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TECHNET Archives


January 1997


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Table of Contents:

"Tinning house" (5 messages)
"Wet" Soldermask (1 message)
3D Stereoscopes (2 messages)
55110E (1 message)
<No subject> (1 message)
<none> (4 messages)
Ablebond??? (1 message)
Absorption mechanism of PTH (2 messages)
ACF vs Soldering (1 message)
Adhesive applicatiion equipment on flex rigid boards (1 message)
Adhesive applicatiion equipment on flex rigid boards. (6 messages)
ADMIN: IPC Chat (5 messages)
ADMIN: IPCchat - good news (1 message)
ADMIN: IPCchat session announcement (2 messages)
ADMIN: TechNet problem (1 message)
ADMIN: What is Eric's Number (1 message)
Alumina Oxide Surface Prep (2 messages)
Aluminum oxide scrubbers (1 message)
ANSI/IPC-R-700c (1 message)
Area Code Change 310---->>>> 562 (1 message)
Aspect Ratio (1 message)
Aspect Ratios (4 messages)
Aspect Ratios -Reply (2 messages)
ASS:Wave Solder Board Support (1 message)
ASSEM: Copper Choride problem (6 messages)
ASSEM: Re: JEDEC Info. (1 message)
Assem: under stencil cleaner (2 messages)
Assembly (3 messages)
Assembly: ESD (3 messages)
Assembly: ESD -Reply (1 message)
ASSM: Top fillet formation (1 message)
ASSY (3 messages)
ASSY : Ionic Contamination on FR2 (5 messages)
ASSY : pretinning of fine-pitch devices (3 messages)
ASSY: adhesive pads (1 message)
ASSY: Desiccant Quantity for 15 Year Storage of VMEs (2 messages)
ASSY: Fine Pitch Solder Joint Inspection Method? (6 messages)
ASSY: Florida Cirtech (WS120 and WS130) (1 message)
ASSY: IR Reflow of Thru-Hole Components (7 messages)
ASSY: J-STD-001 vs. IPC-A-610 (3 messages)
ASSY: Jumpers and cuts (3 messages)
ASSY: Low Tin Level in Wave Solder (10 messages)
ASSY: Manix Component Counter (or similar) (2 messages)
ASSY: Manix Mfg Component Counter (or similar) (1 message)
ASSY: Moire Interferometry (2 messages)
ASSY: MTBF for Components, relating to ESD (1 message)
ASSY: OSP coatings (5 messages)
ASSY: Pre-tinning of Gold Leads (5 messages)
Assy: Press Fit (2 messages)
assy: Press In (1 message)
Assy: Rigid Flex (2 messages)
ASSY: Solder Paste Process Control (1 message)
Assy: Solder Skip (3 messages)
ASSY: thermocouple adhesive (6 messages)
ASSY: TSOP with Alloy 42 lead frame field failures (3 messages)
ASSY: TSOP/PLCC reliability (1 message)
ASSY:J-STD-001 vs. IPC-A-610 (1 message)
ASSY:Mil-std 55110?? (3 messages)
ASSY:solder paste qual (1 message)
Assy:TopLine (9 messages)
AW: Re: dielectrics for dif materials (1 message)
backfilling holes at press (1 message)
BGA :ASSY/REWORK (3 messages)
BGA's machines (1 message)
blanks boards (1 message)
Breakaway holes (1 message)
Breakaway holes and V-groove scoring (1 message)
Buried Capacitance / Resistance (3 messages)
Call for Speakers in London (1 message)
Can somebody give me some advice? (2 messages)
CIMS (1 message)
Circo Flex (1 message)
cleaners for RMA flux (5 messages)
Compressors (2 messages)
Conductive foam (5 messages)
conformal coating help (6 messages)
Conformal Coating Suppli (1 message)
Conformal Coating Supplier (1 message)
conformal coating vendor request (2 messages)
Connector placement (2 messages)
Contact pads (1 message)
controlled Impedance (5 messages)
controlled impedance p.c.b's (2 messages)
convection rates (4 messages)
Copper (2 messages)
Copper scopping in solder (1 message)
Creep Rupture testing on BGA (1 message)
current carrying capacity (2 messages)
current in screened silver circuits (4 messages)
defect ppm data (1 message)
Depanelising Ceramic Substrate (1 message)
DES- Gerber formats? (1 message)
DES/FAB:switchpad contacts (2 messages)
DES: Ag polmer via holes (1 message)
DES: Ag polmer via holes - contact (1 message)
DES: Heat Rise Calculations For Flex Part II (1 message)
DES: Internodal Capacitance & Inductance (1 message)
DES: package style ? (1 message)
Des: temp rise (current) (1 message)
DES: trace layout (4 messages)
Design issues (current carrying variables) (3 messages)
Design Standards for BGA (6 messages)
Dielectric Constant of FR-4 and Getek (1 message)
dielectrics for dif materials (3 messages)
Direct metallization (1 message)
Direct metallization for MIL grade PCBs. (2 messages)
direct plating (1 message)
Dispenser for solder preforms (1 message)
DOC:IEC Component value code (6 messages)
DRILL SPINDLE RUNOUT (2 messages)
Dry Film Solder Mask (2 messages)
Dry Film Soldermask (2 messages)
dynamic spindle runout (1 message)
E-Mail addresses (6 messages)
Edmund Scientific Catalog (2 messages)
Effects of temp on growth rate of tin oxide and Cu-Sn IM (1 message)
Effects of temp on growth rate of tin oxide and Cu-Sn IMC (1 message)
Employment (1 message)
Entek Plus Cu-106A (3 messages)
epoxy screening 0603's (2 messages)
epoxy vs. solder paste (2 messages)
Exposed circuits (4 messages)
Exposed circuits -Reply (1 message)
FAB (6 messages)
FAB - Defective units on panelized PWBs (3 messages)
FAB - Matte masks (1 message)
FAB -Reply (2 messages)
FAB Clear LPI (1 message)
fab SM questions (2 messages)
FAB-Dish downs in copper circuits (4 messages)
FAB: (3 messages)
FAB: Carbon Ink vs. Gold Contact Fingers (2 messages)
FAB: Ceramic Alternative (1 message)
FAB: Clean before solder mask (2 messages)
FAB: Clear LPISM (2 messages)
FAB: Core Filling (1 message)
FAB: CU/Invar/Cu suppliers (1 message)
FAB: CU/Invar/Cu suppliers -Reply (2 messages)
FAB: Cupric chloride regeneration with sodium chlorate (2 messages)
FAB: Deburr (1 message)
Fab: Drill Entry Questions (1 message)
FAB: Electrolytic plating propogation rate testers (2 messages)
FAB: Embedded High Density (1 message)
FAB: exposed copper? (1 message)
Fab: Extended Material Cure Cycles (2 messages)
Fab: Finish LPI thickness on circuits (7 messages)
FAB: Hole filling (1 message)
FAB: Horizontal versus vertical etching (5 messages)
FAB: Immersion tin coating (1 message)
fab: immersion tin coatings (5 messages)
FAB: IPC Printed Circuits Expo (4 messages)
FAB: Panelization Software (1 message)
FAB: Plating distribution/ATE/AOI (1 message)
FAB: prepreg fill (1 message)
FAB: Rick Taormino; diazo film and LPI solder mask (1 message)
FAB: Supplier: Job Opportunities Posting (1 message)
Fab: To Equipment Mfr's & Field Serv Org's (1 message)
FAB: Woven Kevlar (1 message)
FAB:ASS: Solder Balling Resist Trials (1 message)
FAB:ASS: Solder Finish Symposium, UK (1 message)
FAB:ASSY: Solder ball free solder resist ?? (1 message)
FAB:Cedal ADDARA PRESS LAMINATOR (2 messages)
FAB:cross grain construction (4 messages)
FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING (1 message)
FAB:Roller swelling (3 messages)
Fabrication (1 message)
Fabrication of Large Printed Circuit Boards (3 messages)
Fabrication of Printed Circuit Boards (5 messages)
fiducial recognition problems (3 messages)
Filling clearance holes in thick metal innerlayer planes (1 message)
final cleaning of pwb's (1 message)
Flex (2 messages)
flexible circuit (1 message)
Flexible Soldermask (2 messages)
Floating waste water treatment sludge (7 messages)
Flying Probe Testers, Another voice heard! (1 message)
FOOTPRINT PQFP208 (2 messages)
FR4 moisture absorption rate (1 message)
FR4 processing and properties (1 message)
Freezing electroless tin: oxide, IMC, whiskers, and pest (2 messages)
Fuji Tape leaf covers (1 message)
FW: 55110E (3 messages)
FW: ASSY: IR Reflow of Thru-Hole Components (1 message)
FW: FAB - Defective units on panelized PWBs (1 message)
FW: Fabrication of Printed Circuit Boards (1 message)
FW: FW: lab facilities for SEM testing (1 message)
FW: GEN: ISO and Calibration (1 message)
FW: Gold as Etch Resist (1 message)
FW: ISO and calibration (1 message)
FW: Manufacturing Engineer Seeking Employment. (1 message)
FW: ORC EXPOSURE MACHINE (1 message)
FW: Panelization Software (fwd) (1 message)
Fw: Who is Tom Bresnan? Son of Victor Johansen, perhaps? (1 message)
Fwd: GEN: Condor Nonsense (1 message)
Fwd: Re: Who is Tom Bresnan? (1 message)
GEN- ISO and Calibration (1 message)
GEN: Book Review (2 messages)
GEN: Book Review for Flex (1 message)
GEN: CMI After Etch (1 message)
GEN: Condor Nonsense (2 messages)
GEN: Condor Nonsense -Reply (1 message)
GEN: Electrowinning Units (2 messages)
GEN: Electrowinning Units (Long) (1 message)
GEN: ISO and Calibration (5 messages)
GEN: Lead Coplanarity Spec?? (5 messages)
Gen: Looking for Bachi Inc. and Meteor Inc. (2 messages)
Gen: Obsoleted Military Documents (1 message)
GEN: PWB Contract Manufacturers (1 message)
GEN: Shelf life for components... (4 messages)
GEN: Vision Engineering; Just gotta vent (2 messages)
GEN: Where in the world is Ralph Hersey? (4 messages)
GEN: Where in the world is Ralph Hersey? -Reply (1 message)
Gold as Etch Resist (6 messages)
Gold wiring bonding (2 messages)
handling silver halide wastes (1 message)
heat capacity (2 messages)
Hooray for Bob Mesick! (1 message)
how much force to apply on pcb? (1 message)
Hull Cell criteria (4 messages)
I found them !! (1 message)
IEC 1112 (2 messages)
IEC 249-2-9-FVO-EP-CP (2 messages)
IEEE WEBSITE? (3 messages)
ImageFlex (2 messages)
immersion tin (3 messages)
Immersion Tin coatings (1 message)
Info: AT Brackets - GLOBE? (4 messages)
Inner Layer Core Prep (1 message)
IPC Chart on Hi Density Interconnect (1 message)
IPC CHAT (3 messages)
IPC CHAT -Reply (1 message)
IPC Convention, San Jose, CA March '97 (1 message)
IPC Convention, San Jose, CA March '97 (fwd) (1 message)
IPC Printed Cts Expo (1 message)
IPC Source for PWB Products/Services (1 message)
IPC-D-356 (4 messages)
IPC-D-356 and IPC356A (1 message)
IPC-D-356 Netlist Testing (1 message)
IPC-RB-276 (1 message)
IPC-RB-276 is OBSOLETE! (2 messages)
IPC-RB-276 is OBSOLETE! -Reply (5 messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply (4 messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply -Reply (1 message)
IPC-SM-840 (4 messages)
ipc356 netlist (1 message)
IPCchat (1 message)
IPCchat session announcement (4 messages)
Is the use of Masking Tape an ESD Event ?? (3 messages)
JEDEC Info. (1 message)
Job listing (1 message)
LA, Calif meeting (1 message)
lab facilities for SEM testing (5 messages)
Labs (1 message)
Laser via source (5 messages)
lifed pads (2 messages)
Manufacturing Engineer Seeking Employment. (2 messages)
Marking (11 messages)
Marking -Reply (1 message)
marking ink (1 message)
Masking Tape and ESD Damage (2 messages)
measuring paste height (10 messages)
melf's (3 messages)
melf's, J-STD-001, IPC-610 (5 messages)
MIL Std. -2000- ??? (2 messages)
missing components (3 messages)
Mixed Tech Assy (1 message)
MTBF/ESD/EOS (1 message)
Need HELP with Mydata machines (4 messages)
Nepcon West'97 (3 messages)
New Substrate Materials for P-BGA (3 messages)
Ni Resins for Gold Plating (3 messages)
No clean Fluxes (1 message)
No messages (1 message)
NO MORE RULE MESSAGES! (1 message)
NO SUBJECT (1 message)
Off topic subject - do not read for technical info. (1 message)
offset stripline (1 message)
Optimizing for Fine Pitch Devices in SMT (2 messages)
ORC EXPOSURE MACHINE (2 messages)
other forums (2 messages)
package style ? (6 messages)
Paper Phenolic Assemblies (1 message)
paraCHAT (2 messages)
PEM Reliability (2 messages)
Phone Request (3 messages)
Photo-initiation (7 messages)
Phototool dimensional stability (5 messages)
Plasma (5 messages)
Plastic Package Hemeticity (1 message)
plastic package hermeticity (7 messages)
Plotter manufacturers for PCB (1 message)
Post Baking Process (6 messages)
pqfp208 footprint land pattern (1 message)
Probimer 74 (1 message)
Proto-type Quick Turn Boards (5 messages)
Proto-type Quick Turn Boards -Reply (3 messages)
Proto-type Quick Turn Boards -Reply -Reply (1 message)
PWB manufacturing question? (1 message)
qualification plan for BGA soldering process. (4 messages)
qualification plan for BGA soldering process. -Reply (1 message)
Query (1 message)
Quick Turn Boards (1 message)
RAW CARD MFG PROCESS (2 messages)
Re : Re: Woven Kevlar (2 messages)
RE dielectric values for dif (2 messages)
Re Re:Solder blow-out in soldered PTH assemblies (1 message)
Re [2]: lifed pads (1 message)
Re: Aspect Ratios (1 message)
Re: FAB-Dish downs in copper circuits (1 message)
Re:Post Baking Process - Bravo! (1 message)
Reflow of Through-hole (2 messages)
Reflow Soldering of PTH Connectors (4 messages)
Reliability issues and failure modes of Plastic packages (1 message)
Reliability Testing (3 messages)
removing RMA flux (6 messages)
Repeat: Retinning (2 messages)
Resource Planning and Execution Systems Meeting (1 message)
reverse pulse plating system (6 messages)
reverse pulse plating system -Reply (2 messages)
Re[2]: ASSY: J-STD-001 vs. IPC-A-610 (1 message)
Re[2]: ASSY: thermocouple adhesive (1 message)
Re[2]: E-Mail addresses (1 message)
Re[2]: FAB: Horizontal versus vertical etching (1 message)
Re[2]: Laser via source (1 message)
Re[2]: Ni Resins for Gold Plating (1 message)
Re[2]: Post Baking Process (2 messages)
Re[2]: Stripping photo resist problem (1 message)
Re[3]: FAB-Dish downs in copper circuits (1 message)
Rigid Laminate stabilty (2 messages)
Roku Roku Sangyo, Ltd. (1 message)
ROLLER SWELLING (1 message)
Rule: Re: offset stripline (2 messages)
Rule: Re[2]: ASSY: IR Reflow of Thru-Hole Components -Reply (1 message)
science fair (1 message)
screen ink (1 message)
SEM LabTest and Analysis Facilities (1 message)
Shelf Life of Fused Tin/Lead Coated PWBs (1 message)
Shelf Life of Solderable Finishes (1 message)
signup of Joe Dickson (1 message)
Silver Halide Film Development (5 messages)
Silver Halide Film Development (Waste Mgmnt) (1 message)
Silver Halide Film Development -Reply (1 message)
SM version of a through-hole cap (5 messages)
Software (4 messages)
Solder blow-out in soldered PTH assemblies (2 messages)
Solder Joint Reliability & Standards (3 messages)
Solder Mask Peel Off (4 messages)
Solder Mask Peel Off - 2 (1 message)
Solder pallets (1 message)
Solder Paste Plastic or Eutectic (1 message)
Solder purification (copper removal) (2 messages)
Solder Resist Plugs (3 messages)
Solder Resist Plugs II (2 messages)
Soldering Profiles (6 messages)
Soldermask peeling (3 messages)
Soldermask Peeling -Reply (1 message)
SOT23 leadframe alloy (2 messages)
Space Qualified Solder Mask (2 messages)
Space Qualified Solder Mask -Reply (1 message)
Spot peel-soldermask (3 messages)
Sputtering (1 message)
Standard Time Data (2 messages)
Stripping photo resist problem (6 messages)
Subj: Center Support Wire (3 messages)
SUBSTRATE MATERIAL (2 messages)
Substrate Materials. (1 message)
Surface Leakage Testing (2 messages)
Surface Mount Test Points (2 messages)
technet (1 message)
TechNet-d Digest V97 #30 (1 message)
Temp Profile (4 messages)
temp rise (current) (1 message)
Temperature profile (2 messages)
Tenting Process (2 messages)
Terra Universal Dessicant Chambers (1 message)
Test house for ipc tm-650 tests (1 message)
Test temperature range (6 messages)
Test temperature range / SM reliability (1 message)
TEST: Re: Test temperature range (2 messages)
thanks (1 message)
Thanks for Proto-Type house leads (1 message)
The shape of test probes for SMD (4 messages)
Thermal relief gap width (3 messages)
Thermal relief gap width -Reply (1 message)
Thermal sensitive sheet (3 messages)
Thermal sensitive sheets (1 message)
Time to train operators: J-STD-001 and LRNC flux (5 messages)
Tin Coatings (4 messages)
Tom's Apology (1 message)
Trace Damage from Breakaway Holes (6 messages)
Trace Damage from Breakaway Holes -Reply (1 message)
Transmission test (1 message)
TSOP placement (1 message)
Unidentified subject! (9 messages)
Unidentified subject! (Cu balance) (1 message)
unsubscribe (1 message)
Use of standards to ensure solder connection reliability (1 message)
Use of the term "alumina" (1 message)
Vacuum frames (1 message)
vias (5 messages)
VP precision (1 message)
Washing Stencils (3 messages)
WAVE SOLDERING SMT ICS (6 messages)
Whatever happened to ?? (2 messages)
White soldermask (8 messages)
Who is Tom Bresnan? (3 messages)
Woven Kevlar (1 message)
WS-609 paste clean and SM part for filter capacitor (2 messages)
Xray technology (2 messages)
XRF Plating thickness measurement (2 messages)
[2] ASSY: IR Reflow of Thru-Hole Components (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

