloy 42 lead frame field failures

RE: ASSY: TSOP with Alloy 42 lead frame field failures

[log in to unmask]

Mon, 6 Jan 1997 19:11:45 -0500

69 lines

Re: ASSY: TSOP with Alloy 42 lead frame field failures

Ulrich Korndoerfer <[log in to unmask]>

Thu, 09 Jan 1997 00:16:37 +0100

61 lines

Re: ASSY: TSOP with Alloy 42 lead frame field failures

[log in to unmask]

Wed, 8 Jan 1997 21:14:57 -0500 (EST)

83 lines

New Thread

ASSY: TSOP/PLCC reliability

Re: ASSY: TSOP/PLCC reliability

[log in to unmask]

Wed, 15 Jan 1997 13:49:42 -0500 (EST)

60 lines

New Thread

ASSY:J-STD-001 vs. IPC-A-610

Re: ASSY:J-STD-001 vs. IPC-A-610

MTTC <[log in to unmask]>

Mon, 13 Jan 1997 08:30:23 -0800 (PST)

86 lines

New Thread

ASSY:Mil-std 55110??

ASSY:Mil-std 55110??

Jeffery L. Hempton <[log in to unmask]>

Fri, 24 Jan 1997 14:22:36 -0500

52 lines

Re: ASSY:Mil-std 55110??

Douglas Sandvick <[log in to unmask]>

Fri, 24 Jan 1997 14:39:28 -0600 (CST)

81 lines

RE: ASSY:Mil-std 55110??

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 27 Jan 1997 11:28:00 -0500 (EST)

62 lines

New Thread

ASSY:solder paste qual

ASSY:solder paste qual

Jeffery L. Hempton <[log in to unmask]>

Fri, 17 Jan 1997 14:51:41 -0500

52 lines

New Thread

Assy:TopLine

Assy:TopLine

[log in to unmask]

Thu, 23 Jan 1997 11:24:19 -0600

46 lines

Re: Assy:TopLine

ddhillma <[log in to unmask]>

Thu, 23 Jan 97 12:37:24 cst

79 lines

Re: Assy:TopLine

[log in to unmask]

Thu, 23 Jan 97 14:52:38

82 lines

Re: Assy:TopLine

[log in to unmask]

Thu, 23 Jan 97 19:22:27 CST

68 lines

Re: Assy:TopLine

Alan Hilton <[log in to unmask]>

Thu, 23 Jan 1997 18:10:05 PST

57 lines

Re[2]: Assy:TopLine

Chris Messner <[log in to unmask]>

24 Jan 97 06:01:52 -0500

89 lines

Re[2]: Assy:TopLine

ddhillma <[log in to unmask]>

Fri, 24 Jan 97 05:17:12 cst

84 lines

Re: Assy:TopLine

Edward J. Valentine <[log in to unmask]>

Fri, 24 Jan 1997 08:26:48 -0800

64 lines

Re: Assy:TopLine

Tom Cooper <[log in to unmask]>

Fri, 24 Jan 97 09:16:42 EST

63 lines

New Thread

AW: Re: dielectrics for dif materials

AW: Re: dielectrics for dif materials

Huschka, Manfred <[log in to unmask]>

Fri, 24 Jan 1997 13:40:00 -0700

147 lines

New Thread

backfilling holes at press

backfilling holes at press

Marc Strickland <[log in to unmask]>

Sat, 11 Jan 1997 03:23:24 -0500

52 lines

New Thread

BGA :ASSY/REWORK

BGA :ASSY/REWORK

[log in to unmask]

Tue, 14 Jan 1997 11:07:46 -0500 (EST)

54 lines

Re: BGA :ASSY/REWORK

LWFERGUS <[log in to unmask]>

Wed, 15 Jan 97 16:12:06 CST

83 lines

BGA :ASSY/REWORK

jon johnson <[log in to unmask]>

Thu, 16 Jan 1997 15:41:17 -0500

50 lines

New Thread

BGA's machines

BGA's machines

Antoni Cherta <[log in to unmask]>

Wed, 15 Jan 1997 15:08:25 +0100

65 lines

New Thread

blanks boards

blanks boards

Mike Cussen <[log in to unmask]>

Thu, 9 Jan 97 15:23 EST

43 lines

New Thread

Breakaway holes

Breakaway holes

[log in to unmask]

Mon, 20 Jan 1997 13:30:52 -0800

60 lines

New Thread

Breakaway holes and V-groove scoring

RE: Breakaway holes and V-groove scoring

Glenn Heath <[log in to unmask]>

Mon, 20 Jan 1997 16:12:25 -0800 (PST)

61 lines

New Thread

Buried Capacitance / Resistance

Buried Capacitance / Resistance

[log in to unmask]

Mon, 27 Jan 1997 15:24:53 -0600 (CST)

40 lines

Re: Buried Capacitance / Resistance

DENNY PULVINO <[log in to unmask]>

Mon, 27 Jan 97 16:16:03 PST

63 lines

Re: Buried Capacitance / Resistance

jyoung <[log in to unmask]>

Tue, 28 Jan 97 18:06:08 PST

70 lines

New Thread

Call for Speakers in London

Call for Speakers in London

Bob Willis <[log in to unmask]>

29 Jan 97 06:18:22 EST

87 lines

New Thread

Can somebody give me some advice?

Can somebody give me some advice?

[log in to unmask]

Mon, 06 Jan 97 07:26:49

99 lines

Re: Can somebody give me some advice?

jseeger <[log in to unmask]>

Mon, 06 Jan 1997 14:18:29 -0500

72 lines

New Thread

CIMS

CIMS

cctc <[log in to unmask]>

Mon, 6 Jan 1997 13:40:22 +0800

53 lines

New Thread

Circo Flex

Circo Flex

John Gibson <[log in to unmask]>

Sat, 18 Jan 1997 12:25:09 -0800

46 lines

New Thread

cleaners for RMA flux

cleaners for RMA flux

Yakov Steinberg <[log in to unmask]>

Tue, 14 Jan 1997 10:52:21 +0200 (IST)

42 lines

RE: cleaners for RMA flux

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Tue, 14 Jan 97 10:22:47 EST

107 lines

RE: cleaners for RMA flux

Jan Satterfield <[log in to unmask]>

Tue, 14 Jan 97 8:36

69 lines

Re: cleaners for RMA flux

[log in to unmask]

Tue, 14 Jan 1997 16:00:32 -0500 (EST)

96 lines

Re: cleaners for RMA flux

Luis Rivera <[log in to unmask]>

Wed, 15 Jan 1997 08:55:35 +600 CDT

99 lines

New Thread

Compressors

Compressors

Scott C Prentice KE3UM <[log in to unmask]>

Thu, 16 Jan 1997 13:10:24 -0500

55 lines

Re: Compressors

Jerry Cupples <[log in to unmask]>

Thu, 16 Jan 1997 16:29:35 -0600

109 lines

New Thread

Conductive foam

Conductive foam

Paul Reynolds <[log in to unmask]>

Thu, 23 Jan 1997 12:05:00 -0600

49 lines

re: Conductive foam

[log in to unmask]

Thu, 23 Jan 97 14:20:41 EST

84 lines

re: Conductive foam

[log in to unmask]

Thu, 23 Jan 97 15:03:40 EST

86 lines

Re: Conductive foam

[log in to unmask]

Fri, 24 Jan 97 08:20:58 PST

66 lines

re: Conductive foam

Yuen, Mike <[log in to unmask]>

Fri, 24 Jan 97 08:59:00 CST

102 lines

New Thread

conformal coating help

conformal coating help

[log in to unmask]

Tue, 21 Jan 1997 09:39:41 -0500 (EST)

38 lines

Re: conformal coating help

Paul Stolar <[log in to unmask]>

Tue, 21 Jan 97 09:56:12 CDT

67 lines

RE: Conformal Coating Help

Karl Ring <[log in to unmask]>

Tue, 21 Jan 1997 12:11:45 -0500

45 lines

Re: conformal coating help

Lynch, Lyn <[log in to unmask]>

Tue, 21 Jan 97 10:50:54

50 lines

Re: conformal coating help

[log in to unmask]

Wed, 22 Jan 1997 07:42:39 -0500 (EST)

54 lines

Re[2]: conformal coating help

Aric Parr <[log in to unmask]>

22 Jan 97 16:37:21 -0500

89 lines

New Thread

Conformal Coating Suppli

Re: Conformal Coating Suppli

Greg Bartlett <[log in to unmask]>

31 Jan 1997 10:27:06 -0500

98 lines

New Thread

Conformal Coating Supplier

Conformal Coating Supplier

[log in to unmask]

Fri, 31 Jan 97 08:22:53 est

41 lines

New Thread

conformal coating vendor request

Re:conformal coating vendor request

[log in to unmask]

Thu, 30 Jan 1997 15:23:52 -0500 (EST)

43 lines

Re[2]: conformal coating vendor request

Aric Parr <[log in to unmask]>

31 Jan 97 08:46:41 -0500

77 lines

New Thread

Connector placement

Re: Connector placement

MR JIM R ZANOLLI <[log in to unmask]>

Fri, 24 Jan 1997 08:39:54, -0500

44 lines

Re: Connector placement

[log in to unmask]

Fri, 24 Jan 1997 17:07:52 -0500 (EST)

42 lines

New Thread

Contact pads

Re: Contact pads

David Bergman <[log in to unmask]>

Tue, 28 Jan 1997 12:55:47 -0600 (CST)

73 lines

New Thread

Controlled Impedance

Controlled Impedance

Max.P.Harris <[log in to unmask]>

Fri, 03 Jan 1997 10:11:30 -0800

51 lines

Re: Controlled Impedance

Alan Hilton <[log in to unmask]>

Fri, 3 Jan 1997 18:49:21 PST

66 lines

Re[2]: Controlled Impedance

Max Harris <[log in to unmask]>

Mon, 6 Jan 1997 08:39:57 -0500

63 lines

controlled Impedance

Kyle Gulley <[log in to unmask]>

Thu, 23 Jan 97 09:23:40 PST

50 lines

Re: controlled Impedance

Andy Burkhardt <[log in to unmask]>

Sun, 26 Jan 1997 12:39:45 GMT

82 lines

New Thread

controlled impedance p.c.b's

controlled impedance p.c.b's

Steve Sekanina <[log in to unmask]>

Mon, 6 Jan 1997 13:10:09 +0000

46 lines

Re: controlled impedance p.c.b's

jbrunett <[log in to unmask]>

Tue, 07 Jan 97 01:08:02 PST

65 lines

New Thread

convection rates

convection rates

[log in to unmask]

Thu, 30 Jan 97 08:40:29 CST

39 lines

RE: convection rates

John Guy <[log in to unmask]>

Fri, 31 Jan 1997 13:05:11 -0500

61 lines

Re: convection rates

Rex Breunsbach <[log in to unmask]>

31 Jan 1997 15:13:08 -0800

57 lines

Re: convection rates

Hollandsworth, Ron <[log in to unmask]>

Fri, 31 Jan 97 16:29:47 EST

64 lines

New Thread

Copper

RE: Copper

Karl Ring <[log in to unmask]>

Wed, 8 Jan 1997 08:05:19 -0500

48 lines

Re: Copper

[log in to unmask]

Wed, 8 Jan 1997 09:19:15 -0500 (EST)

38 lines

New Thread

Copper scopping in solder

Copper scopping in solder

tonghh <[log in to unmask]>

Fri, 31 Jan 1997 20:44:51 +0800

49 lines

New Thread

Creep Rupture testing on BGA

Creep Rupture testing on BGA

OBRIEN GERARD <[log in to unmask]>

Wed, 22 Jan 97 10:26:00 -0500

42 lines

New Thread

current carrying capacity

current carrying capacity

Dan Lorinser <[log in to unmask]>

Tue, 28 Jan 1997 09:39:48 -0600

57 lines

Re: current carrying capacity

Bill Gaines B160 x2199 <[log in to unmask]>

Wed, 29 Jan 97 15:05:27 PST

56 lines

New Thread

current in screened silver circuits

current in screened silver circuits

[log in to unmask]

Fri, 24 Jan 1997 12:37:11 -0800

45 lines

Re: current in screened silver circuits

Ralph Hersey <[log in to unmask]>

Mon, 27 Jan 1997 15:49:07 -0800

114 lines

Re: current in screened silver circuits

Don Vischulis <[log in to unmask]>

Tue, 28 Jan 1997 22:11:35 -0600

137 lines

Re: current in screened silver circuits

Ralph Hersey <[log in to unmask]>

Wed, 29 Jan 1997 10:03:17 -0800

109 lines

New Thread

defect ppm data

defect ppm data

Dominick Cizek <[log in to unmask]>

Thu, 23 Jan 1997 11:03:20 -0500

37 lines

New Thread

Depanelising Ceramic Substrate

Depanelising Ceramic Substrate

aposeiko <[log in to unmask]>

Fri, 17 Jan 1997 15:00:01 -0800

45 lines

New Thread

DES- Gerber formats?