Re:

Bob Mesick

Fri, 31 Jan 1997 10:51:38 -0800 (PST)

103 lines

New Thread

"Tinning house"

Re[2]: "Tinning house"

mkwoka01

Fri, 24 Jan 1997 09:18:07 -0500

91 lines

Re[2]: "Tinning house"

ddhillma

Fri, 24 Jan 97 05:09:43 cst

99 lines

Re: "Tinning house"

<>

Thu, 23 Jan 1997 22:11:44 -0500 (EST)

42 lines

"Tinning house"

DAVY.J.G-

Thu, 23 Jan 1997 11:04:08 -0500

42 lines

"Tinning house"

DAVY.J.G-

Thu, 23 Jan 1997 10:14:20 -0500

45 lines

New Thread

"Wet" Soldermask

"Wet" Soldermask

Greg Hirneisen

Mon, 06 Jan 1997 10:06:12 -0500

56 lines

New Thread

3D Stereoscopes

Re: 3D Stereoscopes

<>

Wed, 8 Jan 1997 18:21:49 -0500

62 lines

3D Stereoscopes

<>

Wed, 8 Jan 1997 10:52:17 -0600

47 lines

New Thread

55110E

55110E

Baker,Kelly

Mon, 27 Jan 1997 06:29:09 -0500

43 lines

New Thread

<No subject>

<No subject>

John Riley

Thu, 9 Jan 1997 13:20:23 -0600 (CST)

72 lines

New Thread

<none>

Re: <none>

Ava Fung

31 Jan 97 16:15:58 PST

53 lines

Re: <none>

Sherman Banks

31 Jan 97 08:11:55 PST

46 lines

Re: <none>

Ava Fung

30 Jan 97 09:50:00 PST

83 lines

Re: <none>

Sherman Banks

14 Jan 97 06:36:12 PST

49 lines

New Thread

Ablebond???

Re: Ablebond???

<>

Thu, 2 Jan 1997 13:19:27 -0500

53 lines

New Thread

Absorption mechanism of PTH

Re: Absorption mechanism of PTH

<>

Sun, 5 Jan 1997 22:17:34 -0500

128 lines

Absorption mechanism of PTH

No Name

Sat, 4 Jan 1997 22:13:42 -0600 (CST)

66 lines

New Thread

ACF vs Soldering

ACF vs Soldering

aposeiko

Fri, 17 Jan 1997 14:57:21 -0800

42 lines

New Thread

Adhesive applicatiion equipment on flex rigid boards

Re:Adhesive applicatiion equipment on flex rigid boards

David Anderson

Thu, 09 Jan 1997 16:16:13 -0600

46 lines

New Thread

Adhesive applicatiion equipment on flex rigid boards.

Adhesive applicatiion equipment on flex rigid boards.

Steve Sekanina

Thu, 9 Jan 1997 15:07:51 +0000

54 lines

Adhesive applicatiion equipment on flex rigid boards.

<>

Fri, 10 Jan 97 09:23:46 EST

69 lines

Re: Adhesive applicatiion equipment on flex rigid boards.

Michael Barmuta

Thu, 9 Jan 1997 14:29:03 -0800

78 lines

Re: Adhesive applicatiion equipment on flex rigid boards.

Paul Stolar

Thu, 09 Jan 97 15:57:19 CDT

59 lines

Re: Adhesive applicatiion equipment on flex rigid boards.

<>

Thu, 09 Jan 97 13:22:26 PST

59 lines

Adhesive applicatiion equipment on flex rigid boards.

Steve Sekanina

Thu, 9 Jan 1997 15:07:51 +0000

43 lines

New Thread

ADMIN: IPC Chat

ADMIN: IPC Chat

<>

Thu, 16 Jan 1997 14:21:10 -0600 (CST)

477 lines

ADMIN: IPC Chat

<>

Tue, 14 Jan 1997 16:28:19 -0600 (CST)

70 lines

Re: ADMIN: IPC Chat

jseeger

Tue, 14 Jan 1997 14:56:13 -0500

85 lines

Re: ADMIN: IPC Chat

<>

Sat, 11 Jan 1997 00:19:25 -0500 (EST)

38 lines

ADMIN: IPC Chat

<>

Fri, 10 Jan 1997 17:08:18 -0600 (CST)

81 lines

New Thread

ADMIN: IPCchat - good news

ADMIN: IPCchat - good news

<>

Thu, 16 Jan 1997 15:25:51 -0600 (CST)

62 lines

New Thread

ADMIN: IPCchat session announcement

ADMIN: IPCchat session announcement

<>

Fri, 24 Jan 1997 18:24:07 -0600 (CST)

92 lines

ADMIN: IPCchat session announcement

<>

Fri, 24 Jan 1997 18:24:07 -0600 (CST)

92 lines

New Thread

ADMIN: TechNet problem

ADMIN: TechNet problem

<>

Fri, 31 Jan 1997 11:54:40 -0600 (CST)

66 lines

New Thread

ADMIN: What is Eric's Number

ADMIN: What is Eric's Number

Melinda Robinson

Wed, 22 Jan 1997 17:20:42 -0600 (CST)

52 lines

New Thread

Alumina Oxide Surface Prep

Re: Alumina Oxide Surface Prep

<>

Thu, 2 Jan 1997 23:31:54 -0500

52 lines

Alumina Oxide Surface Prep

<>

Thu, 2 Jan 1997 19:01:31 -0500

42 lines

New Thread

Aluminum oxide scrubbers

Aluminum oxide scrubbers

<>

Tue, 7 Jan 1997 13:08:45 -0500

50 lines

New Thread

ANSI/IPC-R-700c

ANSI/IPC-R-700c

Richard Boerdner

Fri, 24 Jan 1997 16:52:50 +0000

39 lines

New Thread

Area Code Change 310---->>>> 562

Area Code Change 310---->>>> 562

Bernard Kessler & Associates LTD

Tue, 28 Jan 97 18:19 EST

86 lines

New Thread

Aspect Ratio

Aspect Ratio

Dan Lorinser

Mon, 06 Jan 1997 10:28:07 -0600

43 lines

New Thread

Aspect Ratios

Re: Aspect Ratios

<>

Fri, 3 Jan 1997 13:57:41 -0600

130 lines

Re[2]: Aspect Ratios

<>

Fri, 03 Jan 97 09:47:41 EST

162 lines

RE: Aspect Ratios

Wander, Nicholas G RV

Thu, 02 Jan 97 14:53:00 CST

98 lines

RE: Aspect Ratios

Wander, Nicholas G RV

Thu, 02 Jan 97 13:29:00 CST

142 lines

New Thread

Aspect Ratios -Reply

RE: Aspect Ratios -Reply

Wander, Nicholas G RV

Fri, 03 Jan 97 10:27:00 CST

140 lines

RE: Aspect Ratios -Reply

Dan Lorinser

Fri, 03 Jan 1997 08:32:30 -0600

168 lines

New Thread

ASS:Wave Solder Board Support

ASS:Wave Solder Board Support

Bob Willis

10 Jan 97 10:39:05 EST

99 lines

New Thread

ASSEM: Copper Choride problem

Re: ASSEM: Copper Choride problem

Steve Mikell

Fri, 10 Jan 1997 00:39:00 -0600 (CST)

82 lines

Re: ASSEM: Copper Choride problem

<>

Thu, 9 Jan 1997 21:27:12 -0500 (EST)

38 lines

Re: ASSEM: Copper Choride problem

D. Rooke

Wed, 8 Jan 1997 21:35:17 -0500 (EST)

96 lines

Re: ASSEM: Copper Choride problem

<>

Wed, 8 Jan 1997 18:14:51 -0500

70 lines

Re: ASSEM: Copper Choride problem

ddsulliv

Wed, 08 Jan 97 16:25:22 cst

118 lines

ASSEM: Copper Choride problem

YAP CHOW LAN

Wed, 8 Jan 1997 16:00:07 +0800

51 lines

New Thread

ASSEM: Re: JEDEC Info.

ASSEM: Re: JEDEC Info.

Mike Buetow

Thu, 30 Jan 1997 10:43:30 -0600 (CST)

79 lines

New Thread

Assem: under stencil cleaner

RE: Assem: under stencil cleaner

Jim Marsico 516-595-5879

Tue, 14 Jan 1997 07:53:00 -0500 (EST)

63 lines

Assem: under stencil cleaner

<>

Tue, 14 Jan 1997 17:03:22 +1200

58 lines

New Thread

Assembly

RE: Assembly

Jan Satterfield

Mon, 20 Jan 97 9:10

83 lines

RE: Assembly

Jerry Cupples

Mon, 20 Jan 1997 09:38:26 -0600

60 lines

RE: Assembly

Jack W. Bryant

Mon, 20 Jan 1997 07:27:34 -0500

43 lines

New Thread

Assembly: ESD

Re: Assembly: ESD

Hollandsworth, Ron

Fri, 31 Jan 97 16:24:04 EST

88 lines

RE: Assembly: ESD

Darrell Bonzo

Fri, 31 Jan 97 15:47

80 lines

Assembly: ESD

ddhillma

Fri, 31 Jan 97 08:58:37 cst

48 lines

New Thread

Assembly: ESD -Reply

Assembly: ESD -Reply

David Anderson

Fri, 31 Jan 1997 14:17:05 -0600

37 lines

New Thread

ASSM: Top fillet formation

Re[2]: ASSM: Top fillet formation

Aric Parr

02 Jan 97 15:59:25 -0500

146 lines

New Thread

ASSY

Re: ASSY

<>

Tue, 14 Jan 1997 23:00:10 -0500 (EST)

144 lines

Re: ASSY

<>

Tue, 14 Jan 1997 23:00:10 -0500 (EST)

50 lines

ASSY

Mike Cussen

Tue, 14 Jan 97 11:37 EST

42 lines

New Thread

ASSY : Ionic Contamination on FR2

Re: ASSY : Ionic Contamination on FR2

John Barton

Fri, 24 Jan 1997 12:36:39 +0000 (WET)

91 lines

Re: ASSY : Ionic Contamination on FR2

John Barton

Mon, 20 Jan 1997 10:23:54 +0000 (WET)

64 lines

Re: ASSY : Ionic Contamination on FR2

<>

Sat, 11 Jan 1997 00:20:58 -0500 (EST)

44 lines

RE: ASSY : Ionic Contamination on FR2

<>

Fri, 10 Jan 97 17:25:15 EST

59 lines

ASSY : Ionic Contamination on FR2

John Barton

Fri, 10 Jan 1997 10:14:54 +0000 (WET)

50 lines

New Thread

ASSY : pretinning of fine-pitch devices

Re: ASSY : pretinning of fine-pitch devices

ddhillma

Wed, 15 Jan 97 07:45:45 cst

89 lines

Re: ASSY : pretinning of fine-pitch devices

<>

Wed, 15 Jan 1997 05:51:14 -0500

80 lines

ASSY : pretinning of fine-pitch devices

D. Terstegge

Tue, 14 Jan 1997 21:05:22 +0100

56 lines

New Thread

ASSY: adhesive pads

ASSY: adhesive pads

D. Terstegge

Thu, 16 Jan 1997 20:39:16 +0100

51 lines

New Thread

ASSY: Desiccant Quantity for 15 Year Storage of VMEs

RE: ASSY: Desiccant Quantity for 15 Year Storage of VMEs

DAVY.J.G-

Thu, 16 Jan 1997 17:04:37 -0500

97 lines

ASSY: Desiccant Quantity for 15 Year Storage of VMEs

James W Baker

13 Jan 1997 15:07:47 -0700

85 lines

New Thread

ASSY: Fine Pitch Solder Joint Inspection Method?