Re: DES- Gerber formats?

Kevin Seaman <[log in to unmask]>

Fri, 10 Jan 97 08:05:05 PST

56 lines

New Thread

DES/FAB:switchpad contacts

DES/FAB:switchpad contacts

72030,3271 <[log in to unmask]>

24 Jan 97 10:35:31 EST

53 lines

Re[2]: DES/FAB:switchpad contacts

ddhillma <[log in to unmask]>

Mon, 27 Jan 97 16:50:18 cst

133 lines

New Thread

DES: Ag polmer via holes

DES: Ag polmer via holes

Lee Dunford <[log in to unmask]>

Thu, 9 Jan 1997 16:38:12 GMT

63 lines

New Thread

DES: Ag polmer via holes - contact

Re: DES: Ag polmer via holes - contact

Lee Dunford <[log in to unmask]>

Thu, 9 Jan 1997 17:21:30 GMT

71 lines

New Thread

DES: Heat Rise Calculations For Flex Part II

DES: Heat Rise Calculations For Flex Part II

Magee, Andrew P <[log in to unmask]>

Wed, 22 Jan 1997 11:27:00 -0800

80 lines

New Thread

DES: Internodal Capacitance & Inductance

DES: Internodal Capacitance & Inductance

David Anderson <[log in to unmask]>

Thu, 09 Jan 1997 16:00:30 -0600

49 lines

New Thread

DES: package style ?

Re: DES: package style ?

jseeger <[log in to unmask]>

Thu, 09 Jan 1997 12:00:08 -0500

67 lines

New Thread

Des: temp rise (current)

Des: temp rise (current)

Andrew P Magee <[log in to unmask]>

Wed, 29 Jan 1997 14:56:00 -0800

99 lines

New Thread

DES: trace layout

DES: trace layout

Bilal Khalaf <[log in to unmask]>

Mon, 13 Jan 97 13:26:00 PST

42 lines

Re: DES: trace layout

Doug McKean <[log in to unmask]>

Tue, 14 Jan 1997 09:59:21 -0500

74 lines

Re: DES: trace layout

jseeger <[log in to unmask]>

Tue, 14 Jan 1997 11:51:01 -0500

74 lines

Re: DES: trace layout

Ralph Hersey <[log in to unmask]>

Tue, 28 Jan 1997 02:13:35 -0800

264 lines

New Thread

Design issues (current carrying variables)

RE: Design issues (current carrying variables)

Mitch Morey <[log in to unmask]>

Thu, 16 Jan 1997 15:22:22 -0800

48 lines

RE: Design issues (current carrying variables)

Mitch Morey <[log in to unmask]>

Thu, 16 Jan 1997 15:22:22 -0800

48 lines

RE: Design issues (current carrying variables)

Jeff Neisess <[log in to unmask]>

Fri, 17 Jan 1997 10:43:08 GMT-0500

81 lines

New Thread

Design Standards for BGA

Design Standards for BGA

Ian Wylie <[log in to unmask]>

Tue, 14 Jan 1997 14:55:12 GMT

54 lines

Re: Design Standards for BGA

[log in to unmask]

Tue, 14 Jan 97 11:30:44 PST

126 lines

RE: Design Standards for BGA

Foster, Donald C. <[log in to unmask]>

Tue, 14 Jan 97 14:14:00 MST

49 lines

Re: Design Standards for BGA

[log in to unmask]

Thu, 16 Jan 1997 00:50:09 -0500 (EST)

62 lines

Re: Design Standards for BGA

David Bergman <[log in to unmask]>

Thu, 16 Jan 1997 12:02:51 -0600 (CST)

89 lines

RE: Design Standards for BGA

Ng-CSN007 Shirley <[log in to unmask]>

17 Jan 1997 18:58:46 U

145 lines

New Thread

Dielectric Constant of FR-4 and Getek

Re: Dielectric Constant of FR-4 and Getek

[log in to unmask]

Thu, 23 Jan 97 11:36:21 PST

46 lines

New Thread

dielectrics for dif materials

dielectrics for dif materials

Armando Saldana <[log in to unmask]>

Wed, 22 Jan 1997 14:37:05 +0000

61 lines

Re: dielectrics for dif materials

No Name <[log in to unmask]>

Wed, 22 Jan 1997 20:43:27 -0600 (CST)

82 lines

Re: dielectrics for dif materials

Andrew P Magee <[log in to unmask]>

Thu, 23 Jan 1997 07:41:00 -0800

124 lines

New Thread

Direct metallization

Re: Direct metallization

Motoyo Wajima <[log in to unmask]>

Tue, 07 Jan 1997 12:36:10 +0900

77 lines

New Thread

Direct metallization for MIL grade PCBs.

Direct metallization for MIL grade PCBs.

[log in to unmask]

15 Jan 97 20:52 GMT+0500

47 lines

Re: Direct metallization for MIL grade PCBs.

ddsulliv <[log in to unmask]>

Wed, 15 Jan 97 15:26:11 cst

160 lines

New Thread

direct plating

direct plating

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 16 Jan 1997 13:13:24 +0200 (IST)

49 lines

New Thread

Dispenser for solder preforms

Dispenser for solder preforms

Dominick Cizek <[log in to unmask]>

Thu, 23 Jan 1997 10:47:23 -0500

36 lines

New Thread

DOC:IEC Component value code

DOC:IEC Component value code

[log in to unmask]

Wed, 22 Jan 1997 13:31:59 -0500 (EST)

42 lines

Re: DOC:IEC Component value code

[log in to unmask]

Wed, 22 Jan 97 20:38:20

185 lines

Re: DOC:IEC Component value code

Max Bernhardt <[log in to unmask]>

Thu, 23 Jan 1997 08:58:00 -0600

311 lines

Re: DOC:IEC Component value code

Max Bernhardt <[log in to unmask]>

Fri, 24 Jan 1997 07:37:00 -0600

338 lines

Re: DOC:IEC Component value code

Jack Ray <[log in to unmask]>

Fri, 24 Jan 1997 20:27:06 -0500

51 lines

Re: DOC:IEC Component value code

Max Bernhardt <[log in to unmask]>

Mon, 27 Jan 1997 06:30:00 -0600

77 lines

New Thread

Drill Spindle Runout

Drill Spindle Runout

William Johnson <[log in to unmask]>

Thu, 16 Jan 97 22:19:53 UT

38 lines

DRILL SPINDLE RUNOUT

[log in to unmask]

Fri, 17 Jan 1997 05:09:49 EST

59 lines

New Thread

Dry Film Solder Mask

Dry Film Solder Mask

[log in to unmask]

Mon, 13 Jan 97 10:04:05 EST

44 lines

Re: Dry Film Solder Mask

[log in to unmask]

Tue, 14 Jan 1997 00:45:48 -0500 (EST)

70 lines

New Thread

Dry Film Soldermask

RE: Dry Film Soldermask

[log in to unmask]

Mon, 13 Jan 97 14:15:31 EST

41 lines

Re[2]: Dry Film Soldermask

sbryan <[log in to unmask]>

Mon, 13 Jan 97 17:11:43 PST

65 lines

New Thread

dynamic spindle runout

dynamic spindle runout

William Johnson <[log in to unmask]>

Wed, 22 Jan 97 20:40:48 UT

37 lines

New Thread

E-Mail addresses

E-Mail addresses

[log in to unmask]

Tue, 21 Jan 97 18:57:53 +0100

45 lines

Re: E-Mail addresses

Lynch, Lyn <[log in to unmask]>

Tue, 21 Jan 97 14:06:28

66 lines

Re: E-Mail addresses

[log in to unmask]

Tue, 21 Jan 97 16:30:44

68 lines

Re: E-Mail addresses

Kerry Grimes <[log in to unmask]>

Tue, 21 Jan 1997 18:32:03 -0800

115 lines

Re: E-Mail addresses

David Bergman <[log in to unmask]>

Wed, 22 Jan 1997 10:20:15 -0600 (CST)

128 lines

Re[2]: E-Mail addresses

[log in to unmask]

Wed, 22 Jan 97 09:47:31

104 lines

New Thread

Edmund Scientific Catalog

Edmund Scientific Catalog

Chris Stack <[log in to unmask]>

Mon, 20 Jan 1997 09:55:00 -0500

76 lines

Re: Edmund Scientific Catalog

Chris Stack <[log in to unmask]>

Mon, 20 Jan 1997 13:28:40 -0500

94 lines

New Thread

Effects of temp on growth rate of tin oxide and Cu-Sn IM

Re: Effects of temp on growth rate of tin oxide and Cu-Sn IM

ddhillma <[log in to unmask]>

Fri, 17 Jan 97 18:00:02 cst

169 lines

New Thread

Effects of temp on growth rate of tin oxide and Cu-Sn IMC

Effects of temp on growth rate of tin oxide and Cu-Sn IMC

DAVY.J.G- <[log in to unmask]>

Fri, 17 Jan 1997 17:00:01 -0500

124 lines

New Thread

Employment

Employment

[log in to unmask]

Sat, 1 Feb 1997 11:39:21 -0500 (EST)

47 lines

New Thread

Entek Plus Cu-106A

Entek Plus Cu-106A

cjlong <[log in to unmask]>

Fri, 10 Jan 1997 15:13:41 +0800

53 lines

Re: Entek Plus Cu-106A

[log in to unmask]

Fri, 10 Jan 97 08:29:31 MDT

99 lines

Re: Entek Plus Cu-106A

[log in to unmask]

Fri, 10 Jan 97 09:21:57

143 lines

New Thread

epoxy screening 0603's

epoxy screening 0603's

MIKE J. LOPEZ <[log in to unmask]>

Mon, 06 Jan 1997 16:32:25 -0500

37 lines

Re: epoxy screening 0603's

[log in to unmask]

Mon, 06 Jan 97 16:47:25

103 lines

New Thread

epoxy vs. solder paste

epoxy vs. solder paste

Seth Tompkins <[log in to unmask]>

Mon, 06 Jan 1997 10:15:15 -0800

55 lines

Re:epoxy vs. solder paste

Guenter Grossmann <[log in to unmask]>

Tue, 7 Jan 1997 11:07:39 +0100

95 lines

New Thread

Exposed circuits

Exposed circuits

Todd Rogers <[log in to unmask]>

Thu, 2 Jan 1997 16:36:22 -0600

50 lines

Re: Exposed circuits

Paul Gould <[log in to unmask]>

Fri, 3 Jan 1997 09:34:34 +0000

64 lines

re: Exposed circuits

James Kenny <[log in to unmask]>

Fri, 3 Jan 97 6:38:46 PST

86 lines

Re: Exposed circuits

Michael Barmuta <[log in to unmask]>

Fri, 3 Jan 1997 08:55:45 -0800

95 lines

New Thread

Exposed circuits -Reply

Exposed circuits -Reply

Bob Poirier <[log in to unmask]>

Fri, 03 Jan 1997 08:15:01 -0800

70 lines

New Thread

Fab

Fab

Otto Jespersen <[log in to unmask]>

Tue, 14 Jan 1997 07:53:06 -0500

46 lines

FAB

Ron Oneal <[log in to unmask]>

Thu, 16 Jan 1997 16:22:58 -0500

51 lines

Re: FAB

John Laur <[log in to unmask]>

Fri, 17 Jan 1997 07:24:49 -0600

92 lines

RE: FAB

Gagnon, Gerry <[log in to unmask]>

Fri, 17 Jan 1997 09:36:24 -0500

72 lines

re: Fab

[log in to unmask]

Sun, 26 Jan 1997 21:57:06 -0500 (EST)

60 lines

FAB

Hemstad, Jon (MN51) <[log in to unmask]>

27 Jan 1997 10:22:37 -0600

57 lines

New Thread

FAB - Defective units on panelized PWBs

FAB - Defective units on panelized PWBs

[log in to unmask]

29 Jan 97 13:41:10 -0500

57 lines

Re: FAB - Defective units on panelized PWBs

Neil Maloney <[log in to unmask]>

Thu, 30 Jan 1997 07:45:32 -0600 (CST)

96 lines

Re: FAB - Defective units on panelized PWBs

Don Vischulis <[log in to unmask]>

Thu, 30 Jan 1997 20:47:50 -0600

92 lines

New Thread

FAB - Matte masks

Re: FAB - Matte masks

[log in to unmask]

Tue, 28 Jan 1997 13:41:14 -0500 (EST)

38 lines

New Thread

FAB -Reply

FAB -Reply

Dan Lorinser <[log in to unmask]>

Fri, 17 Jan 1997 10:37:59 -0600

67 lines

FAB -Reply

Bob Metcalf <[log in to unmask]>

Mon, 27 Jan 1997 17:35:46 -0800

66 lines

New Thread

FAB Clear LPI

FAB Clear LPI

Bob Metcalf <[log in to unmask]>

Sat, 25 Jan 1997 10:22:24 -0800

47 lines

New Thread

fab SM questions

Re: fab SM questions

Jerry Cupples <[log in to unmask]>

Sat, 18 Jan 1997 13:24:31 -0600

126 lines

Re: fab SM questions

[log in to unmask]

Thu, 23 Jan 1997 23:34:28 -0500 (EST)

44 lines

New Thread

FAB-Dish downs in copper circuits

FAB-Dish downs in copper circuits

[log in to unmask]

Mon, 27 Jan 1997 10:24:07 -0500

57 lines

Re: FAB-Dish downs in copper circuits

[log in to unmask]

Mon, 27 Jan 97 12:24:35 PST8

92 lines

RE: FAB-Dish downs in copper circuits

Murray, George @ GSC <[log in to unmask]>

Mon, 27 Jan 97 17:51:00 PST

89 lines

Re[3]: FAB-Dish downs in copper circuits

ddsulliv <[log in to unmask]>

Tue, 28 Jan 97 12:00:10 cst

102 lines

New Thread

FAB:

FAB:

David Bergman <[log in to unmask]>

Thu, 23 Jan 1997 15:53:04 -0600 (CST)

65 lines

FAB:

Ian Wylie <[log in to unmask]>

Fri, 24 Jan 1997 08:29:28 GMT

85 lines

Re: FAB:

Eltek Ltd. - Process Engineering <[log in to unmask]>

Tue, 28 Jan 1997 06:45:37 +0200 (IST)

90 lines

New Thread

FAB: Carbon Ink vs. Gold Contact Fingers

FAB: Carbon Ink vs. Gold Contact Fingers

[log in to unmask]

Tue, 28 Jan 97 12:51:56 -0800

57 lines

Re: FAB: Carbon Ink vs. Gold Contact Fingers

[log in to unmask]

Wed, 29 Jan 1997 11:35:47 -0500 (EST)

41 lines

New Thread

FAB: Ceramic Alternative

FAB: Ceramic Alternative

John Parsons <[log in to unmask]>

Mon, 13 Jan 1997 10:22:52 -0800

59 lines

New Thread

FAB: Clean before solder mask

FAB: Clean before solder mask

Nashua Circuits <[log in to unmask]>

Tue, 07 Jan 1997 09:00:01 -0500

51 lines

Re: FAB: Clean before solder mask

John E Nelson <[log in to unmask]>

Tue, 7 Jan 1997 21:09:33 PST

51 lines

New Thread

FAB: Clear LPISM

FAB: Clear LPISM

John Gordon <[log in to unmask]>

Thu, 23 Jan 1997 11:31:02 -0800

48 lines

Re: FAB: Clear LPISM

sbryan <[log in to unmask]>

Fri, 24 Jan 97 05:47:08 PST

75 lines

New Thread

FAB: Core Filling

Re: FAB: Core Filling

Doug Jeffery <[log in to unmask]>

Fri, 24 Jan 1997 03:20:45 -0800

184 lines

New Thread

FAB: CU/Invar/Cu suppliers

FAB: CU/Invar/Cu suppliers

George Franck Jr <[log in to unmask]>

Tue, 21 Jan 1997 11:37:41 -0500

71 lines

New Thread

FAB: CU/Invar/Cu suppliers -Reply

FAB: CU/Invar/Cu suppliers -Reply

Dan Lorinser <[log in to unmask]>

Tue, 21 Jan 1997 12:42:32 -0600

91 lines

Re: FAB: CU/Invar/Cu suppliers -Reply

[log in to unmask]

Tue, 21 Jan 1997 21:39:07 -0500 (EST)

36 lines

New Thread

FAB: Cupric chloride regeneration with sodium chlorate

FAB: Cupric chloride regeneration with sodium chlorate

Ted Stern <"[log in to unmask]"@[log in to unmask]>

Wed, 22 Jan 1997 12:07:21 -0800

56 lines

RE: FAB: Cupric chloride regeneration with sodium chlorate

Edwards, Ted A (AZ75) <[log in to unmask]>

28 Jan 1997 17:18:38 -0600

123 lines

New Thread

FAB: Deburr

FAB: Deburr

[log in to unmask]

Mon, 27 Jan 1997 10:49:29 -0600

44 lines

New Thread

Fab: Drill Entry Questions

Fab: Drill Entry Questions

[log in to unmask]

Wed, 15 Jan 1997 13:25:00 -0500 (EST)

71 lines

New Thread

FAB: Electrolytic plating propogation rate testers

FAB: Electrolytic plating propogation rate testers

dhoppe <[log in to unmask]>

Tue, 14 Jan 97 09:49:52 PST

33 lines

Re: FAB: Electrolytic plating propogation rate testers

[log in to unmask]

Tue, 14 Jan 1997 23:57:23 -0500 (EST)

98 lines

New Thread

FAB: Embedded High Density

FAB: Embedded High Density

[log in to unmask]

Sun, 5 Jan 1997 11:06:40 -0500

65 lines

New Thread

FAB: exposed copper?

FAB: exposed copper?

Dave Pizzoferrato <[log in to unmask]>

Tue, 28 Jan 1997 08:10:49 -0700

71 lines

New Thread

Fab: Extended Material Cure Cycles

Fab: Extended Material Cure Cycles

D. Van Iderstine - Engineering Mgr. <[log in to unmask]>

Thu, 2 Jan 1997 08:21:08 -0800

59 lines

Re: Fab: Extended Material Cure Cycles

D. Rooke <[log in to unmask]>

Thu, 2 Jan 1997 13:03:38 -0500 (EST)

79 lines

New Thread

Fab: Finish LPI thickness on circuits

Fab: Finish LPI thickness on circuits

sam mccorkel <[log in to unmask]>

Fri, 17 Jan 1997 15:25:01 -0500

41 lines

Re: Fab: Finish LPI thickness on circuits

[log in to unmask]

Fri, 17 Jan 1997 17:18:10 -0500 (EST)

33 lines

Re: Fab: Finish LPI thickness on circuits

sbryan <[log in to unmask]>

Fri, 17 Jan 97 15:37:04 PST

58 lines

Re: Fab: Finish LPI thickness on circuits

[log in to unmask]

Sat, 18 Jan 1997 09:02:38 -0500 (EST)

40 lines

Re: Fab: Finish LPI thickness on circuits

Timothy Gaylor <[log in to unmask]>

Sat, 18 Jan 1997 11:05:47 -0500

76 lines

Re: Fab: Finish LPI thickness on circuits

[log in to unmask]

Sat, 18 Jan 1997 17:16:07 -0500 (EST)

53 lines

Re: Fab: Finish LPI thickness on circuits

[log in to unmask]

Fri, 24 Jan 1997 00:24:20 -0500 (EST)

84 lines

New Thread

FAB: Hole filling

FAB: Hole filling

Paul Gould <[log in to unmask]>

Fri, 24 Jan 1997 17:10:38 +0000

90 lines

New Thread

FAB: Horizontal versus vertical etching

FAB: Horizontal versus vertical etching

Luis Rivera <[log in to unmask]>

Tue, 28 Jan 1997 14:51:13 +600 CDT

60 lines

Re: FAB: Horizontal versus vertical etching

gwilling <[log in to unmask]>

Wed, 29 Jan 97 09:20:45 PST

100 lines

Re[2]: FAB: Horizontal versus vertical etching

ddsulliv <[log in to unmask]>

Wed, 29 Jan 97 18:01:26 cst

178 lines

Re: FAB: Horizontal versus vertical etching

gwilling <[log in to unmask]>

Wed, 29 Jan 97 16:51:19 PST

101 lines

Re: FAB: Horizontal versus vertical etching

George Franck Jr <[log in to unmask]>

Wed, 29 Jan 1997 12:34:07 -0500

67 lines

New Thread

FAB: Immersion tin coating

Re: FAB: Immersion tin coating

DAVY.J.G- <[log in to unmask]>

Thu, 16 Jan 1997 14:58:19 -0500

63 lines

New Thread

fab: immersion tin coatings

fab: immersion tin coatings

sam mccorkel <[log in to unmask]>

Thu, 16 Jan 1997 09:30:24 -0500

43 lines

Re: fab: immersion tin coatings

Pratap Singh <[log in to unmask]>

Thu, 16 Jan 1997 11:35:02 -0800

69 lines

Re: fab: immersion tin coatings

Jim Reed <[log in to unmask]>

Thu, 16 Jan 1997 16:46:40 -0800

116 lines

Re: fab: immersion tin coatings

[log in to unmask]

Thu, 16 Jan 1997 19:42:19 -0500 (EST)

45 lines

Re: fab: immersion tin coatings

Yisrael Leshman <[log in to unmask]>

Mon, 20 Jan 1997 12:01:02 -0800

58 lines

New Thread

FAB: IPC Printed Circuits Expo

FAB: IPC Printed Circuits Expo

Mike Buetow <[log in to unmask]>

Tue, 14 Jan 1997 09:18:59 -0600 (CST)

70 lines

Re: FAB: IPC Printed Circuits Expo

[log in to unmask]

Mon, 20 Jan 1997 07:59:36 -0500 (EST)

36 lines

Re: FAB: IPC Printed Circuits Expo

George Franck Jr <[log in to unmask]>

Mon, 20 Jan 1997 10:09:16 -0500

83 lines

Re[2]: FAB: IPC Printed Circuits Expo

[log in to unmask]

Mon, 20 Jan 1997 11:43:10 -0500

101 lines

New Thread

FAB: Panelization Software

FAB: Panelization Software

John Parsons <[log in to unmask]>

Fri, 10 Jan 1997 14:18:29 -0800

54 lines

New Thread

FAB: Plating distribution/ATE/AOI

FAB: Plating distribution/ATE/AOI

Paul Gould <[log in to unmask]>

Mon, 6 Jan 1997 20:24:33 +0000

95 lines

New Thread

FAB: prepreg fill

Re: FAB: prepreg fill

George Franck Jr <[log in to unmask]>

Fri, 24 Jan 1997 08:52:05 -0500

145 lines

New Thread

FAB: Rick Taormino; diazo film and LPI solder mask

FAB: Rick Taormino; diazo film and LPI solder mask

[log in to unmask]

Thu, 9 Jan 1997 18:33:04 -0500 (EST)

62 lines

New Thread

FAB: Supplier: Job Opportunities Posting

FAB: Supplier: Job Opportunities Posting

[log in to unmask]

Wed, 22 Jan 1997 18:36:08 -0500 (EST)

73 lines

New Thread

Fab: To Equipment Mfr's & Field Serv Org's

Fab: To Equipment Mfr's & Field Serv Org's

[log in to unmask]

Mon, 13 Jan 1997 11:28:17 -0500 (EST)

46 lines

New Thread

FAB: Woven Kevlar

FAB: Woven Kevlar

Bob McGarry <[log in to unmask]>

Fri, 3 Jan 1997 11:26:53 +0000

41 lines

New Thread

FAB:ASS: Solder Balling Resist Trials

FAB:ASS: Solder Balling Resist Trials

Bob Willis <[log in to unmask]>

08 Jan 97 13:27:11 EST

96 lines

New Thread

FAB:ASS: Solder Finish Symposium, UK

FAB:ASS: Solder Finish Symposium, UK

Bob Willis <[log in to unmask]>

08 Jan 97 13:27:17 EST

87 lines

New Thread

FAB:ASSY: Solder ball free solder resist ??