RE: ASSY: Fine Pitch Solder Joint Inspection Method?

Jerry Cupples

Tue, 21 Jan 1997 12:43:09 -0600

131 lines

RE: ASSY: Fine Pitch Solder Joint Inspection Method?

Max Bernhardt

Tue, 21 Jan 1997 08:21:00 -0600

175 lines

Re: ASSY: Fine Pitch Solder Joint Inspection Method?

<>

Tue, 14 Jan 1997 23:00:14 -0500 (EST)

40 lines

RE: ASSY: Fine Pitch Solder Joint Inspection Method?

Max Bernhardt

Tue, 14 Jan 1997 07:22:00 -0600

142 lines

Re: ASSY: Fine Pitch Solder Joint Inspection Method?

Pat McGuine

Tue, 14 Jan 1997 07:28:43 -0600

142 lines

ASSY: Fine Pitch Solder Joint Inspection Method?

<>

Mon, 13 Jan 97 18:51:27

90 lines

New Thread

ASSY: Florida Cirtech (WS120 and WS130)

ASSY: Florida Cirtech (WS120 and WS130)

<>

Wed, 29 Jan 1997 14:14:07 -0600

45 lines

New Thread

ASSY: IR Reflow of Thru-Hole Components

Re: ASSY: IR Reflow of Thru-Hole Components

Pratap Singh

Mon, 13 Jan 1997 20:38:50 -0800

244 lines

Re: ASSY: IR Reflow of Thru-Hole Components

DAVY.J.G-

Mon, 13 Jan 1997 10:19:54 -0500

306 lines

Re[2]: ASSY: IR Reflow of Thru-Hole Components

<>

Fri, 10 Jan 1997 10:27:14 -0600

231 lines

Re: ASSY: IR Reflow of Thru-Hole Components

Chris Messner

10 Jan 97 09:13:29 -0500

171 lines

Re: ASSY: IR Reflow of Thru-Hole Components

Bob Willis

10 Jan 97 10:56:31 EST

218 lines

Re: ASSY: IR Reflow of Thru-Hole Components

Pratap Singh

Thu, 09 Jan 1997 19:56:01 -0800

164 lines

ASSY: IR Reflow of Thru-Hole Components

Thad McMillan

9 Jan 97 17:11 CST

126 lines

New Thread

ASSY: J-STD-001 vs. IPC-A-610

Re[2]: ASSY: J-STD-001 vs. IPC-A-610

<>

Fri, 10 Jan 97 14:36:55

81 lines

Re: ASSY: J-STD-001 vs. IPC-A-610

George Franck Jr

Fri, 10 Jan 1997 13:48:04 -0500

133 lines

ASSY: J-STD-001 vs. IPC-A-610

Jim Marsico 516-595-5879

Fri, 10 Jan 1997 10:19:00 -0500 (EST)

65 lines

New Thread

ASSY: Jumpers and cuts

RE: ASSY: Jumpers and cuts

MTTC

Thu, 16 Jan 1997 14:33:38 -0800 (PST)

70 lines

RE: ASSY: Jumpers and cuts

Jan Satterfield

Thu, 16 Jan 97 14:36

78 lines

ASSY: Jumpers and cuts

MTTC

Thu, 16 Jan 1997 09:30:35 -0800 (PST)

54 lines

New Thread

ASSY: Low Tin Level in Wave Solder

Re: ASSY: Low Tin Level in Wave Solder

<>

Tue, 07 Jan 97 09:06:41 EST

149 lines

Re: ASSY: Low Tin Level in Wave Solder

Paul Gould

Sun, 5 Jan 1997 13:24:17 +0000

40 lines

Re: ASSY: Low Tin Level in Wave Solder

<>

Sat, 4 Jan 1997 14:15:00 -0500

80 lines

Re: ASSY: Low Tin Level in Wave Solder

Aric Parr

03 Jan 97 16:32:11 -0500

135 lines

Re: ASSY: Low Tin Level in Wave Solder

rmosebar

Fri, 03 Jan 97 14:27:34 PST

129 lines

re:ASSY: Low Tin Level in Wave Solder

<>

Friday, 3 January 1997 5:08pm ET

130 lines

RE:ASSY: Low Tin Level in Wave Solder

DAVY.J.G-

Fri, 3 Jan 1997 16:37:37 -0500

99 lines

Re: ASSY: Low Tin Level in Wave Solder

ddhillma

Fri, 03 Jan 97 14:56:51 cst

134 lines

Re: ASSY: Low Tin Level in Wave Solder

Jerry Cupples

Fri, 3 Jan 1997 15:05:33 -0600

76 lines

ASSY: Low Tin Level in Wave Solder

<>

Fri, 03 Jan 97 08:41:11

92 lines

New Thread

ASSY: Manix Component Counter (or similar)

ASSY: Manix Component Counter (or similar)

<>

Fri, 24 Jan 1997 17:07:32 -0600

66 lines

ASSY: Manix Component Counter (or similar)

<>

Fri, 24 Jan 1997 11:58:47 -0600

52 lines

New Thread

ASSY: Manix Mfg Component Counter (or similar)

ASSY: Manix Mfg Component Counter (or similar)

<>

Tue, 28 Jan 1997 10:24:39 -0600

56 lines

New Thread

ASSY: Moire Interferometry

Re: ASSY: Moire Interferometry

Phil Yates

Tue, 21 Jan 1997 08:48:49 -0600

70 lines

ASSY: Moire Interferometry

Randy Reed

Mon, 20 Jan 97 13:37:25 PST

42 lines

New Thread

ASSY: MTBF for Components, relating to ESD

ASSY: MTBF for Components, relating to ESD

<>

Thu, 2 Jan 1997 11:18:22 -0600

56 lines

New Thread

ASSY: OSP coatings

Re[2]: ASSY: OSP coatings

BrianWada

Wed, 15 Jan 97 17:46:12 PST

172 lines

RE: ASSY: OSP coatings

Michael Barmuta

Tue, 14 Jan 1997 15:41:55 -0800

150 lines

RE: ASSY: OSP coatings

Ng-CSN007 Shirley

14 Jan 1997 08:46:58 U

108 lines

Re: ASSY: OSP coatings

<>

Mon, 13 Jan 1997 11:43:24 -0600

93 lines

ASSY: OSP coatings

<>

Mon, 13 Jan 97 18:38:29

54 lines

New Thread

ASSY: Pre-tinning of Gold Leads

Re[2]: ASSY: Pre-tinning of Gold Leads

ddhillma

Wed, 15 Jan 97 11:54:39 cst

124 lines

RE: ASSY: Pre-tinning of Gold Leads

Gary Peterson

Wed, 15 Jan 1997 10:41:42 -0700

56 lines

RE: ASSY: Pre-tinning of Gold Leads

Max Bernhardt

Wed, 15 Jan 1997 07:33:00 -0600

93 lines

Re: ASSY: Pre-tinning of Gold Leads

ddhillma

Wed, 15 Jan 97 07:23:46 cst

100 lines

ASSY: Pre-tinning of Gold Leads

Rajan, Sanjay

Tue, 14 Jan 97 14:45:00 EST

54 lines

New Thread

Assy: Press Fit

Assy: Press Fit

Gary Peterson

Fri, 17 Jan 1997 11:04:49 -0700

66 lines

Assy: Press Fit

Yuen, Mike

Fri, 17 Jan 97 10:16:00 CST

40 lines

New Thread

assy: Press In

assy: Press In

<>

Thu, 23 Jan 97 19:36:33 PST

46 lines

New Thread

Assy: Rigid Flex

Re: Assy: Rigid Flex

<>

Fri, 24 Jan 97 08:12:20 EST

76 lines

Assy: Rigid Flex

Marshall Andrews

Thu, 23 Jan 1997 14:18:12 -0600

46 lines

New Thread

ASSY: Solder Paste Process Control

ASSY: Solder Paste Process Control

Jack Crawford

Wed, 22 Jan 1997 09:00:30 -0500

56 lines

New Thread

Assy: Solder Skip

Re: Assy: Solder Skip

ddhillma

Thu, 16 Jan 97 13:13:25 cst

78 lines

Re: Assy: Solder Skip

Aric Parr

16 Jan 97 11:01:28 -0500

84 lines

Assy: Solder Skip

Poh Kong Hui

Thu, 16 Jan 1997 21:01:25 +0800

49 lines

New Thread

ASSY: thermocouple adhesive

RE: ASSY: thermocouple adhesive

Chilcote, Jim (AZ75)

10 Jan 1997 16:38:41 -0600

70 lines

Re[2]: ASSY: thermocouple adhesive

Allen Hertz

Fri, 10 Jan 1997 14:17:42 -0500 (EST)

83 lines

RE: ASSY: thermocouple adhesive

John Guy

Fri, 10 Jan 1997 13:48:24 -0500

72 lines

Re: ASSY: thermocouple adhesive

Bob Willis

10 Jan 97 10:53:06 EST

43 lines

Re: ASSY: thermocouple adhesive

<>

Fri, 10 Jan 1997 09:19:50 -0500

66 lines

ASSY: thermocouple adhesive

Foster, Donald C.

Thu, 09 Jan 97 12:32:00 MST

43 lines

New Thread

ASSY: TSOP with Alloy 42 lead frame field failures

Re: ASSY: TSOP with Alloy 42 lead frame field failures

<>

Wed, 8 Jan 1997 21:14:57 -0500 (EST)

83 lines

Re: ASSY: TSOP with Alloy 42 lead frame field failures

Ulrich Korndoerfer

Thu, 09 Jan 1997 00:16:37 +0100

61 lines

RE: ASSY: TSOP with Alloy 42 lead frame field failures

<>

Mon, 6 Jan 1997 19:11:45 -0500

69 lines

New Thread

ASSY: TSOP/PLCC reliability

Re: ASSY: TSOP/PLCC reliability

<>

Wed, 15 Jan 1997 13:49:42 -0500 (EST)

60 lines

New Thread

ASSY:J-STD-001 vs. IPC-A-610

Re: ASSY:J-STD-001 vs. IPC-A-610

MTTC

Mon, 13 Jan 1997 08:30:23 -0800 (PST)

86 lines

New Thread

ASSY:Mil-std 55110??

RE: ASSY:Mil-std 55110??

Jim Marsico 516-595-5879

Mon, 27 Jan 1997 11:28:00 -0500 (EST)

62 lines

Re: ASSY:Mil-std 55110??

Douglas Sandvick

Fri, 24 Jan 1997 14:39:28 -0600 (CST)

81 lines

ASSY:Mil-std 55110??

Jeffery L. Hempton

Fri, 24 Jan 1997 14:22:36 -0500

52 lines

New Thread

ASSY:solder paste qual

ASSY:solder paste qual

Jeffery L. Hempton

Fri, 17 Jan 1997 14:51:41 -0500

52 lines

New Thread

Assy:TopLine

Re: Assy:TopLine

Tom Cooper

Fri, 24 Jan 97 09:16:42 EST

63 lines

Re: Assy:TopLine

Edward J. Valentine

Fri, 24 Jan 1997 08:26:48 -0800

64 lines

Re[2]: Assy:TopLine

ddhillma

Fri, 24 Jan 97 05:17:12 cst

84 lines

Re[2]: Assy:TopLine

Chris Messner

24 Jan 97 06:01:52 -0500

89 lines

Re: Assy:TopLine

Alan Hilton

Thu, 23 Jan 1997 18:10:05 PST

57 lines

Re: Assy:TopLine

<>

Thu, 23 Jan 97 19:22:27 CST

68 lines

Re: Assy:TopLine

<>

Thu, 23 Jan 97 14:52:38

82 lines

Re: Assy:TopLine

ddhillma

Thu, 23 Jan 97 12:37:24 cst

79 lines

Assy:TopLine

<>

Thu, 23 Jan 1997 11:24:19 -0600

46 lines

New Thread

AW: Re: dielectrics for dif materials

AW: Re: dielectrics for dif materials

Huschka, Manfred

Fri, 24 Jan 1997 13:40:00 -0700

147 lines

New Thread

backfilling holes at press

backfilling holes at press

Marc Strickland

Sat, 11 Jan 1997 03:23:24 -0500

52 lines

New Thread

BGA :ASSY/REWORK

BGA :ASSY/REWORK

jon johnson

Thu, 16 Jan 1997 15:41:17 -0500

50 lines

Re: BGA :ASSY/REWORK

LWFERGUS

Wed, 15 Jan 97 16:12:06 CST

83 lines

BGA :ASSY/REWORK

<>

Tue, 14 Jan 1997 11:07:46 -0500 (EST)

54 lines

New Thread

BGA's machines

BGA's machines

Antoni Cherta

Wed, 15 Jan 1997 15:08:25 +0100

65 lines

New Thread

blanks boards

blanks boards

Mike Cussen

Thu, 9 Jan 97 15:23 EST

43 lines

New Thread

Breakaway holes

Breakaway holes

<>

Mon, 20 Jan 1997 13:30:52 -0800

60 lines

New Thread

Breakaway holes and V-groove scoring

RE: Breakaway holes and V-groove scoring

Glenn Heath

Mon, 20 Jan 1997 16:12:25 -0800 (PST)

61 lines

New Thread

Buried Capacitance / Resistance

Re: Buried Capacitance / Resistance

jyoung

Tue, 28 Jan 97 18:06:08 PST

70 lines

Re: Buried Capacitance / Resistance

DENNY PULVINO

Mon, 27 Jan 97 16:16:03 PST

63 lines

Buried Capacitance / Resistance

<>

Mon, 27 Jan 1997 15:24:53 -0600 (CST)

40 lines

New Thread

Call for Speakers in London

Call for Speakers in London

Bob Willis

29 Jan 97 06:18:22 EST

87 lines

New Thread

Can somebody give me some advice?