FAB:ASSY: Solder ball free solder resist ??

Bob Willis <[log in to unmask]>

02 Jan 97 03:23:05 EST

63 lines

New Thread

FAB:Cedal ADDARA PRESS LAMINATOR

FAB:Cedal ADDARA PRESS LAMINATOR

chuan <[log in to unmask]>

Sat, 11 Jan 1997 16:56:07 +0800

46 lines

Re: FAB:Cedal ADDARA PRESS LAMINATOR

Roland Jaquet <[log in to unmask]>

Sat, 11 Jan 1997 14:41:26 +0100

71 lines

New Thread

FAB:cross grain construction

FAB:cross grain construction

Bob McGarry <[log in to unmask]>

Mon, 20 Jan 1997 16:27:05 +0000

61 lines

Re: FAB:cross grain construction

Robert Welch <[log in to unmask]>

Tue, 21 Jan 1997 18:11:32 +0000

83 lines

Re: FAB:cross grain construction

Tom Ingham <[log in to unmask]>

Tue, 21 Jan 1997 17:25:17 -0700

138 lines

Re: FAB:cross grain construction

Paul Gould <[log in to unmask]>

Tue, 21 Jan 1997 18:13:50 +0000

78 lines

New Thread

FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING

Re: FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING

Thor-Inge Næsset <[log in to unmask]>

Wed, 1 Jan 1997 04:16:51 +0100

128 lines

New Thread

FAB:Roller swelling

FAB:Roller swelling

DAVID MANDER <[log in to unmask]>

Wed, 8 Jan 1997 15:10:52, -0500

45 lines

Re: FAB:Roller swelling

ddsulliv <[log in to unmask]>

Wed, 08 Jan 97 17:44:56 cst

104 lines

Re: FAB:Roller swelling

[log in to unmask]

Fri, 10 Jan 1997 00:43:57 -0500 (EST)

34 lines

New Thread

Fabrication

Fabrication

[log in to unmask]

Thu, 16 Jan 97 19:11:09 EST

50 lines

New Thread

Fabrication of Large Printed Circuit Boards

RE: Fabrication of Large Printed Circuit Boards

Bert Ohlig <[log in to unmask]>

Fri, 31 Jan 97 11:18:55 UT

58 lines

RE: Fabrication of Large Printed Circuit Boards

[log in to unmask]

Fri, 31 Jan 97 09:10:55 EST

68 lines

Re: Fabrication of Large Printed Circuit Boards

[log in to unmask]

Fri, 31 Jan 1997 15:33:02 -0500 (EST)

39 lines

New Thread

Fabrication of Printed Circuit Boards

Fabrication of Printed Circuit Boards

[log in to unmask]

Wed, 29 Jan 1997 18:40:04 GMT

47 lines

Re: Fabrication of Printed Circuit Boards

[log in to unmask]

Thu, 30 Jan 97 08:50:36 EST

72 lines

Re: Fabrication of Printed Circuit Boards

ddsulliv <[log in to unmask]>

Thu, 30 Jan 97 08:07:54 cst

103 lines

Fabrication of Printed Circuit Boards

[log in to unmask]

Thu, 30 Jan 1997 11:17:32 EST

115 lines

RE: Fabrication of Printed Circuit Boards

Thomas, Kevin <[log in to unmask]>

Thu, 30 Jan 1997 10:28:00 -0700

71 lines

New Thread

fiducial recognition problems

fiducial recognition problems

[log in to unmask]

23 JAN 97 17:05:10 EST

48 lines

Re: fiducial recognition problems

Paul Gould <[log in to unmask]>

Fri, 24 Jan 1997 21:55:27 +0000

80 lines

RE: fiducial recognition problems

Jack Crawford <[log in to unmask]>

Mon, 27 Jan 1997 10:50:33 -0500

115 lines

New Thread

Filling clearance holes in thick metal innerlayer planes

Filling clearance holes in thick metal innerlayer planes

Gagnon, Gerry <[log in to unmask]>

Fri, 24 Jan 1997 09:51:23 -0500

130 lines

New Thread

final cleaning of pwb's

final cleaning of pwb's

Matt Leary <[log in to unmask]>

Fri, 24 Jan 97 12:41:40 -0800

38 lines

New Thread

Flex

Flex

Timothy Gaylor <[log in to unmask]>

Thu, 2 Jan 1997 23:16:54 -0500

51 lines

Re: Flex

[log in to unmask]

Fri, 03 Jan 97 09:12:52 EST

114 lines

New Thread

flexible circuit

Re: flexible circuit

John Lopez <[log in to unmask]>

Mon, 6 Jan 1997 14:09:41 -0500

54 lines

New Thread

Flexible Soldermask

Flexible Soldermask

[log in to unmask]

Fri, 10 Jan 1997 08:13:47 -0500 (EST)

39 lines

Re: Flexible Soldermask

[log in to unmask]

Fri, 10 Jan 1997 18:16:38 -0500 (EST)

48 lines

New Thread

Floating waste water treatment sludge

Floating waste water treatment sludge

[log in to unmask]

Mon, 6 Jan 1997 20:19:30 -0500

48 lines

Re: Floating waste water treatment sludge

[log in to unmask]

Mon, 6 Jan 1997 22:30:51 -0500

71 lines

Re: Floating waste water treatment sludge

Bob Mesick <[log in to unmask]>

Tue, 7 Jan 1997 07:52:28 -0800 (PST)

55 lines

Re: Floating waste water treatment sludge

Paul Gould <[log in to unmask]>

Tue, 7 Jan 1997 21:25:54 +0000

82 lines

Re: Floating waste water treatment sludge

David Creager <[log in to unmask]>

Wed, 8 Jan 1997 07:09:00 -0600

125 lines

Re: Floating waste water treatment sludge

[log in to unmask]

Wed, 8 Jan 1997 16:13:54 -0500 (EST)

95 lines

Re[2]: Floating waste water treatment sludge

ddsulliv <[log in to unmask]>

Wed, 08 Jan 97 17:30:51 cst

174 lines

New Thread

Flying Probe Testers, Another voice heard!

Flying Probe Testers, Another voice heard!

Stephen <[log in to unmask]>

Fri, 10 Jan 1997 10:51:38 -0800

89 lines

New Thread

FOOTPRINT PQFP208

FOOTPRINT PQFP208

Karren Olson <[log in to unmask]>

Thu, 23 Jan 1997 13:32:46 -0800

51 lines

Re: FOOTPRINT PQFP208

Chris Messner <[log in to unmask]>

24 Jan 97 06:13:39 -0500

92 lines

New Thread

FR4 moisture absorption rate

FR4 moisture absorption rate

[log in to unmask]

Fri, 17 Jan 97 11:51:24 MDT

37 lines

New Thread

FR4 processing and properties

FR4 processing and properties

ILA <[log in to unmask]>

Fri, 10 Jan 1997 09:25:51 +0500

55 lines

New Thread

Freezing electroless tin: oxide, IMC, whiskers, and pest

Re: Freezing electroless tin: oxide, IMC, whiskers, and pest

ddhillma <[log in to unmask]>

Mon, 20 Jan 97 20:39:34 cst

197 lines

Freezing electroless tin: oxide, IMC, whiskers, and pest

DAVY.J.G- <[log in to unmask]>

Mon, 20 Jan 1997 17:06:41 -0500

130 lines

New Thread

Fuji Tape leaf covers

Fuji Tape leaf covers

Paul Stolar <[log in to unmask]>

Wed, 15 Jan 97 16:33:20 CDT

36 lines

New Thread

FW: 55110E

FW: 55110E

Baker,Kelly <[log in to unmask]>

Mon, 27 Jan 1997 08:00:34 -0500

73 lines

FW: 55110E

Baker,Kelly <[log in to unmask]>

Mon, 27 Jan 1997 08:33:34 -0500

82 lines

FW: 55110E

Baker,Kelly <[log in to unmask]>

Mon, 27 Jan 1997 09:29:00 -0500

73 lines

New Thread

FW: ASSY: IR Reflow of Thru-Hole Components

FW: ASSY: IR Reflow of Thru-Hole Components

Dill, Norm J <[log in to unmask]>

Tue, 14 Jan 97 15:34:00 EST

144 lines

New Thread

FW: FAB - Defective units on panelized PWBs

FW: FAB - Defective units on panelized PWBs

Dill, Norm J <[log in to unmask]>

Thu, 30 Jan 97 12:01:00 EST

80 lines

New Thread

FW: Fabrication of Printed Circuit Boards

FW: Fabrication of Printed Circuit Boards

Gagnon, Gerry <[log in to unmask]>

Thu, 30 Jan 1997 09:40:00 -0500

83 lines

New Thread

FW: FW: lab facilities for SEM testing

FW: FW: lab facilities for SEM testing

Gagnon, Gerry <[log in to unmask]>

Fri, 24 Jan 1997 13:22:05 -0500

61 lines

New Thread

FW: GEN: ISO and Calibration

FW: GEN: ISO and Calibration

Dill, Norm J <[log in to unmask]>

Wed, 22 Jan 97 19:26:00 EST

103 lines

New Thread

FW: Gold as Etch Resist

FW: Gold as Etch Resist

Gagnon, Gerry <[log in to unmask]>

Thu, 30 Jan 1997 09:36:59 -0500

145 lines

New Thread

FW: ISO and calibration

FW: ISO and calibration

Ed Cosper <[log in to unmask]>

Tue, 28 Jan 1997 17:09:03 -0600

75 lines

New Thread

FW: Manufacturing Engineer Seeking Employment.

FW: Manufacturing Engineer Seeking Employment.

Baker,Kelly <[log in to unmask]>

Sat, 1 Feb 1997 09:24:49 -0500

39 lines

New Thread

FW: ORC EXPOSURE MACHINE

FW: ORC EXPOSURE MACHINE

Edwards, Ted A (AZ75) <[log in to unmask]>

28 Jan 1997 15:30:59 -0600

96 lines

New Thread

FW: Panelization Software (fwd)

FW: Panelization Software (fwd)

Hernan Jaramillo <[log in to unmask]>

Wed, 22 Jan 1997 16:04:00

115 lines

New Thread

Fw: Who is Tom Bresnan? Son of Victor Johansen, perhaps?

Fw: Who is Tom Bresnan? Son of Victor Johansen, perhaps?

Matt Mahlau <[log in to unmask]>

Thu, 16 Jan 1997 05:18:24 -0500

97 lines

New Thread

Fwd: GEN: Condor Nonsense

Fwd: GEN: Condor Nonsense

[log in to unmask]

Sun, 5 Jan 1997 09:42:58 -0500

99 lines

New Thread

Fwd: Re: Who is Tom Bresnan?

Fwd: Re: Who is Tom Bresnan?