Re: Can somebody give me some advice?

jseeger

Mon, 06 Jan 1997 14:18:29 -0500

72 lines

Can somebody give me some advice?

<>

Mon, 06 Jan 97 07:26:49

99 lines

New Thread

CIMS

CIMS

cctc

Mon, 6 Jan 1997 13:40:22 +0800

53 lines

New Thread

Circo Flex

Circo Flex

John Gibson

Sat, 18 Jan 1997 12:25:09 -0800

46 lines

New Thread

cleaners for RMA flux

Re: cleaners for RMA flux

Luis Rivera

Wed, 15 Jan 1997 08:55:35 +600 CDT

99 lines

Re: cleaners for RMA flux

<>

Tue, 14 Jan 1997 16:00:32 -0500 (EST)

96 lines

RE: cleaners for RMA flux

Jan Satterfield

Tue, 14 Jan 97 8:36

69 lines

RE: cleaners for RMA flux

<>

Tue, 14 Jan 97 10:22:47 EST

107 lines

cleaners for RMA flux

Yakov Steinberg

Tue, 14 Jan 1997 10:52:21 +0200 (IST)

42 lines

New Thread

Compressors

Re: Compressors

Jerry Cupples

Thu, 16 Jan 1997 16:29:35 -0600

109 lines

Compressors

Scott C Prentice KE3UM

Thu, 16 Jan 1997 13:10:24 -0500

55 lines

New Thread

Conductive foam

re: Conductive foam

Yuen, Mike

Fri, 24 Jan 97 08:59:00 CST

102 lines

Re: Conductive foam

<>

Fri, 24 Jan 97 08:20:58 PST

66 lines

re: Conductive foam

<>

Thu, 23 Jan 97 15:03:40 EST

86 lines

re: Conductive foam

<>

Thu, 23 Jan 97 14:20:41 EST

84 lines

Conductive foam

Paul Reynolds

Thu, 23 Jan 1997 12:05:00 -0600

49 lines

New Thread

conformal coating help

Re[2]: conformal coating help

Aric Parr

22 Jan 97 16:37:21 -0500

89 lines

Re: conformal coating help

<>

Wed, 22 Jan 1997 07:42:39 -0500 (EST)

54 lines

Re: conformal coating help

Lynch, Lyn

Tue, 21 Jan 97 10:50:54

50 lines

RE: Conformal Coating Help

Karl Ring

Tue, 21 Jan 1997 12:11:45 -0500

45 lines

Re: conformal coating help

Paul Stolar

Tue, 21 Jan 97 09:56:12 CDT

67 lines

conformal coating help

<>

Tue, 21 Jan 1997 09:39:41 -0500 (EST)

38 lines

New Thread

Conformal Coating Suppli

Re: Conformal Coating Suppli

Greg Bartlett

31 Jan 1997 10:27:06 -0500

98 lines

New Thread

Conformal Coating Supplier

Conformal Coating Supplier

<>

Fri, 31 Jan 97 08:22:53 est

41 lines

New Thread

conformal coating vendor request

Re[2]: conformal coating vendor request

Aric Parr

31 Jan 97 08:46:41 -0500

77 lines

Re:conformal coating vendor request

<>

Thu, 30 Jan 1997 15:23:52 -0500 (EST)

43 lines

New Thread

Connector placement

Re: Connector placement

<>

Fri, 24 Jan 1997 17:07:52 -0500 (EST)

42 lines

Re: Connector placement

MR JIM R ZANOLLI

Fri, 24 Jan 1997 08:39:54, -0500

44 lines

New Thread

Contact pads

Re: Contact pads

David Bergman

Tue, 28 Jan 1997 12:55:47 -0600 (CST)

73 lines

New Thread

controlled Impedance

Re: controlled Impedance

Andy Burkhardt

Sun, 26 Jan 1997 12:39:45 GMT

82 lines

controlled Impedance

Kyle Gulley

Thu, 23 Jan 97 09:23:40 PST

50 lines

Re[2]: Controlled Impedance

Max Harris

Mon, 6 Jan 1997 08:39:57 -0500

63 lines

Re: Controlled Impedance

Alan Hilton

Fri, 3 Jan 1997 18:49:21 PST

66 lines

Controlled Impedance

Max.P.Harris

Fri, 03 Jan 1997 10:11:30 -0800

51 lines

New Thread

controlled impedance p.c.b's

Re: controlled impedance p.c.b's

jbrunett

Tue, 07 Jan 97 01:08:02 PST

65 lines

controlled impedance p.c.b's

Steve Sekanina

Mon, 6 Jan 1997 13:10:09 +0000

46 lines

New Thread

convection rates

Re: convection rates

Hollandsworth, Ron

Fri, 31 Jan 97 16:29:47 EST

64 lines

Re: convection rates

Rex Breunsbach

31 Jan 1997 15:13:08 -0800

57 lines

RE: convection rates

John Guy

Fri, 31 Jan 1997 13:05:11 -0500

61 lines

convection rates

<>

Thu, 30 Jan 97 08:40:29 CST

39 lines

New Thread

Copper

Re: Copper

<>

Wed, 8 Jan 1997 09:19:15 -0500 (EST)

38 lines

RE: Copper

Karl Ring

Wed, 8 Jan 1997 08:05:19 -0500

48 lines

New Thread

Copper scopping in solder

Copper scopping in solder

tonghh

Fri, 31 Jan 1997 20:44:51 +0800

49 lines

New Thread

Creep Rupture testing on BGA

Creep Rupture testing on BGA

OBRIEN GERARD

Wed, 22 Jan 97 10:26:00 -0500

42 lines

New Thread

current carrying capacity

Re: current carrying capacity

Bill Gaines B160 x2199

Wed, 29 Jan 97 15:05:27 PST

56 lines

current carrying capacity

Dan Lorinser

Tue, 28 Jan 1997 09:39:48 -0600

57 lines

New Thread

current in screened silver circuits

Re: current in screened silver circuits

Ralph Hersey

Wed, 29 Jan 1997 10:03:17 -0800

109 lines

Re: current in screened silver circuits

Don Vischulis

Tue, 28 Jan 1997 22:11:35 -0600

137 lines

Re: current in screened silver circuits

Ralph Hersey

Mon, 27 Jan 1997 15:49:07 -0800

114 lines

current in screened silver circuits

<>

Fri, 24 Jan 1997 12:37:11 -0800

45 lines

New Thread

defect ppm data

defect ppm data

Dominick Cizek

Thu, 23 Jan 1997 11:03:20 -0500

37 lines

New Thread

Depanelising Ceramic Substrate

Depanelising Ceramic Substrate

aposeiko

Fri, 17 Jan 1997 15:00:01 -0800

45 lines

New Thread

DES- Gerber formats?

Re: DES- Gerber formats?

Kevin Seaman

Fri, 10 Jan 97 08:05:05 PST

56 lines

New Thread

DES/FAB:switchpad contacts

Re[2]: DES/FAB:switchpad contacts

ddhillma

Mon, 27 Jan 97 16:50:18 cst

133 lines

DES/FAB:switchpad contacts

72030,3271

24 Jan 97 10:35:31 EST

53 lines

New Thread

DES: Ag polmer via holes

DES: Ag polmer via holes

Lee Dunford

Thu, 9 Jan 1997 16:38:12 GMT

63 lines

New Thread

DES: Ag polmer via holes - contact

Re: DES: Ag polmer via holes - contact

Lee Dunford

Thu, 9 Jan 1997 17:21:30 GMT

71 lines

New Thread

DES: Heat Rise Calculations For Flex Part II

DES: Heat Rise Calculations For Flex Part II

Magee, Andrew P

Wed, 22 Jan 1997 11:27:00 -0800

80 lines

New Thread

DES: Internodal Capacitance & Inductance

DES: Internodal Capacitance & Inductance

David Anderson

Thu, 09 Jan 1997 16:00:30 -0600

49 lines

New Thread

DES: package style ?

Re: DES: package style ?

jseeger

Thu, 09 Jan 1997 12:00:08 -0500

67 lines

New Thread

Des: temp rise (current)

Des: temp rise (current)

Andrew P Magee

Wed, 29 Jan 1997 14:56:00 -0800

99 lines

New Thread

DES: trace layout

Re: DES: trace layout

Ralph Hersey

Tue, 28 Jan 1997 02:13:35 -0800

264 lines

Re: DES: trace layout

jseeger

Tue, 14 Jan 1997 11:51:01 -0500

74 lines

Re: DES: trace layout

Doug McKean

Tue, 14 Jan 1997 09:59:21 -0500

74 lines

DES: trace layout

Bilal Khalaf

Mon, 13 Jan 97 13:26:00 PST

42 lines

New Thread

Design issues (current carrying variables)

RE: Design issues (current carrying variables)

Jeff Neisess

Fri, 17 Jan 1997 10:43:08 GMT-0500

81 lines

RE: Design issues (current carrying variables)

Mitch Morey

Thu, 16 Jan 1997 15:22:22 -0800

48 lines

RE: Design issues (current carrying variables)

Mitch Morey

Thu, 16 Jan 1997 15:22:22 -0800

48 lines

New Thread

Design Standards for BGA

RE: Design Standards for BGA

Ng-CSN007 Shirley

17 Jan 1997 18:58:46 U

145 lines

Re: Design Standards for BGA

David Bergman

Thu, 16 Jan 1997 12:02:51 -0600 (CST)

89 lines

Re: Design Standards for BGA

<>

Thu, 16 Jan 1997 00:50:09 -0500 (EST)

62 lines

RE: Design Standards for BGA

Foster, Donald C.

Tue, 14 Jan 97 14:14:00 MST

49 lines

Re: Design Standards for BGA

<>

Tue, 14 Jan 97 11:30:44 PST

126 lines

Design Standards for BGA

Ian Wylie

Tue, 14 Jan 1997 14:55:12 GMT

54 lines

New Thread

Dielectric Constant of FR-4 and Getek

Re: Dielectric Constant of FR-4 and Getek

<>

Thu, 23 Jan 97 11:36:21 PST

46 lines

New Thread

dielectrics for dif materials

Re: dielectrics for dif materials

Andrew P Magee

Thu, 23 Jan 1997 07:41:00 -0800

124 lines

Re: dielectrics for dif materials

No Name

Wed, 22 Jan 1997 20:43:27 -0600 (CST)

82 lines

dielectrics for dif materials

Armando Saldana

Wed, 22 Jan 1997 14:37:05 +0000

61 lines

New Thread

Direct metallization

Re: Direct metallization

Motoyo Wajima

Tue, 07 Jan 1997 12:36:10 +0900

77 lines

New Thread

Direct metallization for MIL grade PCBs.

Re: Direct metallization for MIL grade PCBs.

ddsulliv

Wed, 15 Jan 97 15:26:11 cst

160 lines

Direct metallization for MIL grade PCBs.

<>

15 Jan 97 20:52 GMT+0500

47 lines

New Thread

direct plating

direct plating

Eltek Ltd. - Process Engineering

Thu, 16 Jan 1997 13:13:24 +0200 (IST)

49 lines

New Thread

Dispenser for solder preforms

Dispenser for solder preforms

Dominick Cizek

Thu, 23 Jan 1997 10:47:23 -0500

36 lines

New Thread

DOC:IEC Component value code

Re: DOC:IEC Component value code

Max Bernhardt

Mon, 27 Jan 1997 06:30:00 -0600

77 lines

Re: DOC:IEC Component value code

Jack Ray

Fri, 24 Jan 1997 20:27:06 -0500

51 lines

Re: DOC:IEC Component value code

Max Bernhardt

Fri, 24 Jan 1997 07:37:00 -0600

338 lines

Re: DOC:IEC Component value code

Max Bernhardt

Thu, 23 Jan 1997 08:58:00 -0600

311 lines

Re: DOC:IEC Component value code

<>

Wed, 22 Jan 97 20:38:20

185 lines

DOC:IEC Component value code

<>

Wed, 22 Jan 1997 13:31:59 -0500 (EST)

42 lines

New Thread

DRILL SPINDLE RUNOUT

DRILL SPINDLE RUNOUT

<>

Fri, 17 Jan 1997 05:09:49 EST

59 lines

Drill Spindle Runout

William Johnson

Thu, 16 Jan 97 22:19:53 UT

38 lines

New Thread

Dry Film Solder Mask

Re: Dry Film Solder Mask

<>

Tue, 14 Jan 1997 00:45:48 -0500 (EST)

70 lines

Dry Film Solder Mask

<>

Mon, 13 Jan 97 10:04:05 EST

44 lines

New Thread

Dry Film Soldermask

Re[2]: Dry Film Soldermask

sbryan

Mon, 13 Jan 97 17:11:43 PST

65 lines

RE: Dry Film Soldermask

<>

Mon, 13 Jan 97 14:15:31 EST

41 lines

New Thread

dynamic spindle runout

dynamic spindle runout

William Johnson

Wed, 22 Jan 97 20:40:48 UT

37 lines

New Thread

E-Mail addresses

Re[2]: E-Mail addresses

<>

Wed, 22 Jan 97 09:47:31

104 lines

Re: E-Mail addresses

David Bergman

Wed, 22 Jan 1997 10:20:15 -0600 (CST)

128 lines

Re: E-Mail addresses

Kerry Grimes

Tue, 21 Jan 1997 18:32:03 -0800

115 lines

Re: E-Mail addresses

<>

Tue, 21 Jan 97 16:30:44

68 lines

Re: E-Mail addresses

Lynch, Lyn

Tue, 21 Jan 97 14:06:28

66 lines

E-Mail addresses

<>

Tue, 21 Jan 97 18:57:53 +0100

45 lines

New Thread

Edmund Scientific Catalog

Re: Edmund Scientific Catalog

Chris Stack

Mon, 20 Jan 1997 13:28:40 -0500

94 lines

Edmund Scientific Catalog

Chris Stack

Mon, 20 Jan 1997 09:55:00 -0500

76 lines

New Thread

Effects of temp on growth rate of tin oxide and Cu-Sn IM

Re: Effects of temp on growth rate of tin oxide and Cu-Sn IM

ddhillma

Fri, 17 Jan 97 18:00:02 cst

169 lines

New Thread

Effects of temp on growth rate of tin oxide and Cu-Sn IMC

Effects of temp on growth rate of tin oxide and Cu-Sn IMC

DAVY.J.G-

Fri, 17 Jan 1997 17:00:01 -0500

124 lines

New Thread

Employment

Employment

<>

Sat, 1 Feb 1997 11:39:21 -0500 (EST)