[log in to unmask]

Thu, 16 Jan 1997 18:17:15 -0500

117 lines

New Thread

GEN- ISO and Calibration

Re: GEN- ISO and Calibration

Greg Bartlett <[log in to unmask]>

22 Jan 1997 16:55:15 -0500

102 lines

New Thread

GEN: Book Review

GEN: Book Review

Yuen, Mike <[log in to unmask]>

Wed, 15 Jan 97 15:22:00 CST

41 lines

Re: GEN: Book Review

Bob Willis <[log in to unmask]>

16 Jan 97 13:36:58 EST

44 lines

New Thread

GEN: Book Review for Flex

Re: GEN: Book Review for Flex

[log in to unmask]

Thu, 16 Jan 1997 17:38:44 -0500 (EST)

40 lines

New Thread

GEN: CMI After Etch

GEN: CMI After Etch

[log in to unmask]

Wed, 1 Jan 1997 22:48:01 -0500

71 lines

New Thread

GEN: Condor Nonsense

GEN: Condor Nonsense

[log in to unmask]

Sat, 4 Jan 1997 09:24:20 -0500

66 lines

GEN: Condor Nonsense

[log in to unmask]

Sat, 04 Jan 97 22:00:45 EST

36 lines

New Thread

GEN: Condor Nonsense -Reply

GEN: Condor Nonsense -Reply

Dan Lorinser <[log in to unmask]>

Mon, 06 Jan 1997 06:51:46 -0600

54 lines

New Thread

GEN: Electrowinning Units

Re: GEN: Electrowinning Units

George Franck Jr <[log in to unmask]>

Thu, 2 Jan 1997 08:35:53 -0500

101 lines

Re: GEN: Electrowinning Units

Edwards, Ted A (AZ75) <[log in to unmask]>

02 Jan 1997 09:00:41 -0600

113 lines

New Thread

GEN: Electrowinning Units (Long)

Re: GEN: Electrowinning Units (Long)

Bob Mesick <[log in to unmask]>

Thu, 2 Jan 1997 17:02:33 -0800 (PST)

129 lines

New Thread

GEN: ISO and Calibration

GEN: ISO and Calibration

David Pizzoferrato <[log in to unmask]>

Wed, 22 Jan 1997 08:21:46 -0700

70 lines

Re: GEN: ISO and Calibration

Luis Rivera <[log in to unmask]>

Wed, 22 Jan 1997 13:25:41 +600 CDT

119 lines

Re: GEN: ISO and Calibration

Steve Mikell <[log in to unmask]>

Thu, 23 Jan 1997 00:18:30 -0600 (CST)

102 lines

Re: GEN: ISO and Calibration

Doug McKean <[log in to unmask]>

Mon, 27 Jan 1997 09:57:09 -0500

112 lines

Re[2]: GEN: ISO and Calibration

George Kotecki <[log in to unmask]>

Mon, 27 Jan 97 13:04:37 CST

160 lines

New Thread

GEN: Lead Coplanarity Spec??

GEN: Lead Coplanarity Spec??

Rajan, Sanjay <[log in to unmask]>

Wed, 22 Jan 97 10:53:00 EST

56 lines

Re: GEN: Lead Coplanarity Spec??

Bilal Khalaf <[log in to unmask]>

Wed, 22 Jan 97 14:29:00 PST

123 lines

Re: GEN: Lead Coplanarity Spec??

[log in to unmask]

Wed, 22 Jan 97 17:38:20

74 lines

Re[2]: GEN: Lead Coplanarity Spec??

mrosenfi <[log in to unmask]>

Thu, 23 Jan 1997 12:27:34 -0500

99 lines

Re: GEN: Lead Coplanarity Spec??

mrosenfi <[log in to unmask]>

Thu, 23 Jan 1997 12:35:31 -0500

88 lines

New Thread

Gen: Looking for Bachi Inc. and Meteor Inc.

Gen: Looking for Bachi Inc. and Meteor Inc.

Poh Kong Hui <[log in to unmask]>

Tue, 28 Jan 1997 22:01:07 +0800 (SST)

57 lines

Re: Gen: Looking for Bachi Inc. and Meteor Inc.

[log in to unmask]

Tue, 28 Jan 1997 11:55:14 -0600

82 lines

New Thread

Gen: Obsoleted Military Documents

Gen: Obsoleted Military Documents

[log in to unmask]

Wed, 22 Jan 97 8:22:41 PST

54 lines

New Thread

GEN: PWB Contract Manufacturers

GEN: PWB Contract Manufacturers

[log in to unmask]

Mon, 6 Jan 1997 14:25:44 -0600

49 lines

New Thread

GEN: Shelf life for components...

GEN: Shelf life for components...

Gopalakrishna Bhat - Mfg. Engineering , Digital India <[log in to unmask]>

Wed, 15 Jan 97 22:58:57 EST

45 lines

Re: GEN: Shelf life for components...

[log in to unmask]

Thu, 16 Jan 1997 08:34:57 -0600

78 lines

RE: GEN: Shelf life for components...

DAVY.J.G- <[log in to unmask]>

Thu, 16 Jan 1997 18:09:35 -0500

115 lines

Re[2]: GEN: Shelf life for components...

ddhillma <[log in to unmask]>

Fri, 17 Jan 97 10:26:44 cst

170 lines

New Thread

GEN: Vision Engineering; Just gotta vent

GEN: Vision Engineering; Just gotta vent

[log in to unmask]

Thu, 23 Jan 1997 15:47:35 -0600

87 lines

Re: GEN: Vision Engineering; Just gotta vent

BrianWada <[log in to unmask]>

Fri, 24 Jan 97 09:44:06 PST

106 lines

New Thread

GEN: Where in the world is Ralph Hersey?

GEN: Where in the world is Ralph Hersey?

Randy Reed <[log in to unmask]>

Mon, 20 Jan 97 9:32:05 PST

42 lines

Re: GEN: Where in the world is Ralph Hersey?

[log in to unmask]

Mon, 20 Jan 97 11:32:17 PST

96 lines

Re: GEN: Where in the world is Ralph Hersey?

[log in to unmask]

Mon, 20 Jan 97 11:34:03 PST

63 lines

Re: GEN: Where in the world is Ralph Hersey?

Ralph Hersey <[log in to unmask]>

Mon, 20 Jan 1997 17:38:56 -0800

67 lines

New Thread

GEN: Where in the world is Ralph Hersey? -Reply

GEN: Where in the world is Ralph Hersey? -Reply

David Anderson <[log in to unmask]>

Mon, 20 Jan 1997 13:37:37 -0600

42 lines

New Thread

Gold as Etch Resist

Gold as Etch Resist

[log in to unmask]

Wed, 29 Jan 97 12:05:39 MST

41 lines

Re: Gold as Etch Resist

[log in to unmask]

Wed, 29 Jan 97 15:38:48 PST

65 lines

Re: Gold as Etch Resist

cabeles <[log in to unmask]>

Wed, 29 Jan 97 17:10:00 PST

67 lines

Re[2]: Gold as Etch Resist

ddsulliv <[log in to unmask]>

Thu, 30 Jan 97 08:04:59 cst

140 lines

Re: Gold as Etch Resist

[log in to unmask]

Thu, 30 Jan 97 09:15:57 EST

65 lines

Re[2]: Gold as Etch Resist

[log in to unmask]

Fri, 31 Jan 97 07:48:36 EST

90 lines

New Thread

Gold wiring bonding

Gold wiring bonding

[log in to unmask]

Mon, 27 Jan 1997 07:22:37 EST

58 lines

Re:Gold wiring bonding

David Anderson <[log in to unmask]>

Mon, 27 Jan 1997 15:44:24 -0600

54 lines

New Thread

handling silver halide wastes

RE: handling silver halide wastes

Roubineau, Pascal <[log in to unmask]>

Tue, 21 Jan 1997 17:42 -0800 (PST)

59 lines

New Thread

heat capacity

heat capacity

[log in to unmask]

Tue, 21 Jan 97 15:37:36 CST

40 lines

Re: heat capacity

joef <[log in to unmask]>

Tue, 21 Jan 97 18:14:44 EST

61 lines

New Thread

Hooray for Bob Mesick!

Hooray for Bob Mesick!

[log in to unmask]

Fri, 3 Jan 1997 10:10:17 -0500

36 lines

New Thread

how much force to apply on pcb?

how much force to apply on pcb?

Bab-Hui Lee-CTUA065 <[log in to unmask]>

Mon, 20 Jan 1997 21:00:39 -0600

38 lines

New Thread

Hull Cell criteria

Hull Cell criteria

Vera Payne <[log in to unmask]>

Wed, 22 Jan 1997 09:05:32 -0600

43 lines

Re: Hull Cell criteria

cabeles <[log in to unmask]>

Wed, 22 Jan 97 08:44:22 PST

68 lines

Hull Cell Criteria

Vera Payne <[log in to unmask]>

Wed, 22 Jan 1997 10:57:46 -0600

48 lines

Re: Hull Cell criteria

ddsulliv <[log in to unmask]>

Wed, 22 Jan 97 11:00:05 cst

103 lines

New Thread

I found them !!

I found them !!

Kasprzak, Bill (esd) US <[log in to unmask]>

Fri, 17 Jan 97 09:46:00 PST

51 lines

New Thread

IEC 1112

IEC 1112

Emstad, Zane <[log in to unmask]>

Fri, 17 Jan 1997 12:38:07 -0500

43 lines

Re: IEC 1112

PDUDLEY <[log in to unmask]>

Fri, 17 Jan 97 14:06:38 CST

75 lines

New Thread

IEC 249-2-9-FVO-EP-CP

IEC 249-2-9-FVO-EP-CP

Tom Killick <[log in to unmask]>

Thu, 9 Jan 97 11:59:32 -0800

43 lines

Re: IEC 249-2-9-FVO-EP-CP

PDUDLEY <[log in to unmask]>

Fri, 10 Jan 97 13:42:26 CST

62 lines

New Thread

IEEE WEBSITE?

IEEE WEBSITE?

[log in to unmask]

Tue, 21 Jan 1997 09:04:43 +0000

51 lines

Re: IEEE WEBSITE?

Pratap Singh <[log in to unmask]>

Thu, 23 Jan 1997 21:16:46 -0800

59 lines

RE: IEEE WEBSITE?

NEW INTERNET ADDRESS: [log in to unmask] <[log in to unmask]>

Fri, 24 Jan 97 08:28:35 EST

37 lines

New Thread

ImageFlex

ImageFlex

[log in to unmask]

Wed, 22 Jan 1997 09:07:50 -0800

48 lines

Re: ImageFlex

[log in to unmask]

Thu, 23 Jan 1997 18:34:07 -0500 (EST)

54 lines

New Thread

immersion tin

immersion tin

Robert Welch <[log in to unmask]>

Thu, 16 Jan 1997 18:03:21 +0000

68 lines

Re: immersion tin

ddhillma <[log in to unmask]>

Fri, 17 Jan 97 07:38:03 cst

110 lines

Re: immersion tin

[log in to unmask]

Thu, 23 Jan 1997 16:12:56 +0800

101 lines

New Thread

Immersion Tin coatings

Immersion Tin coatings

Kasprzak, Bill (esd) US <[log in to unmask]>

Fri, 17 Jan 97 07:22:00 PST

57 lines

New Thread

Info: AT Brackets - GLOBE?

Info: AT Brackets - GLOBE?

Neil Diamond <[log in to unmask]>

Tue, 07 Jan 1997 09:31:47 -0600

58 lines

Re: Info: AT Brackets - GLOBE?

Pat McGuine <[log in to unmask]>

Tue, 07 Jan 1997 12:18:57 -0600

91 lines

Re: Info: AT Brackets - GLOBE?

Jerry Cupples <[log in to unmask]>

Tue, 7 Jan 1997 13:34:45 -0600

79 lines

RE: Info: AT Brackets - GLOBE?

Mucelli, Patricia <[log in to unmask]>

Tue, 07 Jan 97 12:39:00 PST

92 lines

New Thread

Inner Layer Core Prep

Inner Layer Core Prep

Dusty <[log in to unmask]>

Thu, 16 Jan 1997 06:57:20 -0500

54 lines

New Thread

IPC Chart on Hi Density Interconnect

IPC Chart on Hi Density Interconnect

Karl Sauter <[log in to unmask]>

Fri, 10 Jan 1997 12:54:51 -0800

45 lines

New Thread

IPC Chat

IPC Chat

Bernard Kessler & Associates LTD <[log in to unmask]>

Wed, 15 Jan 97 11:39 EST

53 lines

IPC CHAT

[log in to unmask]

Wed, 15 Jan 97 19:17:35 +0100

42 lines

RE: IPC CHAT

Wayne Gitlitz <[log in to unmask]>

Wed, 15 Jan 97 18:44:06 -0500

59 lines

New Thread

IPC CHAT -Reply

IPC CHAT -Reply

Dan Lorinser <[log in to unmask]>

Wed, 15 Jan 1997 14:29:45 -0600

55 lines

New Thread

IPC Convention, San Jose, CA March '97

IPC Convention, San Jose, CA March '97

Phil Culpovich <[log in to unmask]>

Wed, 15 Jan 1997 19:13:22 -0800

58 lines

New Thread

IPC Convention, San Jose, CA March '97 (fwd)

IPC Convention, San Jose, CA March '97 (fwd)

David Bergman <[log in to unmask]>

Thu, 16 Jan 1997 15:08:01 -0600 (CST)

107 lines

New Thread

IPC Printed Cts Expo

IPC Printed Cts Expo

Lynch, Lyn <[log in to unmask]>

Mon, 20 Jan 97 07:44:35

53 lines

New Thread

IPC Source for PWB Products/Services

IPC Source for PWB Products/Services

Bob Neves <[log in to unmask]>

Thu, 09 Jan 1997 11:06:59 -0800

58 lines

New Thread

IPC-D-356

IPC-D-356

[log in to unmask]

Fri, 31 Jan 1997 08:47:43 -0500

43 lines

Re: IPC-D-356

[log in to unmask]

Fri, 31 Jan 1997 08:49:02 -0800

47 lines

Re[2]: IPC-D-356

[log in to unmask]

Fri, 31 Jan 1997 12:49:01 -0500

60 lines

RE: IPC-D-356

Schlice Dave <[log in to unmask]>

Fri, 31 Jan 97 11:13:00 MST

61 lines

New Thread

IPC-D-356 and IPC356A

Re: IPC-D-356 and IPC356A

Wolfgang Schenke <[log in to unmask]>

Sat, 1 Feb 97 09:47 PST

77 lines

New Thread

IPC-D-356 Netlist Testing

IPC-D-356 Netlist Testing

[log in to unmask]

Fri, 3 Jan 1997 09:56:42 -0500 (EST)

46 lines

New Thread

IPC-RB-276

IPC-RB-276

Don Vischulis <[log in to unmask]>

Thu, 30 Jan 1997 21:47:04 -0600

46 lines

New Thread

IPC-RB-276 is OBSOLETE!

Re: IPC-RB-276 is OBSOLETE!

George Franck Jr <[log in to unmask]>

Tue, 21 Jan 1997 17:09:26 -0500

154 lines

Re: IPC-RB-276 is OBSOLETE!

[log in to unmask]

Wed, 22 Jan 1997 07:35:45 EST

254 lines

New Thread

IPC-RB-276 is OBSOLETE! -Reply

Re: IPC-RB-276 is OBSOLETE! -Reply

Dan Lorinser <[log in to unmask]>

Wed, 22 Jan 1997 06:48:13 -0600

145 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

George Franck Jr <[log in to unmask]>

Wed, 22 Jan 1997 09:33:44 -0500

140 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

Mitch Morey <[log in to unmask]>

Wed, 22 Jan 1997 08:45:45 -0800

65 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

Mitch Morey <[log in to unmask]>

Wed, 22 Jan 1997 08:45:45 -0800

65 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

David Bergman <[log in to unmask]>

Wed, 22 Jan 1997 10:56:22 -0600 (CST)

212 lines

New Thread

IPC-RB-276 is OBSOLETE! -Reply -Reply

Re: IPC-RB-276 is OBSOLETE! -Reply -Reply

Dan Lorinser <[log in to unmask]>

Thu, 23 Jan 1997 07:05:35 -0600

39 lines

RE: IPC-RB-276 is OBSOLETE! -Reply -Reply

Vera Payne <[log in to unmask]>

Thu, 23 Jan 1997 09:16:34 -0600

98 lines

Re: IPC-RB-276 is OBSOLETE! -Reply -Reply

David Bergman <[log in to unmask]>

Thu, 23 Jan 1997 09:14:07 -0600 (CST)

51 lines

Re: IPC-RB-276 is OBSOLETE! -Reply -Reply

Lisa Williams <[log in to unmask]>

Thu, 23 Jan 1997 11:09:40 -0600 (CST)

74 lines

New Thread

IPC-RB-276 is OBSOLETE! -Reply -Reply -Reply

RE: IPC-RB-276 is OBSOLETE! -Reply -Reply -Reply

Dan Lorinser <[log in to unmask]>

Thu, 23 Jan 1997 10:28:26 -0600

72 lines

New Thread

IPC-SM-840

RE: IPC-SM-840

[log in to unmask]

Wed, 29 Jan 1997 12:51:52 -0700

49 lines

Re: IPC-SM-840

[log in to unmask]

Thu, 30 Jan 1997 15:50:12 -0500 (EST)

36 lines

Re: IPC-SM-840

[log in to unmask]

Fri, 31 Jan 1997 09:33:39 -0500 (EST)

63 lines

Re: IPC-SM-840

[log in to unmask]

Fri, 31 Jan 1997 12:35:04 -0500 (EST)

50 lines

New Thread

ipc356 netlist

ipc356 netlist

Jerome Schwartz x5474 <[log in to unmask]>

Tue, 7 Jan 1997 08:28:51 -0500

45 lines

New Thread

IPCchat

IPCchat

[log in to unmask]

Wed, 15 Jan 97 19:24:22 EST

54 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Tue, 28 Jan 1997 21:15:18 GMT

62 lines

RE: IPCchat session announcement

Goldman, Patricia J. <[log in to unmask]>

Wed, 29 Jan 97 08:40:00 PST

92 lines

IPCchat session announcement

[log in to unmask]

Wed, 29 Jan 1997 17:30:46 GMT

70 lines

IPCchat session announcement

[log in to unmask]

Fri, 31 Jan 1997 18:17:39 GMT

63 lines

New Thread

Is the use of Masking Tape an ESD Event ??

Is the use of Masking Tape an ESD Event ??

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 15 Jan 97 10:33:00 PST

62 lines

RE: Is the use of Masking Tape an ESD Event ??

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 15 Jan 1997 15:36:00 -0500 (EST)

58 lines

RE: Is the use of Masking Tape an ESD Event ??

Mack, Roger CA-WINPO2 <[log in to unmask]>

Thu, 16 Jan 97 16:12:00 GMT

74 lines

New Thread

JEDEC Info.

JEDEC Info.

Jim Moffit <[log in to unmask]>

Thu, 30 Jan 1997 11:31:52 -0500

43 lines

New Thread

Job listing

Job listing

[log in to unmask][log in to unmask]

Tue, 21 Jan 1997 22:54:51 +0000

70 lines

New Thread

LA, Calif meeting

LA, Calif meeting

Bill Gaines B160 x2199 <[log in to unmask]>

Mon, 20 Jan 97 16:54:39 PST

43 lines

New Thread

lab facilities for SEM testing

lab facilities for SEM testing

Todd Rogers <[log in to unmask]>

Thu, 23 Jan 1997 08:42:26 -0600

40 lines

lab facilities for SEM testing

Todd Rogers <[log in to unmask]>

Thu, 23 Jan 1997 08:51:33 -0600

44 lines

Re: lab facilities for SEM testing

James W Baker <[log in to unmask]>

23 Jan 1997 09:18:08 -0700

71 lines

Re: lab facilities for SEM testing

Jack Crawford <[log in to unmask]>

Thu, 23 Jan 1997 11:31:33 -0500

60 lines

Re: lab facilities for SEM testing

Ted Stern <[log in to unmask]>

Thu, 23 Jan 1997 16:28:38 -0800

62 lines

New Thread

Labs

RE: Labs

Gagnon, Gerry <[log in to unmask]>

Thu, 30 Jan 1997 11:12:37 -0500

189 lines

New Thread

Laser via source

Laser via source

[log in to unmask]

Wed, 29 Jan 1997 04:33:10 -0500 (EST)

33 lines

Re: Laser via source

James Ying <[log in to unmask]>

Wed, 29 Jan 1997 23:22:02 +0800 (SST)

55 lines

RE: Laser via source

Thomas, Kevin <[log in to unmask]>

Wed, 29 Jan 1997 15:05:00 -0700

67 lines

RE: Laser via source

David Anderson <[log in to unmask]>

Thu, 30 Jan 1997 10:02:52 -0600

41 lines

Re[2]: Laser via source

[log in to unmask]

Fri, 31 Jan 97 07:51:16 EST

85 lines

New Thread

lifed pads

lifed pads

Yakov Steinberg <[log in to unmask]>

Tue, 14 Jan 1997 10:52:18 +0200 (IST)

45 lines

Re: lifed pads

Jack Crawford <[log in to unmask]>

Tue, 14 Jan 1997 15:43:45 -0500

85 lines

New Thread

Manufacturing Engineer Seeking Employment.

Manufacturing Engineer Seeking Employment.

[log in to unmask]

Fri, 31 Jan 1997 08:01:56 -0500

54 lines

Re: Manufacturing Engineer Seeking Employment.

[log in to unmask]

Fri, 31 Jan 1997 18:39:50 -0500 (EST)

38 lines

New Thread

Marking

Marking

Paul Stolar <[log in to unmask]>

Mon, 06 Jan 97 08:39:51 CDT

38 lines

Re: Marking

KoizumiT <[log in to unmask]>

Tue, 07 Jan 97 10:49:31 JST

64 lines

Marking

Paul Stolar <[log in to unmask]>

Tue, 07 Jan 97 10:43:26 CDT

38 lines

Re[2]: Marking

[log in to unmask]

Tue, 7 Jan 1997 13:56:29 -0600

93 lines

Re: Marking

[log in to unmask]

Tue, 7 Jan 1997 17:24:20 -0600

55 lines

Re[2]: Marking

mhu <[log in to unmask]>

Tue, 07 Jan 97 15:48:34 PST

71 lines

Re[3]: Marking

Bilal Khalaf <[log in to unmask]>

Tue, 07 Jan 97 15:54:00 PST

148 lines

Re[3]: Marking

KoizumiT <[log in to unmask]>

Wed, 08 Jan 97 09:48:32 JST

110 lines

Re: Marking

[log in to unmask]

Wed, 8 Jan 1997 09:00:32 -0600

63 lines

Re[4]: Marking

BrianWada <[log in to unmask]>

Wed, 08 Jan 97 09:17:58 PST

175 lines

Re[4]: Marking

BrianWada <[log in to unmask]>

Wed, 08 Jan 97 09:31:40 PST

140 lines

New Thread

Marking -Reply

Re[3]: Marking -Reply

David Anderson <[log in to unmask]>

Wed, 08 Jan 1997 10:16:57 -0600

56 lines

New Thread

marking ink

marking ink

Jim Douglas <[log in to unmask]>

Thu, 16 Jan 1997 15:31:23 -0000

45 lines

New Thread

Masking Tape and ESD Damage

RE: Masking Tape and ESD Damage

Lynch, Lyn <[log in to unmask]>

Thu, 16 Jan 97 08:24:14

58 lines

Re[2]: Masking Tape and ESD Damage

BrianWada <[log in to unmask]>

Thu, 16 Jan 97 11:22:13 PST

110 lines

New Thread

measuring paste height

measuring paste height

MIKE J. LOPEZ <[log in to unmask]>

Fri, 31 Jan 1997 08:03:21 -0500

37 lines

Re: measuring paste height

[log in to unmask]

Fri, 31 Jan 1997 09:13:11 -0500 (EST)

39 lines

Re:measuring paste height

David Anderson <[log in to unmask]>

Fri, 31 Jan 1997 10:03:26 -0600

54 lines

RE: measuring paste height

John Nelson <[log in to unmask]>

Thu, 30 Jan 1997 11:46:47 -0500

48 lines

Re: measuring paste height

nldeblie <[log in to unmask]>

Fri, 31 Jan 97 11:42:52 cst

95 lines

Re: measuring paste height

[log in to unmask]

Fri, 31 Jan 1997 14:08:27 -0500

76 lines

Re: measuring paste height

LWFERGUS <[log in to unmask]>

Fri, 31 Jan 97 13:01:45 CST

64 lines

Re: measuring paste height

[log in to unmask]

Fri, 31 Jan 97 10:39:59

116 lines

Re[2]: measuring paste height

Doreen Fisher <[log in to unmask]>

31 Jan 97 15:19 CST

81 lines

Re: measuring paste height

Phil Yates <[log in to unmask]>

Fri, 31 Jan 1997 13:41:15 -0600

66 lines

New Thread

melf's

melf's

[log in to unmask]

Thu, 16 Jan 1997 09:15:22 +0000

63 lines

Re: melf's

ddhillma <[log in to unmask]>

Thu, 16 Jan 97 13:02:58 cst

99 lines

Re: melf's

Jack Crawford <[log in to unmask]>

Tue, 21 Jan 1997 11:04:35 -0500

133 lines

New Thread

melf's, J-STD-001, IPC-610

Re: melf's, J-STD-001, IPC-610

VS <[log in to unmask]>

Sun, 19 Jan 1997 13:43:12 -0500

167 lines

Re: melf's, J-STD-001, IPC-610

[log in to unmask]

Mon, 20 Jan 1997 13:07:14 -0500 (EST)

56 lines

Re[2]: melf's, J-STD-001, IPC-610

ddhillma <[log in to unmask]>

Mon, 20 Jan 97 12:54:27 cst

227 lines

Re: melf's, J-STD-001, IPC-610

VS <[log in to unmask]>

Mon, 20 Jan 1997 22:57:23 -0500

127 lines

Re[2]: melf's, J-STD-001, IPC-610

ddhillma <[log in to unmask]>

Tue, 21 Jan 97 08:03:52 cst

158 lines

New Thread

MIL Std. -2000- ???