47 lines

New Thread

Entek Plus Cu-106A

Re: Entek Plus Cu-106A

<>

Fri, 10 Jan 97 09:21:57

143 lines

Re: Entek Plus Cu-106A

<>

Fri, 10 Jan 97 08:29:31 MDT

99 lines

Entek Plus Cu-106A

cjlong

Fri, 10 Jan 1997 15:13:41 +0800

53 lines

New Thread

epoxy screening 0603's

Re: epoxy screening 0603's

<>

Mon, 06 Jan 97 16:47:25

103 lines

epoxy screening 0603's

MIKE J. LOPEZ

Mon, 06 Jan 1997 16:32:25 -0500

37 lines

New Thread

epoxy vs. solder paste

Re:epoxy vs. solder paste

Guenter Grossmann

Tue, 7 Jan 1997 11:07:39 +0100

95 lines

epoxy vs. solder paste

Seth Tompkins

Mon, 06 Jan 1997 10:15:15 -0800

55 lines

New Thread

Exposed circuits

Re: Exposed circuits

Michael Barmuta

Fri, 3 Jan 1997 08:55:45 -0800

95 lines

re: Exposed circuits

James Kenny

Fri, 3 Jan 97 6:38:46 PST

86 lines

Re: Exposed circuits

Paul Gould

Fri, 3 Jan 1997 09:34:34 +0000

64 lines

Exposed circuits

Todd Rogers

Thu, 2 Jan 1997 16:36:22 -0600

50 lines

New Thread

Exposed circuits -Reply

Exposed circuits -Reply

Bob Poirier

Fri, 03 Jan 1997 08:15:01 -0800

70 lines

New Thread

FAB

FAB

Hemstad, Jon (MN51)

27 Jan 1997 10:22:37 -0600

57 lines

re: Fab

<>

Sun, 26 Jan 1997 21:57:06 -0500 (EST)

60 lines

RE: FAB

Gagnon, Gerry

Fri, 17 Jan 1997 09:36:24 -0500

72 lines

Re: FAB

John Laur

Fri, 17 Jan 1997 07:24:49 -0600

92 lines

FAB

Ron Oneal

Thu, 16 Jan 1997 16:22:58 -0500

51 lines

Fab

Otto Jespersen

Tue, 14 Jan 1997 07:53:06 -0500

46 lines

New Thread

FAB - Defective units on panelized PWBs

Re: FAB - Defective units on panelized PWBs

Don Vischulis

Thu, 30 Jan 1997 20:47:50 -0600

92 lines

Re: FAB - Defective units on panelized PWBs

Neil Maloney

Thu, 30 Jan 1997 07:45:32 -0600 (CST)

96 lines

FAB - Defective units on panelized PWBs

<>

29 Jan 97 13:41:10 -0500

57 lines

New Thread

FAB - Matte masks

Re: FAB - Matte masks

<>

Tue, 28 Jan 1997 13:41:14 -0500 (EST)

38 lines

New Thread

FAB -Reply

FAB -Reply

Bob Metcalf

Mon, 27 Jan 1997 17:35:46 -0800

66 lines

FAB -Reply

Dan Lorinser

Fri, 17 Jan 1997 10:37:59 -0600

67 lines

New Thread

FAB Clear LPI

FAB Clear LPI

Bob Metcalf

Sat, 25 Jan 1997 10:22:24 -0800

47 lines

New Thread

fab SM questions

Re: fab SM questions

<>

Thu, 23 Jan 1997 23:34:28 -0500 (EST)

44 lines

Re: fab SM questions

Jerry Cupples

Sat, 18 Jan 1997 13:24:31 -0600

126 lines

New Thread

FAB-Dish downs in copper circuits

Re[3]: FAB-Dish downs in copper circuits

ddsulliv

Tue, 28 Jan 97 12:00:10 cst

102 lines

RE: FAB-Dish downs in copper circuits

Murray, George @ GSC

Mon, 27 Jan 97 17:51:00 PST

89 lines

Re: FAB-Dish downs in copper circuits

<>

Mon, 27 Jan 97 12:24:35 PST8

92 lines

FAB-Dish downs in copper circuits

<>

Mon, 27 Jan 1997 10:24:07 -0500

57 lines

New Thread

FAB:

Re: FAB:

Eltek Ltd. - Process Engineering

Tue, 28 Jan 1997 06:45:37 +0200 (IST)

90 lines

FAB:

Ian Wylie

Fri, 24 Jan 1997 08:29:28 GMT

85 lines

FAB:

David Bergman

Thu, 23 Jan 1997 15:53:04 -0600 (CST)

65 lines

New Thread

FAB: Carbon Ink vs. Gold Contact Fingers

Re: FAB: Carbon Ink vs. Gold Contact Fingers

<>

Wed, 29 Jan 1997 11:35:47 -0500 (EST)

41 lines

FAB: Carbon Ink vs. Gold Contact Fingers

<>

Tue, 28 Jan 97 12:51:56 -0800

57 lines

New Thread

FAB: Ceramic Alternative

FAB: Ceramic Alternative

John Parsons

Mon, 13 Jan 1997 10:22:52 -0800

59 lines

New Thread

FAB: Clean before solder mask

Re: FAB: Clean before solder mask

John E Nelson

Tue, 7 Jan 1997 21:09:33 PST

51 lines

FAB: Clean before solder mask

Nashua Circuits

Tue, 07 Jan 1997 09:00:01 -0500

51 lines

New Thread

FAB: Clear LPISM

Re: FAB: Clear LPISM

sbryan

Fri, 24 Jan 97 05:47:08 PST

75 lines

FAB: Clear LPISM

John Gordon

Thu, 23 Jan 1997 11:31:02 -0800

48 lines

New Thread

FAB: Core Filling

Re: FAB: Core Filling

Doug Jeffery

Fri, 24 Jan 1997 03:20:45 -0800

184 lines

New Thread

FAB: CU/Invar/Cu suppliers

FAB: CU/Invar/Cu suppliers

George Franck Jr

Tue, 21 Jan 1997 11:37:41 -0500

71 lines

New Thread

FAB: CU/Invar/Cu suppliers -Reply

Re: FAB: CU/Invar/Cu suppliers -Reply

<>

Tue, 21 Jan 1997 21:39:07 -0500 (EST)

36 lines

FAB: CU/Invar/Cu suppliers -Reply

Dan Lorinser

Tue, 21 Jan 1997 12:42:32 -0600

91 lines

New Thread

FAB: Cupric chloride regeneration with sodium chlorate

RE: FAB: Cupric chloride regeneration with sodium chlorate

Edwards, Ted A (AZ75)

28 Jan 1997 17:18:38 -0600

123 lines

FAB: Cupric chloride regeneration with sodium chlorate

Ted Stern

Wed, 22 Jan 1997 12:07:21 -0800

56 lines

New Thread

FAB: Deburr

FAB: Deburr

<>

Mon, 27 Jan 1997 10:49:29 -0600

44 lines

New Thread

Fab: Drill Entry Questions

Fab: Drill Entry Questions

<>

Wed, 15 Jan 1997 13:25:00 -0500 (EST)

71 lines

New Thread

FAB: Electrolytic plating propogation rate testers

Re: FAB: Electrolytic plating propogation rate testers

<>

Tue, 14 Jan 1997 23:57:23 -0500 (EST)

98 lines

FAB: Electrolytic plating propogation rate testers

dhoppe

Tue, 14 Jan 97 09:49:52 PST

33 lines

New Thread

FAB: Embedded High Density

FAB: Embedded High Density

<>

Sun, 5 Jan 1997 11:06:40 -0500

65 lines

New Thread

FAB: exposed copper?

FAB: exposed copper?

Dave Pizzoferrato

Tue, 28 Jan 1997 08:10:49 -0700

71 lines

New Thread

Fab: Extended Material Cure Cycles

Re: Fab: Extended Material Cure Cycles

D. Rooke

Thu, 2 Jan 1997 13:03:38 -0500 (EST)

79 lines

Fab: Extended Material Cure Cycles

D. Van Iderstine - Engineering Mgr.

Thu, 2 Jan 1997 08:21:08 -0800

59 lines

New Thread

Fab: Finish LPI thickness on circuits

Re: Fab: Finish LPI thickness on circuits

<>

Fri, 24 Jan 1997 00:24:20 -0500 (EST)

84 lines

Re: Fab: Finish LPI thickness on circuits

<>

Sat, 18 Jan 1997 17:16:07 -0500 (EST)

53 lines

Re: Fab: Finish LPI thickness on circuits

Timothy Gaylor

Sat, 18 Jan 1997 11:05:47 -0500

76 lines

Re: Fab: Finish LPI thickness on circuits

<>

Sat, 18 Jan 1997 09:02:38 -0500 (EST)

40 lines

Re: Fab: Finish LPI thickness on circuits

sbryan

Fri, 17 Jan 97 15:37:04 PST

58 lines

Re: Fab: Finish LPI thickness on circuits

<>

Fri, 17 Jan 1997 17:18:10 -0500 (EST)

33 lines

Fab: Finish LPI thickness on circuits

sam mccorkel

Fri, 17 Jan 1997 15:25:01 -0500

41 lines

New Thread

FAB: Hole filling

FAB: Hole filling

Paul Gould

Fri, 24 Jan 1997 17:10:38 +0000

90 lines

New Thread

FAB: Horizontal versus vertical etching

Re: FAB: Horizontal versus vertical etching

George Franck Jr

Wed, 29 Jan 1997 12:34:07 -0500

67 lines

Re: FAB: Horizontal versus vertical etching

gwilling

Wed, 29 Jan 97 16:51:19 PST

101 lines

Re[2]: FAB: Horizontal versus vertical etching

ddsulliv

Wed, 29 Jan 97 18:01:26 cst

178 lines

Re: FAB: Horizontal versus vertical etching

gwilling

Wed, 29 Jan 97 09:20:45 PST

100 lines

FAB: Horizontal versus vertical etching

Luis Rivera

Tue, 28 Jan 1997 14:51:13 +600 CDT

60 lines

New Thread

FAB: Immersion tin coating

Re: FAB: Immersion tin coating

DAVY.J.G-

Thu, 16 Jan 1997 14:58:19 -0500

63 lines

New Thread

fab: immersion tin coatings

Re: fab: immersion tin coatings

Yisrael Leshman

Mon, 20 Jan 1997 12:01:02 -0800

58 lines

Re: fab: immersion tin coatings

<>

Thu, 16 Jan 1997 19:42:19 -0500 (EST)

45 lines

Re: fab: immersion tin coatings

Jim Reed

Thu, 16 Jan 1997 16:46:40 -0800

116 lines

Re: fab: immersion tin coatings

Pratap Singh

Thu, 16 Jan 1997 11:35:02 -0800

69 lines

fab: immersion tin coatings

sam mccorkel

Thu, 16 Jan 1997 09:30:24 -0500

43 lines

New Thread

FAB: IPC Printed Circuits Expo

Re[2]: FAB: IPC Printed Circuits Expo

<>

Mon, 20 Jan 1997 11:43:10 -0500

101 lines

Re: FAB: IPC Printed Circuits Expo

George Franck Jr

Mon, 20 Jan 1997 10:09:16 -0500

83 lines

Re: FAB: IPC Printed Circuits Expo

<>

Mon, 20 Jan 1997 07:59:36 -0500 (EST)

36 lines

FAB: IPC Printed Circuits Expo

Mike Buetow

Tue, 14 Jan 1997 09:18:59 -0600 (CST)

70 lines

New Thread

FAB: Panelization Software

FAB: Panelization Software

John Parsons

Fri, 10 Jan 1997 14:18:29 -0800

54 lines

New Thread

FAB: Plating distribution/ATE/AOI

FAB: Plating distribution/ATE/AOI

Paul Gould

Mon, 6 Jan 1997 20:24:33 +0000

95 lines

New Thread

FAB: prepreg fill

Re: FAB: prepreg fill

George Franck Jr

Fri, 24 Jan 1997 08:52:05 -0500

145 lines

New Thread

FAB: Rick Taormino; diazo film and LPI solder mask

FAB: Rick Taormino; diazo film and LPI solder mask

<>

Thu, 9 Jan 1997 18:33:04 -0500 (EST)

62 lines

New Thread

FAB: Supplier: Job Opportunities Posting

FAB: Supplier: Job Opportunities Posting

<>

Wed, 22 Jan 1997 18:36:08 -0500 (EST)

73 lines

New Thread

Fab: To Equipment Mfr's & Field Serv Org's

Fab: To Equipment Mfr's & Field Serv Org's

<>

Mon, 13 Jan 1997 11:28:17 -0500 (EST)

46 lines

New Thread

FAB: Woven Kevlar

FAB: Woven Kevlar

Bob McGarry

Fri, 3 Jan 1997 11:26:53 +0000

41 lines

New Thread

FAB:ASS: Solder Balling Resist Trials

FAB:ASS: Solder Balling Resist Trials

Bob Willis

08 Jan 97 13:27:11 EST

96 lines

New Thread

FAB:ASS: Solder Finish Symposium, UK

FAB:ASS: Solder Finish Symposium, UK

Bob Willis

08 Jan 97 13:27:17 EST

87 lines

New Thread

FAB:ASSY: Solder ball free solder resist ??

FAB:ASSY: Solder ball free solder resist ??