MIL Std. -2000- ???

[log in to unmask]

28 Jan 97 22:35 GMT+0500

53 lines

Re: MIL Std. -2000- ???

David Bergman <[log in to unmask]>

Tue, 28 Jan 1997 17:07:15 -0600 (CST)

70 lines

New Thread

missing components

missing components

Dominick Cizek <[log in to unmask]>

Thu, 23 Jan 1997 10:59:57 -0500

37 lines

Re: missing components

[log in to unmask]

Thu, 23 Jan 97 09:43:24 -0800

50 lines

Re: missing components

[log in to unmask]

Thu, 23 Jan 97 11:22:28

96 lines

New Thread

Mixed Tech Assy

Re: Mixed Tech Assy

Jim Zanolli <[log in to unmask]>

Thu, 30 Jan 1997 12:34:35 -0500

50 lines

New Thread

MTBF/ESD/EOS

MTBF/ESD/EOS

test <[log in to unmask]>

Thu, 2 Jan 97 19:43 WET

48 lines

New Thread

Need HELP with Mydata machines

Need HELP with Mydata machines

SDalton <[log in to unmask]>

Mon, 27 Jan 1997 16:49:12 -0600

45 lines

Re: Need HELP with Mydata machines

Mikael Blank <[log in to unmask]>

Tue, 28 Jan 1997 10:13:28 +0100

57 lines

RE: Need HELP with Mydata machines

Jack Crawford <[log in to unmask]>

Tue, 28 Jan 1997 11:03:33 -0500

79 lines

Re: Need HELP with Mydata machines

[log in to unmask]

Tue, 28 Jan 1997 09:54:28 -0600

69 lines

New Thread

Nepcon West'97

Nepcon West'97

Antoni Cherta <[log in to unmask]>

Wed, 15 Jan 1997 15:08:16 +0100

54 lines

Re: Nepcon West'97

ddhillma <[log in to unmask]>

Wed, 15 Jan 97 11:48:50 cst

80 lines

Re: Nepcon West'97

Tom Chung <[log in to unmask]>

Wed, 15 Jan 1997 17:51:05 -0600

81 lines

New Thread

New Substrate Materials for P-BGA

New Substrate Materials for P-BGA

eiju yorozu <[log in to unmask]>

Tue, 14 Jan 97 16:01:31 JST

64 lines

Re: New Substrate Materials for P-BGA

[log in to unmask]

Tue, 14 Jan 1997 21:33:16 -0500 (EST)

43 lines

Re: New Substrate Materials for P-BGA

[log in to unmask]

Wed, 15 Jan 1997 13:32:55 -0500 (EST)

38 lines

New Thread

Ni Resins for Gold Plating

Ni Resins for Gold Plating

Steve Sparkowich <[log in to unmask]>

Mon, 13 Jan 97 23:16:34 PST

40 lines

Re: Ni Resins for Gold Plating

Bob Mesick <[log in to unmask]>

Tue, 14 Jan 1997 11:52:35 -0800 (PST)

85 lines

Re[2]: Ni Resins for Gold Plating

Michael Holan <[log in to unmask]>

Wed, 15 Jan 1997 06:40:59 -0600

137 lines

New Thread

No clean Fluxes

Re:No clean Fluxes

Antoni <[log in to unmask]>

Wed, 8 Jan 1997 18:48:28 +0100

59 lines

New Thread

No messages

Re: No messages

James W Baker <[log in to unmask]>

31 Jan 1997 07:33:54 -0700

90 lines

New Thread

NO MORE RULE MESSAGES!

NO MORE RULE MESSAGES!

TOM BRESNAN <[log in to unmask]>

Thu, 16 Jan 97 07:50:07 PST

39 lines

New Thread

NO SUBJECT

NO SUBJECT

[log in to unmask]

Sat, 11 Jan 97 10:19:41 EST

46 lines

New Thread

Off topic subject - do not read for technical info.

Off topic subject - do not read for technical info.

[log in to unmask]

Tue, 21 Jan 1997 11:46:46 -0800

77 lines

New Thread

offset stripline

offset stripline

Caldera Desktop User <[log in to unmask]>

Tue, 14 Jan 1997 11:43:09 -0800 (PST)

95 lines

New Thread

Optimizing for Fine Pitch Devices in SMT

Optimizing for Fine Pitch Devices in SMT

David T. Novick <[log in to unmask]>

Wed, 29 Jan 97 09:52:37 PST

63 lines

RE: Optimizing for Fine Pitch Devices in SMT

Pat Kane (by way of [log in to unmask] Jack Crawford) <[log in to unmask]>

Thu, 30 Jan 1997 12:38:32 -0500

94 lines

New Thread

ORC exposure machine

ORC exposure machine

tonghh <[log in to unmask]>

Tue, 28 Jan 1997 21:50:43 +0800

39 lines

ORC EXPOSURE MACHINE

[log in to unmask]

Tue, 28 Jan 1997 11:16:50 EST

64 lines

New Thread

other forums

other forums

Guenter Grossmann <[log in to unmask]>

Fri, 10 Jan 1997 11:11:29 +0100

47 lines

Re: other forums

[log in to unmask]

Fri, 10 Jan 1997 14:11:13 -0500 (EST)

46 lines

New Thread

package style ?

package style ?

[log in to unmask]

Thu, 9 Jan 1997 10:46:00 -0500 (EST)

47 lines

Re: package style ?

mrosenfi <[log in to unmask]>

Thu, 9 Jan 1997 11:32:16 -0500

73 lines

RE: package style ?

Wander, Nicholas G RV <[log in to unmask]>

Thu, 09 Jan 97 11:14:00 CST

86 lines

Re: package style ?

Mack, Roger CA-WINPO2 <[log in to unmask]>

Thu, 09 Jan 97 18:12:00 GMT

105 lines

RE: package style ?

Max Bernhardt <[log in to unmask]>

Thu, 9 Jan 1997 15:59:00 -0600

79 lines

RE: package style ?

Max Bernhardt <[log in to unmask]>

Thu, 9 Jan 1997 16:04:00 -0600

81 lines

New Thread

Paper Phenolic Assemblies

Paper Phenolic Assemblies

Steve O'Hara <[log in to unmask]>

Thu, 30 Jan 1997 09:16:49 -0800

77 lines

New Thread

paraCHAT

paraCHAT

[log in to unmask]

Tue, 14 Jan 1997 16:07:51 -0500 (EST)

55 lines

Re: paraCHAT

BrianWada <[log in to unmask]>

Tue, 14 Jan 97 18:01:01 PST

72 lines

New Thread

PEM Reliability

PEM Reliability

Mike Adams <[log in to unmask]>

Thu, 9 Jan 97 13:43 EST

78 lines

Re: PEM Reliability

Brian Hyde <[log in to unmask]>

Thu, 09 Jan 1997 15:27:10 -0500

79 lines

New Thread

Phone request

Phone request

Antoni <[log in to unmask]>

Fri, 10 Jan 1997 10:18:30 +0100

51 lines

Re: Phone request

Tom Cooper <[log in to unmask]>

Fri, 10 Jan 97 08:12:42 EST

76 lines

RE: Phone Request

Mucelli, Patricia <[log in to unmask]>

Fri, 10 Jan 97 12:05:00 PST

74 lines

New Thread

Photo-initiation

Photo-initiation

tonghh <[log in to unmask]>

Wed, 15 Jan 1997 22:26:59 +0800

46 lines

Re: Photo-initiation

[log in to unmask]

Wed, 15 Jan 1997 15:15:58 -0500 (EST)

66 lines

Re: Photo-initiation

[log in to unmask]

Wed, 15 Jan 1997 18:22:11 -0500

68 lines

RE: Photo-initiation

Bert Ohlig <[log in to unmask]>

Thu, 16 Jan 97 15:00:26 UT

109 lines

Re: Photo-initiation

[log in to unmask]

Sat, 18 Jan 1997 16:54:04 -0500 (EST)

65 lines

Re: Photo-initiation

Kerry Grimes <[log in to unmask]>

Sat, 18 Jan 1997 20:14:32 -0800

109 lines

Re[2]: Photo-initiation

[log in to unmask]

Sun, 19 Jan 97 18:40:54 EST

114 lines

New Thread

Phototool dimensional stability

Phototool dimensional stability

[log in to unmask]

Tue, 7 Jan 1997 03:47:46 -0500

66 lines

RE: Phototool dimensional stability

Murray, George @ GSC <[log in to unmask]>

Tue, 07 Jan 97 14:01:00 PST

116 lines

Re: Phototool dimensional stability

John Gibson <[log in to unmask]>

Tue, 07 Jan 1997 17:33:59 -0800

98 lines

Re[2]: Phototool dimensional stability

E-C-KOH <[log in to unmask]>

Wed, 08 Jan 97 07:56:11

124 lines

Re: Phototool dimensional stability

[log in to unmask]

Tue, 7 Jan 1997 23:59:49 -0500 (EST)

37 lines

New Thread

Plasma

Plasma

Timothy Gaylor <[log in to unmask]>

Thu, 23 Jan 1997 23:25:53 -0500

47 lines

Re: Plasma

[log in to unmask]

Fri, 24 Jan 97 08:27:29 EST

77 lines

Re: Plasma

[log in to unmask]

Fri, 24 Jan 1997 18:49:49 -0600

97 lines

Re: Plasma

Goldman, Patricia J. <[log in to unmask]>

Mon, 27 Jan 97 13:46:00 PST

159 lines

Re[2]: Plasma

[log in to unmask]

Mon, 27 Jan 1997 16:37:59 -0600

200 lines

New Thread

Plastic Package Hemeticity

Re: Plastic Package Hemeticity

DAVY.J.G- <[log in to unmask]>

Wed, 29 Jan 1997 16:55:39 -0500

55 lines

New Thread

plastic package hermeticity

plastic package hermeticity

Neil W. Lareau <[log in to unmask]>

Fri, 24 Jan 1997 17:02:20 -0500

42 lines

Re: plastic package hermeticity

Douglas Sandvick <[log in to unmask]>

Mon, 27 Jan 1997 09:04:01 -0600 (CST)

73 lines

RE: plastic package hermeticity

DAVY.J.G- <[log in to unmask]>

Mon, 27 Jan 1997 10:54:30 -0500

146 lines

Re: plastic package hermeticity

James W Baker <[log in to unmask]>

27 Jan 1997 09:51:24 -0700

80 lines

Re: plastic package hermeticity

James W Baker <[log in to unmask]>

27 Jan 1997 13:12:40 -0700

79 lines

Re: plastic package hermeticity

[log in to unmask]