Bob Willis

02 Jan 97 03:23:05 EST

63 lines

New Thread

FAB:Cedal ADDARA PRESS LAMINATOR

Re: FAB:Cedal ADDARA PRESS LAMINATOR

Roland Jaquet

Sat, 11 Jan 1997 14:41:26 +0100

71 lines

FAB:Cedal ADDARA PRESS LAMINATOR

chuan

Sat, 11 Jan 1997 16:56:07 +0800

46 lines

New Thread

FAB:cross grain construction

Re: FAB:cross grain construction

Paul Gould

Tue, 21 Jan 1997 18:13:50 +0000

78 lines

Re: FAB:cross grain construction

Tom Ingham

Tue, 21 Jan 1997 17:25:17 -0700

138 lines

Re: FAB:cross grain construction

Robert Welch

Tue, 21 Jan 1997 18:11:32 +0000

83 lines

FAB:cross grain construction

Bob McGarry

Mon, 20 Jan 1997 16:27:05 +0000

61 lines

New Thread

FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING

Re: FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING

=?ISO-8859-1?Q?Thor-Inge_N=E6sset?=

Wed, 1 Jan 1997 04:16:51 +0100

128 lines

New Thread

FAB:Roller swelling

Re: FAB:Roller swelling

<>

Fri, 10 Jan 1997 00:43:57 -0500 (EST)

34 lines

Re: FAB:Roller swelling

ddsulliv

Wed, 08 Jan 97 17:44:56 cst

104 lines

FAB:Roller swelling

DAVID MANDER

Wed, 8 Jan 1997 15:10:52, -0500

45 lines

New Thread

Fabrication

Fabrication

<>

Thu, 16 Jan 97 19:11:09 EST

50 lines

New Thread

Fabrication of Large Printed Circuit Boards

Re: Fabrication of Large Printed Circuit Boards

<>

Fri, 31 Jan 1997 15:33:02 -0500 (EST)

39 lines

RE: Fabrication of Large Printed Circuit Boards

<>

Fri, 31 Jan 97 09:10:55 EST

68 lines

RE: Fabrication of Large Printed Circuit Boards

Bert Ohlig

Fri, 31 Jan 97 11:18:55 UT

58 lines

New Thread

Fabrication of Printed Circuit Boards

RE: Fabrication of Printed Circuit Boards

Thomas, Kevin

Thu, 30 Jan 1997 10:28:00 -0700

71 lines

Fabrication of Printed Circuit Boards

<>

Thu, 30 Jan 1997 11:17:32 EST

115 lines

Re: Fabrication of Printed Circuit Boards

ddsulliv

Thu, 30 Jan 97 08:07:54 cst

103 lines

Re: Fabrication of Printed Circuit Boards

<>

Thu, 30 Jan 97 08:50:36 EST

72 lines

Fabrication of Printed Circuit Boards

<>

Wed, 29 Jan 1997 18:40:04 GMT

47 lines

New Thread

fiducial recognition problems

RE: fiducial recognition problems

Jack Crawford

Mon, 27 Jan 1997 10:50:33 -0500

115 lines

Re: fiducial recognition problems

Paul Gould

Fri, 24 Jan 1997 21:55:27 +0000

80 lines

fiducial recognition problems

<>

23 JAN 97 17:05:10 EST

48 lines

New Thread

Filling clearance holes in thick metal innerlayer planes

Filling clearance holes in thick metal innerlayer planes

Gagnon, Gerry

Fri, 24 Jan 1997 09:51:23 -0500

130 lines

New Thread

final cleaning of pwb's

final cleaning of pwb's

Matt Leary

Fri, 24 Jan 97 12:41:40 -0800

38 lines

New Thread

Flex

Re: Flex

<>

Fri, 03 Jan 97 09:12:52 EST

114 lines

Flex

Timothy Gaylor

Thu, 2 Jan 1997 23:16:54 -0500

51 lines

New Thread

flexible circuit

Re: flexible circuit

John Lopez

Mon, 6 Jan 1997 14:09:41 -0500

54 lines

New Thread

Flexible Soldermask

Re: Flexible Soldermask

<>

Fri, 10 Jan 1997 18:16:38 -0500 (EST)

48 lines

Flexible Soldermask

<>

Fri, 10 Jan 1997 08:13:47 -0500 (EST)

39 lines

New Thread

Floating waste water treatment sludge

Re[2]: Floating waste water treatment sludge

ddsulliv

Wed, 08 Jan 97 17:30:51 cst

174 lines

Re: Floating waste water treatment sludge

<>

Wed, 8 Jan 1997 16:13:54 -0500 (EST)

95 lines

Re: Floating waste water treatment sludge

David Creager

Wed, 8 Jan 1997 07:09:00 -0600

125 lines

Re: Floating waste water treatment sludge

Paul Gould

Tue, 7 Jan 1997 21:25:54 +0000

82 lines

Re: Floating waste water treatment sludge

Bob Mesick

Tue, 7 Jan 1997 07:52:28 -0800 (PST)

55 lines

Re: Floating waste water treatment sludge

<>

Mon, 6 Jan 1997 22:30:51 -0500

71 lines

Floating waste water treatment sludge

<>

Mon, 6 Jan 1997 20:19:30 -0500

48 lines

New Thread

Flying Probe Testers, Another voice heard!

Flying Probe Testers, Another voice heard!

Stephen

Fri, 10 Jan 1997 10:51:38 -0800

89 lines

New Thread

FOOTPRINT PQFP208

Re: FOOTPRINT PQFP208

Chris Messner

24 Jan 97 06:13:39 -0500

92 lines

FOOTPRINT PQFP208

Karren Olson

Thu, 23 Jan 1997 13:32:46 -0800

51 lines

New Thread

FR4 moisture absorption rate

FR4 moisture absorption rate

<>

Fri, 17 Jan 97 11:51:24 MDT

37 lines

New Thread

FR4 processing and properties

FR4 processing and properties

ILA

Fri, 10 Jan 1997 09:25:51 +0500

55 lines

New Thread

Freezing electroless tin: oxide, IMC, whiskers, and pest

Freezing electroless tin: oxide, IMC, whiskers, and pest

DAVY.J.G-

Mon, 20 Jan 1997 17:06:41 -0500

130 lines

Re: Freezing electroless tin: oxide, IMC, whiskers, and pest

ddhillma

Mon, 20 Jan 97 20:39:34 cst

197 lines

New Thread

Fuji Tape leaf covers

Fuji Tape leaf covers

Paul Stolar

Wed, 15 Jan 97 16:33:20 CDT

36 lines

New Thread

FW: 55110E

FW: 55110E

Baker,Kelly

Mon, 27 Jan 1997 09:29:00 -0500

73 lines

FW: 55110E

Baker,Kelly

Mon, 27 Jan 1997 08:33:34 -0500

82 lines

FW: 55110E

Baker,Kelly

Mon, 27 Jan 1997 08:00:34 -0500

73 lines

New Thread

FW: ASSY: IR Reflow of Thru-Hole Components

FW: ASSY: IR Reflow of Thru-Hole Components

Dill, Norm J

Tue, 14 Jan 97 15:34:00 EST

144 lines

New Thread

FW: FAB - Defective units on panelized PWBs

FW: FAB - Defective units on panelized PWBs

Dill, Norm J

Thu, 30 Jan 97 12:01:00 EST

80 lines

New Thread

FW: Fabrication of Printed Circuit Boards

FW: Fabrication of Printed Circuit Boards

Gagnon, Gerry

Thu, 30 Jan 1997 09:40:00 -0500

83 lines

New Thread

FW: FW: lab facilities for SEM testing

FW: FW: lab facilities for SEM testing

Gagnon, Gerry

Fri, 24 Jan 1997 13:22:05 -0500

61 lines

New Thread

FW: GEN: ISO and Calibration

FW: GEN: ISO and Calibration

Dill, Norm J

Wed, 22 Jan 97 19:26:00 EST

103 lines

New Thread

FW: Gold as Etch Resist

FW: Gold as Etch Resist

Gagnon, Gerry

Thu, 30 Jan 1997 09:36:59 -0500

145 lines

New Thread

FW: ISO and calibration

FW: ISO and calibration

Ed Cosper

Tue, 28 Jan 1997 17:09:03 -0600

75 lines

New Thread

FW: Manufacturing Engineer Seeking Employment.

FW: Manufacturing Engineer Seeking Employment.

Baker,Kelly

Sat, 1 Feb 1997 09:24:49 -0500

39 lines

New Thread

FW: ORC EXPOSURE MACHINE

FW: ORC EXPOSURE MACHINE

Edwards, Ted A (AZ75)

28 Jan 1997 15:30:59 -0600

96 lines

New Thread

FW: Panelization Software (fwd)

FW: Panelization Software (fwd)

Hernan Jaramillo

Wed, 22 Jan 1997 16:04:00

115 lines

New Thread

Fw: Who is Tom Bresnan? Son of Victor Johansen, perhaps?

Fw: Who is Tom Bresnan? Son of Victor Johansen, perhaps?

Matt Mahlau

Thu, 16 Jan 1997 05:18:24 -0500

97 lines

New Thread

Fwd: GEN: Condor Nonsense

Fwd: GEN: Condor Nonsense

<>

Sun, 5 Jan 1997 09:42:58 -0500

99 lines

New Thread

Fwd: Re: Who is Tom Bresnan?

Fwd: Re: Who is Tom Bresnan?

<>

Thu, 16 Jan 1997 18:17:15 -0500

117 lines

New Thread

GEN- ISO and Calibration

Re: GEN- ISO and Calibration

Greg Bartlett

22 Jan 1997 16:55:15 -0500

102 lines

New Thread

GEN: Book Review

Re: GEN: Book Review

Bob Willis

16 Jan 97 13:36:58 EST

44 lines

GEN: Book Review

Yuen, Mike

Wed, 15 Jan 97 15:22:00 CST

41 lines

New Thread

GEN: Book Review for Flex

Re: GEN: Book Review for Flex

<>

Thu, 16 Jan 1997 17:38:44 -0500 (EST)

40 lines

New Thread

GEN: CMI After Etch

GEN: CMI After Etch

<>

Wed, 1 Jan 1997 22:48:01 -0500

71 lines

New Thread

GEN: Condor Nonsense

GEN: Condor Nonsense

<>

Sat, 04 Jan 97 22:00:45 EST

36 lines

GEN: Condor Nonsense

<>

Sat, 4 Jan 1997 09:24:20 -0500

66 lines

New Thread

GEN: Condor Nonsense -Reply

GEN: Condor Nonsense -Reply

Dan Lorinser

Mon, 06 Jan 1997 06:51:46 -0600

54 lines

New Thread

GEN: Electrowinning Units

Re: GEN: Electrowinning Units

Edwards, Ted A (AZ75)

02 Jan 1997 09:00:41 -0600

113 lines

Re: GEN: Electrowinning Units

George Franck Jr

Thu, 2 Jan 1997 08:35:53 -0500

101 lines

New Thread

GEN: Electrowinning Units (Long)

Re: GEN: Electrowinning Units (Long)

Bob Mesick

Thu, 2 Jan 1997 17:02:33 -0800 (PST)

129 lines

New Thread

GEN: ISO and Calibration

Re[2]: GEN: ISO and Calibration

George Kotecki

Mon, 27 Jan 97 13:04:37 CST

160 lines

Re: GEN: ISO and Calibration

Doug McKean

Mon, 27 Jan 1997 09:57:09 -0500

112 lines

Re: GEN: ISO and Calibration

Steve Mikell

Thu, 23 Jan 1997 00:18:30 -0600 (CST)

102 lines

Re: GEN: ISO and Calibration

Luis Rivera

Wed, 22 Jan 1997 13:25:41 +600 CDT

119 lines

GEN: ISO and Calibration

David Pizzoferrato

Wed, 22 Jan 1997 08:21:46 -0700

70 lines

New Thread

GEN: Lead Coplanarity Spec??

Re: GEN: Lead Coplanarity Spec??

mrosenfi

Thu, 23 Jan 1997 12:35:31 -0500

88 lines

Re[2]: GEN: Lead Coplanarity Spec??

mrosenfi

Thu, 23 Jan 1997 12:27:34 -0500

99 lines

Re: GEN: Lead Coplanarity Spec??

<>

Wed, 22 Jan 97 17:38:20

74 lines

Re: GEN: Lead Coplanarity Spec??

Bilal Khalaf

Wed, 22 Jan 97 14:29:00 PST

123 lines

GEN: Lead Coplanarity Spec??

Rajan, Sanjay

Wed, 22 Jan 97 10:53:00 EST

56 lines

New Thread

Gen: Looking for Bachi Inc. and Meteor Inc.

Re: Gen: Looking for Bachi Inc. and Meteor Inc.

<>

Tue, 28 Jan 1997 11:55:14 -0600

82 lines

Gen: Looking for Bachi Inc. and Meteor Inc.

Poh Kong Hui

Tue, 28 Jan 1997 22:01:07 +0800 (SST)

57 lines

New Thread

Gen: Obsoleted Military Documents

Gen: Obsoleted Military Documents

<>

Wed, 22 Jan 97 8:22:41 PST

54 lines

New Thread

GEN: PWB Contract Manufacturers

GEN: PWB Contract Manufacturers

<>

Mon, 6 Jan 1997 14:25:44 -0600

49 lines

New Thread

GEN: Shelf life for components...

Re[2]: GEN: Shelf life for components...

ddhillma

Fri, 17 Jan 97 10:26:44 cst

170 lines

RE: GEN: Shelf life for components...

DAVY.J.G-

Thu, 16 Jan 1997 18:09:35 -0500

115 lines

Re: GEN: Shelf life for components...

<>

Thu, 16 Jan 1997 08:34:57 -0600

78 lines

GEN: Shelf life for components...

Gopalakrishna Bhat - Mfg. Engineering , Digital India

Wed, 15 Jan 97 22:58:57 EST

45 lines

New Thread

GEN: Vision Engineering; Just gotta vent

Re: GEN: Vision Engineering; Just gotta vent

BrianWada

Fri, 24 Jan 97 09:44:06 PST

106 lines

GEN: Vision Engineering; Just gotta vent

<>

Thu, 23 Jan 1997 15:47:35 -0600

87 lines

New Thread

GEN: Where in the world is Ralph Hersey?

Re: GEN: Where in the world is Ralph Hersey?

Ralph Hersey

Mon, 20 Jan 1997 17:38:56 -0800

67 lines

Re: GEN: Where in the world is Ralph Hersey?

<>

Mon, 20 Jan 97 11:34:03 PST

63 lines

Re: GEN: Where in the world is Ralph Hersey?

<>

Mon, 20 Jan 97 11:32:17 PST

96 lines

GEN: Where in the world is Ralph Hersey?

Randy Reed

Mon, 20 Jan 97 9:32:05 PST

42 lines

New Thread

GEN: Where in the world is Ralph Hersey? -Reply

GEN: Where in the world is Ralph Hersey? -Reply

David Anderson

Mon, 20 Jan 1997 13:37:37 -0600

42 lines

New Thread

Gold as Etch Resist

Re[2]: Gold as Etch Resist

<>

Fri, 31 Jan 97 07:48:36 EST

90 lines

Re: Gold as Etch Resist

<>

Thu, 30 Jan 97 09:15:57 EST

65 lines

Re[2]: Gold as Etch Resist

ddsulliv

Thu, 30 Jan 97 08:04:59 cst

140 lines

Re: Gold as Etch Resist

cabeles

Wed, 29 Jan 97 17:10:00 PST

67 lines

Re: Gold as Etch Resist

<>

Wed, 29 Jan 97 15:38:48 PST

65 lines

Gold as Etch Resist

<>

Wed, 29 Jan 97 12:05:39 MST

41 lines

New Thread

Gold wiring bonding

Re:Gold wiring bonding

David Anderson

Mon, 27 Jan 1997 15:44:24 -0600

54 lines

Gold wiring bonding

<>

Mon, 27 Jan 1997 07:22:37 EST

58 lines

New Thread

handling silver halide wastes

RE: handling silver halide wastes

Roubineau, Pascal

Tue, 21 Jan 1997 17:42 -0800 (PST)

59 lines

New Thread

heat capacity

Re: heat capacity

joef

Tue, 21 Jan 97 18:14:44 EST

61 lines

heat capacity

<>

Tue, 21 Jan 97 15:37:36 CST

40 lines

New Thread

Hooray for Bob Mesick!

Hooray for Bob Mesick!

<>

Fri, 3 Jan 1997 10:10:17 -0500

36 lines

New Thread

how much force to apply on pcb?

how much force to apply on pcb?

Bab-Hui Lee-CTUA065

Mon, 20 Jan 1997 21:00:39 -0600

38 lines

New Thread

Hull Cell criteria

Re: Hull Cell criteria

ddsulliv

Wed, 22 Jan 97 11:00:05 cst

103 lines

Hull Cell Criteria

Vera Payne

Wed, 22 Jan 1997 10:57:46 -0600

48 lines

Re: Hull Cell criteria

cabeles

Wed, 22 Jan 97 08:44:22 PST

68 lines

Hull Cell criteria

Vera Payne

Wed, 22 Jan 1997 09:05:32 -0600

43 lines

New Thread

I found them !!

I found them !!

Kasprzak, Bill (esd) US

Fri, 17 Jan 97 09:46:00 PST

51 lines

New Thread

IEC 1112

Re: IEC 1112

PDUDLEY

Fri, 17 Jan 97 14:06:38 CST

75 lines

IEC 1112

Emstad, Zane

Fri, 17 Jan 1997 12:38:07 -0500

43 lines

New Thread

IEC 249-2-9-FVO-EP-CP

Re: IEC 249-2-9-FVO-EP-CP

PDUDLEY

Fri, 10 Jan 97 13:42:26 CST

62 lines

IEC 249-2-9-FVO-EP-CP

Tom Killick

Thu, 9 Jan 97 11:59:32 -0800

43 lines

New Thread

IEEE WEBSITE?

RE: IEEE WEBSITE?

NEW INTERNET ADDRESS: [log in to unmask]

Fri, 24 Jan 97 08:28:35 EST

37 lines

Re: IEEE WEBSITE?

Pratap Singh

Thu, 23 Jan 1997 21:16:46 -0800

59 lines

IEEE WEBSITE?

<>

Tue, 21 Jan 1997 09:04:43 +0000

51 lines

New Thread

ImageFlex

Re: ImageFlex

<>

Thu, 23 Jan 1997 18:34:07 -0500 (EST)

54 lines

ImageFlex

<>

Wed, 22 Jan 1997 09:07:50 -0800

48 lines

New Thread

immersion tin

Re: immersion tin

<>

Thu, 23 Jan 1997 16:12:56 +0800

101 lines

Re: immersion tin

ddhillma

Fri, 17 Jan 97 07:38:03 cst

110 lines

immersion tin

Robert Welch

Thu, 16 Jan 1997 18:03:21 +0000

68 lines

New Thread

Immersion Tin coatings

Immersion Tin coatings

Kasprzak, Bill (esd) US

Fri, 17 Jan 97 07:22:00 PST

57 lines

New Thread

Info: AT Brackets - GLOBE?

RE: Info: AT Brackets - GLOBE?

Mucelli, Patricia

Tue, 07 Jan 97 12:39:00 PST

92 lines

Re: Info: AT Brackets - GLOBE?

Jerry Cupples

Tue, 7 Jan 1997 13:34:45 -0600

79 lines

Re: Info: AT Brackets - GLOBE?

Pat McGuine

Tue, 07 Jan 1997 12:18:57 -0600

91 lines

Info: AT Brackets - GLOBE?

Neil Diamond

Tue, 07 Jan 1997 09:31:47 -0600

58 lines

New Thread

Inner Layer Core Prep

Inner Layer Core Prep

Dusty

Thu, 16 Jan 1997 06:57:20 -0500

54 lines

New Thread

IPC Chart on Hi Density Interconnect

IPC Chart on Hi Density Interconnect

Karl Sauter

Fri, 10 Jan 1997 12:54:51 -0800

45 lines

New Thread

IPC CHAT

RE: IPC CHAT

Wayne Gitlitz

Wed, 15 Jan 97 18:44:06 -0500

59 lines

IPC CHAT

<>

Wed, 15 Jan 97 19:17:35 +0100

42 lines

IPC Chat

Bernard Kessler & Associates LTD

Wed, 15 Jan 97 11:39 EST

53 lines

New Thread

IPC CHAT -Reply

IPC CHAT -Reply

Dan Lorinser

Wed, 15 Jan 1997 14:29:45 -0600

55 lines

New Thread

IPC Convention, San Jose, CA March '97

IPC Convention, San Jose, CA March '97

Phil Culpovich

Wed, 15 Jan 1997 19:13:22 -0800

58 lines

New Thread

IPC Convention, San Jose, CA March '97 (fwd)

IPC Convention, San Jose, CA March '97 (fwd)

David Bergman

Thu, 16 Jan 1997 15:08:01 -0600 (CST)

107 lines

New Thread

IPC Printed Cts Expo

IPC Printed Cts Expo

Lynch, Lyn

Mon, 20 Jan 97 07:44:35

53 lines

New Thread

IPC Source for PWB Products/Services

IPC Source for PWB Products/Services

Bob Neves

Thu, 09 Jan 1997 11:06:59 -0800

58 lines

New Thread

IPC-D-356

RE: IPC-D-356

Schlice Dave

Fri, 31 Jan 97 11:13:00 MST

61 lines

Re[2]: IPC-D-356

<>

Fri, 31 Jan 1997 12:49:01 -0500

60 lines

Re: IPC-D-356

<>

Fri, 31 Jan 1997 08:49:02 -0800

47 lines

IPC-D-356

<>

Fri, 31 Jan 1997 08:47:43 -0500

43 lines

New Thread

IPC-D-356 and IPC356A

Re: IPC-D-356 and IPC356A

Wolfgang Schenke

Sat, 1 Feb 97 09:47 PST

77 lines

New Thread

IPC-D-356 Netlist Testing

IPC-D-356 Netlist Testing

<>

Fri, 3 Jan 1997 09:56:42 -0500 (EST)

46 lines

New Thread

IPC-RB-276

IPC-RB-276

Don Vischulis

Thu, 30 Jan 1997 21:47:04 -0600

46 lines

New Thread

IPC-RB-276 is OBSOLETE!

Re: IPC-RB-276 is OBSOLETE!

<>

Wed, 22 Jan 1997 07:35:45 EST

254 lines

Re: IPC-RB-276 is OBSOLETE!

George Franck Jr

Tue, 21 Jan 1997 17:09:26 -0500

154 lines

New Thread

IPC-RB-276 is OBSOLETE! -Reply

Re: IPC-RB-276 is OBSOLETE! -Reply

David Bergman

Wed, 22 Jan 1997 10:56:22 -0600 (CST)

212 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

Mitch Morey

Wed, 22 Jan 1997 08:45:45 -0800

65 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

Mitch Morey

Wed, 22 Jan 1997 08:45:45 -0800

65 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

George Franck Jr

Wed, 22 Jan 1997 09:33:44 -0500

140 lines

Re: IPC-RB-276 is OBSOLETE! -Reply

Dan Lorinser

Wed, 22 Jan 1997 06:48:13 -0600

145 lines

New Thread

IPC-RB-276 is OBSOLETE! -Reply -Reply

Re: IPC-RB-276 is OBSOLETE! -Reply -Reply

Lisa Williams

Thu, 23 Jan 1997 11:09:40 -0600 (CST)

74 lines

Re: IPC-RB-276 is OBSOLETE! -Reply -Reply

David Bergman

Thu, 23 Jan 1997 09:14:07 -0600 (CST)

51 lines

RE: IPC-RB-276 is OBSOLETE! -Reply -Reply

Vera Payne

Thu, 23 Jan 1997 09:16:34 -0600

98 lines

Re: IPC-RB-276 is OBSOLETE! -Reply -Reply

Dan Lorinser

Thu, 23 Jan 1997 07:05:35 -0600

39 lines

New Thread

IPC-RB-276 is OBSOLETE! -Reply -Reply -Reply

RE: IPC-RB-276 is OBSOLETE! -Reply -Reply -Reply

Dan Lorinser

Thu, 23 Jan 1997 10:28:26 -0600

72 lines

New Thread

IPC-SM-840

Re: IPC-SM-840

<>

Fri, 31 Jan 1997 12:35:04 -0500 (EST)

50 lines

Re: IPC-SM-840

<>

Fri, 31 Jan 1997 09:33:39 -0500 (EST)

63 lines

Re: IPC-SM-840

<>

Thu, 30 Jan 1997 15:50:12 -0500 (EST)

36 lines

RE: IPC-SM-840

<>

Wed, 29 Jan 1997 12:51:52 -0700

49 lines

New Thread

ipc356 netlist

ipc356 netlist

Jerome Schwartz x5474

Tue, 7 Jan 1997 08:28:51 -0500

45 lines

New Thread

IPCchat

IPCchat

<>

Wed, 15 Jan 97 19:24:22 EST

54 lines

New Thread

IPCchat session announcement

IPCchat session announcement

<>

Fri, 31 Jan 1997 18:17:39 GMT

63 lines

IPCchat session announcement

<>

Wed, 29 Jan 1997 17:30:46 GMT

70 lines

RE: IPCchat session announcement

Goldman, Patricia J.

Wed, 29 Jan 97 08:40:00 PST

92 lines

IPCchat session announcement

<>

Tue, 28 Jan 1997 21:15:18 GMT

62 lines

New Thread

Is the use of Masking Tape an ESD Event ??

RE: Is the use of Masking Tape an ESD Event ??

Mack, Roger CA-WINPO2

Thu, 16 Jan 97 16:12:00 GMT

74 lines

RE: Is the use of Masking Tape an ESD Event ??

Jim Marsico 516-595-5879

Wed, 15 Jan 1997 15:36:00 -0500 (EST)

58 lines

Is the use of Masking Tape an ESD Event ??

Kasprzak, Bill (esd) US

Wed, 15 Jan 97 10:33:00 PST

62 lines

New Thread

JEDEC Info.

JEDEC Info.

Jim Moffit

Thu, 30 Jan 1997 11:31:52 -0500

43 lines

New Thread

Job listing

Job listing

<>

Tue, 21 Jan 1997 22:54:51 +0000

70 lines

New Thread

LA, Calif meeting

LA, Calif meeting

Bill Gaines B160 x2199

Mon, 20 Jan 97 16:54:39 PST

43 lines

New Thread

lab facilities for SEM testing

Re: lab facilities for SEM testing

Ted Stern

Thu, 23 Jan 1997 16:28:38 -0800

62 lines

Re: lab facilities for SEM testing

Jack Crawford

Thu, 23 Jan 1997 11:31:33 -0500

60 lines

Re: lab facilities for SEM testing

James W Baker

23 Jan 1997 09:18:08 -0700

71 lines

lab facilities for SEM testing

Todd Rogers

Thu, 23 Jan 1997 08:51:33 -0600

44 lines

lab facilities for SEM testing

Todd Rogers

Thu, 23 Jan 1997 08:42:26 -0600

40 lines

New Thread

Labs

RE: Labs

Gagnon, Gerry

Thu, 30 Jan 1997 11:12:37 -0500

189 lines

New Thread

Laser via source

Re[2]: Laser via source

<>

Fri, 31 Jan 97 07:51:16 EST

85 lines

RE: Laser via source

David Anderson

Thu, 30 Jan 1997 10:02:52 -0600

41 lines

RE: Laser via source

Thomas, Kevin

Wed, 29 Jan 1997 15:05:00 -0700

67 lines

Re: Laser via source

James Ying

Wed, 29 Jan 1997 23:22:02 +0800 (SST)

55 lines

Laser via source

<>

Wed, 29 Jan 1997 04:33:10 -0500 (EST)

33 lines

New Thread

lifed pads

Re: lifed pads

Jack Crawford

Tue, 14 Jan 1997 15:43:45 -0500

85 lines

lifed pads

Yakov Steinberg

Tue, 14 Jan 1997 10:52:18 +0200 (IST)

45 lines

New Thread

Manufacturing Engineer Seeking Employment.

Re: Manufacturing Engineer Seeking Employment.

<>

Fri, 31 Jan 1997 18:39:50 -0500 (EST)

38 lines

Manufacturing Engineer Seeking Employment.