Mon, 27 Jan 1997 18:17:23 -0500 (EST)

44 lines

Re: plastic package hermeticity

Torrie Bova <[log in to unmask]>

Tue, 28 Jan 1997 14:02:36 +0900

60 lines

New Thread

Plotter manufacturers for PCB

Plotter manufacturers for PCB

Antoni <[log in to unmask]>

Fri, 10 Jan 1997 10:18:28 +0100

51 lines

New Thread

Post Baking Process

Post Baking Process

rsuthar <[log in to unmask]>

Fri, 24 Jan 97 15:03:18 PST

48 lines

Re: Post Baking Process

R_R_HOLMES <[log in to unmask]>

Mon, 27 Jan 97 11:26:40 EST

118 lines

Re[2]: Post Baking Process

cabeles <[log in to unmask]>

Mon, 27 Jan 97 12:30:31 PST

59 lines

Re[3]: Post Baking Process

Terry Pearo <[log in to unmask]>

Mon, 27 Jan 97 16:17:33 PST

103 lines

RE[3]: Post Baking Process

Glenn Heath <[log in to unmask]>

Mon, 27 Jan 1997 16:34:51 -0800 (PST)

67 lines

Re[2]: Post Baking Process

[log in to unmask]

Fri, 31 Jan 97 08:54:02 EST

123 lines

New Thread

pqfp208 footprint land pattern

pqfp208 footprint land pattern

Karren Olson <[log in to unmask]>

Thu, 23 Jan 1997 13:29:29 -0800

49 lines

New Thread

Probimer 74

Probimer 74

[log in to unmask]

Tue, 21 Jan 1997 13:29:14 -0500 (EST)

44 lines

New Thread

Proto-type Quick Turn Boards

Proto-type Quick Turn Boards

[log in to unmask]

Tue, 7 Jan 1997 12:12:07 -0600

53 lines

Re: Proto-type Quick Turn Boards

[log in to unmask]

Wed, 8 Jan 1997 10:26:44 -0500 (EST)

39 lines

Re: Proto-type Quick Turn Boards

[log in to unmask]

Wed, 8 Jan 1997 07:44:34 -0700

44 lines

Re: Proto-type Quick Turn Boards

Jack Olson <[log in to unmask]>

Wed, 08 Jan 1997 11:00:30 -0800

48 lines

Re: Proto-type Quick Turn Boards

Darrell Bonzo <[log in to unmask]>

Wed, 08 Jan 97 15:37

75 lines

New Thread

Proto-type Quick Turn Boards -Reply

Proto-type Quick Turn Boards -Reply

Dan Lorinser <[log in to unmask]>

Thu, 02 Jan 1997 07:12:31 -0600

71 lines

Re: Proto-type Quick Turn Boards -Reply

[log in to unmask]

Thu, 02 Jan 97 10:09:51 PST

91 lines

Re: Proto-type Quick Turn Boards -Reply

Dan Lorinser <[log in to unmask]>

Wed, 08 Jan 1997 10:55:50 -0600

69 lines

New Thread

Proto-type Quick Turn Boards -Reply -Reply

Re: Proto-type Quick Turn Boards -Reply -Reply

Dan Lorinser <[log in to unmask]>

Thu, 02 Jan 1997 12:47:02 -0600

107 lines

New Thread

PWB manufacturing question?

PWB manufacturing question?

[log in to unmask]

Mon, 27 Jan 1997 15:17:50 EST

53 lines

New Thread

qualification plan for BGA soldering process.

qualification plan for BGA soldering process.

OBRIEN GERARD <[log in to unmask]>

Thu, 2 Jan 97 17:04:41 -0500

47 lines

Re: qualification plan for BGA soldering process.

George Franck Jr <[log in to unmask]>

Fri, 3 Jan 1997 09:26:32 -0500

79 lines

RE: qualification plan for BGA soldering process.

Max Bernhardt <[log in to unmask]>

Fri, 3 Jan 1997 07:57:00 -0600

74 lines

Re: qualification plan for BGA soldering process.

[log in to unmask]

Fri, 3 Jan 1997 17:28:19 -0500

52 lines

New Thread

qualification plan for BGA soldering process. -Reply

qualification plan for BGA soldering process. -Reply

Michael Campos <[log in to unmask]>

Fri, 03 Jan 1997 17:51:53 -0500

113 lines

New Thread

Query

Query

[log in to unmask]

Wed, 8 Jan 97 03:29:25 CST

45 lines

New Thread

Quick Turn Boards

Quick Turn Boards

Gregg Frazier <[log in to unmask]>

Wed, 01 Jan 1997 15:32:57 +0000

38 lines

New Thread

Raw card MFG process

Raw card MFG process

[log in to unmask]

Tue, 21 Jan 1997 19:06:55 EST

46 lines

RAW CARD MFG PROCESS

[log in to unmask]

Wed, 22 Jan 1997 05:42:54 EST

58 lines

New Thread

Re : Re: Woven Kevlar

Re : Re: Woven Kevlar

Guenter Grossmann <[log in to unmask]>

Mon, 6 Jan 1997 11:29:08 +0100

62 lines

Re: Re : Re: Woven Kevlar

[log in to unmask]

Mon, 6 Jan 1997 13:38:33 -0500

86 lines

New Thread

RE dielectric values for dif

RE dielectric values for dif

[log in to unmask]

Thu, 23 Jan 1997 10:14:42 +0000

51 lines

RE dielectric values for dif

Andrew P Magee <[log in to unmask]>

Thu, 23 Jan 1997 09:14:00 -0800

79 lines

New Thread

Re Re:Solder blow-out in soldered PTH assemblies

Re Re:Solder blow-out in soldered PTH assemblies

Guenter Grossmann <[log in to unmask]>

Mon, 6 Jan 1997 10:15:23 +0100

84 lines

New Thread

Re [2]: lifed pads

Re [2]: lifed pads

Jack Crawford <[log in to unmask]>

Tue, 21 Jan 1997 15:13:04 -0500

97 lines

New Thread

Re: Aspect Ratios

re: Re: Aspect Ratios

[log in to unmask]

Fri, 3 Jan 1997 07:52:02 -0500

61 lines

New Thread

Re: FAB-Dish downs in copper circuits

Re:Re: FAB-Dish downs in copper circuits

DAVY.J.G- <[log in to unmask]>

Tue, 28 Jan 1997 09:27:56 -0500

45 lines

New Thread

Re:Post Baking Process - Bravo!

Re:Re:Post Baking Process - Bravo!

DAVY.J.G- <[log in to unmask]>

Mon, 27 Jan 1997 15:20:36 -0500

41 lines

New Thread

Reflow of Through-hole

Reflow of Through-hole

[log in to unmask]

Tue, 14 Jan 1997 15:28:31 -0500 (EST)

52 lines

Re: Reflow of Through-hole

[log in to unmask]

Tue, 14 Jan 97 16:56:06 MDT

91 lines

New Thread

Reflow Soldering of PTH Connectors

Reflow Soldering of PTH Connectors

gabriela <[log in to unmask]>

Tue, 23 Jan 1996 23:43:25 +0000

50 lines

Re: Reflow Soldering of PTH Connectors

ddhillma <[log in to unmask]>

Fri, 24 Jan 97 04:42:15 cst

85 lines

Re: Reflow Soldering of PTH Connectors

[log in to unmask]

Fri, 24 Jan 1997 09:38:07 -0500 (EST)

46 lines

RE: Reflow Soldering of PTH Connectors

Wander, Nicholas G RV <[log in to unmask]>

Mon, 27 Jan 97 12:39:00 CST

71 lines

New Thread

Reliability issues and failure modes of Plastic packages

Reliability issues and failure modes of Plastic packages

Oliver Kierse <[log in to unmask]>

Mon, 27 Jan 97 09:30:45 GMT

41 lines

New Thread

Reliability Testing

Reliability Testing

Bob Willis <[log in to unmask]>

02 Jan 97 03:22:34 EST

61 lines

Re: Reliability Testing

[log in to unmask]

Thu, 2 Jan 1997 18:09:33 -0500

110 lines

Re: Reliability Testing

ddhillma <[log in to unmask]>

Fri, 03 Jan 97 15:15:25 cst

110 lines

New Thread

removing RMA flux

removing RMA flux

OPPENHEIMER <[log in to unmask]>

22 Jan 97 21:15:47 EST

36 lines

Re: removing RMA flux

[log in to unmask]

Thu, 23 Jan 1997 08:15:31 -0500

69 lines

RE: removing RMA flux

DAVY.J.G- <[log in to unmask]>

Thu, 23 Jan 1997 10:04:54 -0500

76 lines

Re: removing RMA flux

[log in to unmask]

Thu, 23 Jan 1997 15:58:35 -0500 (EST)

36 lines

Re: removing RMA flux

[log in to unmask]

Fri, 24 Jan 1997 14:47:50 -0500 (EST)

35 lines

RE: removing RMA flux

OPPENHEIMER <[log in to unmask]>

25 Jan 97 14:32:16 EST

34 lines

New Thread

Repeat: Retinning

Repeat: Retinning

[log in to unmask]

Sun, 26 Jan 1997 18:32:53 -0500 (EST)

40 lines

Re: Repeat: Retinning

[log in to unmask]

Mon, 27 Jan 97 10:42:55

72 lines

New Thread

Resource Planning and Execution Systems Meeting

Resource Planning and Execution Systems Meeting

Anthony Hilvers <[log in to unmask]>

Thu, 23 Jan 1997 13:22:21 -0600 (CST)

58 lines

New Thread

reverse pulse plating system

reverse pulse plating system

[log in to unmask]

Thu, 23 Jan 1997 17:34:25 +0500

46 lines

REVERSE PULSE PLATING SYSTEM

[log in to unmask]

Thu, 23 Jan 1997 07:34:03 EST

53 lines

Re: reverse pulse plating system

ddsulliv <[log in to unmask]>

Thu, 23 Jan 97 08:14:33 cst

112 lines

RE: REVERSE PULSE PLATING SYSTEM

[log in to unmask]

Thu, 23 Jan 1997 11:53:37 EST

60 lines

Re: reverse pulse plating system

Thomas E. Waznis <[log in to unmask]>

23 Jan 97 19:32:12 -0800

59 lines

Re[2]: reverse pulse plating system

[log in to unmask]

Fri, 24 Jan 97 09:00:47 MST

53 lines

New Thread

reverse pulse plating system -Reply

reverse pulse plating system -Reply

David Anderson <[log in to unmask]>

Thu, 23 Jan 1997 11:30:48 -0600

70 lines

Re: reverse pulse plating system -Reply

[log in to unmask]

Fri, 24 Jan 1997 00:01:34 -0500 (EST)

37 lines

New Thread

Re[2]: ASSY: J-STD-001 vs. IPC-A-610

RE: Re[2]: ASSY: J-STD-001 vs. IPC-A-610

Goldman, Patricia J. <[log in to unmask]>

Mon, 13 Jan 97 08:33:00 PST

124 lines

New Thread

Re[2]: ASSY: thermocouple adhesive

Re: Re[2]: ASSY: thermocouple adhesive

Eduardo E Wong <[log in to unmask]>

Sat, 11 Jan 1997 02:28:10 PST

120 lines

New Thread

Re[2]: E-Mail addresses

Re: Re[2]: E-Mail addresses

[log in to unmask]

Fri, 24 Jan 1997 14:23:17 -0500

99 lines

New Thread

Re[2]: FAB: Horizontal versus vertical etching

Re: Re[2]: FAB: Horizontal versus vertical etching

Luis Rivera <[log in to unmask]>

Thu, 30 Jan 1997 07:27:16 +600 CDT

154 lines

New Thread

Re[2]: Laser via source

RE: Re[2]: Laser via source

Thomas, Kevin <[log in to unmask]>

Fri, 31 Jan 1997 10:07:00 -0700

130 lines

New Thread

Re[2]: Ni Resins for Gold Plating

Re: Re[2]: Ni Resins for Gold Plating