<>

Fri, 31 Jan 1997 08:01:56 -0500

54 lines

New Thread

Marking

Re[4]: Marking

BrianWada

Wed, 08 Jan 97 09:31:40 PST

140 lines

Re[4]: Marking

BrianWada

Wed, 08 Jan 97 09:17:58 PST

175 lines

Re: Marking

<>

Wed, 8 Jan 1997 09:00:32 -0600

63 lines

Re[3]: Marking

KoizumiT

Wed, 08 Jan 97 09:48:32 JST

110 lines

Re[3]: Marking

Bilal Khalaf

Tue, 07 Jan 97 15:54:00 PST

148 lines

Re[2]: Marking

mhu

Tue, 07 Jan 97 15:48:34 PST

71 lines

Re: Marking

<>

Tue, 7 Jan 1997 17:24:20 -0600

55 lines

Re[2]: Marking

<>

Tue, 7 Jan 1997 13:56:29 -0600

93 lines

Marking

Paul Stolar

Tue, 07 Jan 97 10:43:26 CDT

38 lines

Re: Marking

KoizumiT

Tue, 07 Jan 97 10:49:31 JST

64 lines

Marking

Paul Stolar

Mon, 06 Jan 97 08:39:51 CDT

38 lines

New Thread

Marking -Reply

Re[3]: Marking -Reply

David Anderson

Wed, 08 Jan 1997 10:16:57 -0600

56 lines

New Thread

marking ink

marking ink

Jim Douglas

Thu, 16 Jan 1997 15:31:23 -0000

45 lines

New Thread

Masking Tape and ESD Damage

Re[2]: Masking Tape and ESD Damage

BrianWada

Thu, 16 Jan 97 11:22:13 PST

110 lines

RE: Masking Tape and ESD Damage

Lynch, Lyn

Thu, 16 Jan 97 08:24:14

58 lines

New Thread

measuring paste height

Re: measuring paste height

Phil Yates

Fri, 31 Jan 1997 13:41:15 -0600

66 lines

Re[2]: measuring paste height

Doreen Fisher

31 Jan 97 15:19 CST

81 lines

Re: measuring paste height

<>

Fri, 31 Jan 97 10:39:59

116 lines

Re: measuring paste height

LWFERGUS

Fri, 31 Jan 97 13:01:45 CST

64 lines

Re: measuring paste height

<>

Fri, 31 Jan 1997 14:08:27 -0500

76 lines

Re: measuring paste height

nldeblie

Fri, 31 Jan 97 11:42:52 cst

95 lines

RE: measuring paste height

John Nelson

Thu, 30 Jan 1997 11:46:47 -0500

48 lines

Re:measuring paste height

David Anderson

Fri, 31 Jan 1997 10:03:26 -0600

54 lines

Re: measuring paste height

<>

Fri, 31 Jan 1997 09:13:11 -0500 (EST)

39 lines

measuring paste height

MIKE J. LOPEZ

Fri, 31 Jan 1997 08:03:21 -0500

37 lines

New Thread

melf's

Re: melf's

Jack Crawford

Tue, 21 Jan 1997 11:04:35 -0500

133 lines

Re: melf's

ddhillma

Thu, 16 Jan 97 13:02:58 cst

99 lines

melf's

<>

Thu, 16 Jan 1997 09:15:22 +0000

63 lines

New Thread

melf's, J-STD-001, IPC-610

Re[2]: melf's, J-STD-001, IPC-610

ddhillma

Tue, 21 Jan 97 08:03:52 cst

158 lines

Re: melf's, J-STD-001, IPC-610

VS

Mon, 20 Jan 1997 22:57:23 -0500

127 lines

Re[2]: melf's, J-STD-001, IPC-610

ddhillma

Mon, 20 Jan 97 12:54:27 cst

227 lines

Re: melf's, J-STD-001, IPC-610

<>

Mon, 20 Jan 1997 13:07:14 -0500 (EST)

56 lines

Re: melf's, J-STD-001, IPC-610

VS

Sun, 19 Jan 1997 13:43:12 -0500

167 lines

New Thread

MIL Std. -2000- ???

Re: MIL Std. -2000- ???

David Bergman

Tue, 28 Jan 1997 17:07:15 -0600 (CST)

70 lines

MIL Std. -2000- ???

<>

28 Jan 97 22:35 GMT+0500

53 lines

New Thread

missing components

Re: missing components

<>

Thu, 23 Jan 97 11:22:28

96 lines

Re: missing components

<>

Thu, 23 Jan 97 09:43:24 -0800

50 lines

missing components

Dominick Cizek

Thu, 23 Jan 1997 10:59:57 -0500

37 lines

New Thread

Mixed Tech Assy

Re: Mixed Tech Assy

Jim Zanolli

Thu, 30 Jan 1997 12:34:35 -0500

50 lines

New Thread

MTBF/ESD/EOS

MTBF/ESD/EOS

test

Thu, 2 Jan 97 19:43 WET

48 lines

New Thread

Need HELP with Mydata machines

Re: Need HELP with Mydata machines

<>

Tue, 28 Jan 1997 09:54:28 -0600

69 lines

RE: Need HELP with Mydata machines

Jack Crawford

Tue, 28 Jan 1997 11:03:33 -0500

79 lines

Re: Need HELP with Mydata machines

Mikael Blank

Tue, 28 Jan 1997 10:13:28 +0100

57 lines

Need HELP with Mydata machines

SDalton

Mon, 27 Jan 1997 16:49:12 -0600

45 lines

New Thread

Nepcon West'97

Re: Nepcon West'97

Tom Chung

Wed, 15 Jan 1997 17:51:05 -0600

81 lines

Re: Nepcon West'97

ddhillma

Wed, 15 Jan 97 11:48:50 cst

80 lines

Nepcon West'97

Antoni Cherta

Wed, 15 Jan 1997 15:08:16 +0100

54 lines

New Thread

New Substrate Materials for P-BGA

Re: New Substrate Materials for P-BGA

<>

Wed, 15 Jan 1997 13:32:55 -0500 (EST)

38 lines

Re: New Substrate Materials for P-BGA

<>

Tue, 14 Jan 1997 21:33:16 -0500 (EST)

43 lines

New Substrate Materials for P-BGA

eiju yorozu

Tue, 14 Jan 97 16:01:31 JST

64 lines

New Thread

Ni Resins for Gold Plating

Re[2]: Ni Resins for Gold Plating

Michael Holan

Wed, 15 Jan 1997 06:40:59 -0600

137 lines

Re: Ni Resins for Gold Plating

Bob Mesick

Tue, 14 Jan 1997 11:52:35 -0800 (PST)

85 lines

Ni Resins for Gold Plating

Steve Sparkowich

Mon, 13 Jan 97 23:16:34 PST

40 lines

New Thread

No clean Fluxes

Re:No clean Fluxes

Antoni

Wed, 8 Jan 1997 18:48:28 +0100

59 lines

New Thread

No messages

Re: No messages

James W Baker

31 Jan 1997 07:33:54 -0700

90 lines

New Thread

NO MORE RULE MESSAGES!

NO MORE RULE MESSAGES!

TOM BRESNAN

Thu, 16 Jan 97 07:50:07 PST

39 lines

New Thread

NO SUBJECT

NO SUBJECT

<>

Sat, 11 Jan 97 10:19:41 EST

46 lines

New Thread

Off topic subject - do not read for technical info.

Off topic subject - do not read for technical info.

<>

Tue, 21 Jan 1997 11:46:46 -0800

77 lines

New Thread

offset stripline

offset stripline

Caldera Desktop User

Tue, 14 Jan 1997 11:43:09 -0800 (PST)

95 lines

New Thread

Optimizing for Fine Pitch Devices in SMT

RE: Optimizing for Fine Pitch Devices in SMT

Pat Kane (by way of [log in to unmask] Jack Crawford)

Thu, 30 Jan 1997 12:38:32 -0500

94 lines

Optimizing for Fine Pitch Devices in SMT

David T. Novick

Wed, 29 Jan 97 09:52:37 PST

63 lines

New Thread

ORC EXPOSURE MACHINE

ORC EXPOSURE MACHINE

<>

Tue, 28 Jan 1997 11:16:50 EST

64 lines

ORC exposure machine

tonghh

Tue, 28 Jan 1997 21:50:43 +0800

39 lines

New Thread

other forums

Re: other forums

<>

Fri, 10 Jan 1997 14:11:13 -0500 (EST)

46 lines

other forums

Guenter Grossmann

Fri, 10 Jan 1997 11:11:29 +0100

47 lines

New Thread

package style ?

RE: package style ?

Max Bernhardt

Thu, 9 Jan 1997 16:04:00 -0600

81 lines

RE: package style ?

Max Bernhardt

Thu, 9 Jan 1997 15:59:00 -0600

79 lines

Re: package style ?

Mack, Roger CA-WINPO2

Thu, 09 Jan 97 18:12:00 GMT

105 lines

RE: package style ?

Wander, Nicholas G RV

Thu, 09 Jan 97 11:14:00 CST

86 lines

Re: package style ?

mrosenfi

Thu, 9 Jan 1997 11:32:16 -0500

73 lines

package style ?

<>

Thu, 9 Jan 1997 10:46:00 -0500 (EST)

47 lines

New Thread

Paper Phenolic Assemblies

Paper Phenolic Assemblies

Steve O'Hara

Thu, 30 Jan 1997 09:16:49 -0800

77 lines

New Thread

paraCHAT

Re: paraCHAT

BrianWada

Tue, 14 Jan 97 18:01:01 PST

72 lines

paraCHAT

<>

Tue, 14 Jan 1997 16:07:51 -0500 (EST)

55 lines

New Thread

PEM Reliability

Re: PEM Reliability

Brian Hyde

Thu, 09 Jan 1997 15:27:10 -0500

79 lines

PEM Reliability

Mike Adams

Thu, 9 Jan 97 13:43 EST

78 lines

New Thread

Phone Request

RE: Phone Request

Mucelli, Patricia

Fri, 10 Jan 97 12:05:00 PST

74 lines

Re: Phone request

Tom Cooper

Fri, 10 Jan 97 08:12:42 EST

76 lines

Phone request

Antoni

Fri, 10 Jan 1997 10:18:30 +0100

51 lines

New Thread

Photo-initiation

Re[2]: Photo-initiation

<>

Sun, 19 Jan 97 18:40:54 EST

114 lines

Re: Photo-initiation

Kerry Grimes

Sat, 18 Jan 1997 20:14:32 -0800

109 lines

Re: Photo-initiation

<>

Sat, 18 Jan 1997 16:54:04 -0500 (EST)

65 lines

RE: Photo-initiation

Bert Ohlig

Thu, 16 Jan 97 15:00:26 UT

109 lines

Re: Photo-initiation

<>

Wed, 15 Jan 1997 18:22:11 -0500

68 lines

Re: Photo-initiation

<>

Wed, 15 Jan 1997 15:15:58 -0500 (EST)

66 lines

Photo-initiation

tonghh

Wed, 15 Jan 1997 22:26:59 +0800

46 lines

New Thread

Phototool dimensional stability

Re: Phototool dimensional stability

<>

Tue, 7 Jan 1997 23:59:49 -0500 (EST)

37 lines

Re[2]: Phototool dimensional stability

E-C-KOH

Wed, 08 Jan 97 07:56:11

124 lines

Re: Phototool dimensional stability

John Gibson

Tue, 07 Jan 1997 17:33:59 -0800

98 lines

RE: Phototool dimensional stability

Murray, George @ GSC

Tue, 07 Jan 97 14:01:00 PST

116 lines

Phototool dimensional stability

<>

Tue, 7 Jan 1997 03:47:46 -0500

66 lines

New Thread

Plasma

Re[2]: Plasma

<>

Mon, 27 Jan 1997 16:37:59 -0600

200 lines

Re: Plasma

Goldman, Patricia J.

Mon, 27 Jan 97 13:46:00 PST

159 lines

Re: Plasma

<>

Fri, 24 Jan 1997 18:49:49 -0600

97 lines

Re: Plasma

<>

Fri, 24 Jan 97 08:27:29 EST

77 lines

Plasma

Timothy Gaylor

Thu, 23 Jan 1997 23:25:53 -0500

47 lines

New Thread

Plastic Package Hemeticity

Re: Plastic Package Hemeticity

DAVY.J.G-

Wed, 29 Jan 1997 16:55:39 -0500

55 lines

New Thread

plastic package hermeticity

Re: plastic package hermeticity

Torrie Bova

Tue, 28 Jan 1997 14:02:36 +0900

60 lines

Re: plastic package hermeticity

<>

Mon, 27 Jan 1997 18:17:23 -0500 (EST)

44 lines

Re: plastic package hermeticity

James W Baker

27 Jan 1997 13:12:40 -0700

79 lines

Re: plastic package hermeticity

James W Baker

27 Jan 1997 09:51:24 -0700

80 lines

RE: plastic package hermeticity

DAVY.J.G-

Mon, 27 Jan 1997 10:54:30 -0500

146 lines

Re: plastic package hermeticity

Douglas Sandvick

Mon, 27 Jan 1997 09:04:01 -0600 (CST)

73 lines

plastic package hermeticity

Neil W. Lareau

Fri, 24 Jan 1997 17:02:20 -0500

42 lines

New Thread

Plotter manufacturers for PCB

Plotter manufacturers for PCB

Antoni

Fri, 10 Jan 1997 10:18:28 +0100

51 lines

New Thread

Post Baking Process

Re[2]: Post Baking Process

<>

Fri, 31 Jan 97 08:54:02 EST

123 lines

RE[3]: Post Baking Process

Glenn Heath

Mon, 27 Jan 1997 16:34:51 -0800 (PST)

67 lines

Re[3]: Post Baking Process

Terry Pearo

Mon, 27 Jan 97 16:17:33 PST

103 lines

Re[2]: Post Baking Process

cabeles

Mon, 27 Jan 97 12:30:31 PST

59 lines

Re: Post Baking Process

R_R_HOLMES

Mon, 27 Jan 97 11:26:40 EST

118 lines

Post Baking Process

rsuthar

Fri, 24 Jan 97 15:03:18 PST

48 lines

New Thread

pqfp208 footprint land pattern

pqfp208 footprint land pattern

Karren Olson

Thu, 23 Jan 1997 13:29:29 -0800

49 lines

New Thread

Probimer 74

Probimer 74

<>

Tue, 21 Jan 1997 13:29:14 -0500 (EST)

44 lines

New Thread

Proto-type Quick Turn Boards

Re: Proto-type Quick Turn Boards

Darrell Bonzo

Wed, 08 Jan 97 15:37

75 lines

Re: Proto-type Quick Turn Boards

Jack Olson

Wed, 08 Jan 1997 11:00:30 -0800

48 lines

Re: Proto-type Quick Turn Boards

<>

Wed, 8 Jan 1997 07:44:34 -0700

44 lines

Re: Proto-type Quick Turn Boards

<>

Wed, 8 Jan 1997 10:26:44 -0500 (EST)

39 lines

Proto-type Quick Turn Boards

<>

Tue, 7 Jan 1997 12:12:07 -0600

53 lines

New Thread

Proto-type Quick Turn Boards -Reply

Re: Proto-type Quick Turn Boards -Reply

Dan Lorinser

Wed, 08 Jan 1997 10:55:50 -0600

69 lines

Re: Proto-type Quick Turn Boards -Reply

<>

Thu, 02 Jan 97 10:09:51 PST

91 lines

Proto-type Quick Turn Boards -Reply

Dan Lorinser

Thu, 02 Jan 1997 07:12:31 -0600

71 lines

New Thread

Proto-type Quick Turn Boards -Reply -Reply

Re: Proto-type Quick Turn Boards -Reply -Reply

Dan Lorinser

Thu, 02 Jan 1997 12:47:02 -0600

107 lines

New Thread

PWB manufacturing question?

PWB manufacturing question?

<>

Mon, 27 Jan 1997 15:17:50 EST

53 lines

New Thread

qualification plan for BGA soldering process.

Re: qualification plan for BGA soldering process.

<>

Fri, 3 Jan 1997 17:28:19 -0500

52 lines

RE: qualification plan for BGA soldering process.

Max Bernhardt

Fri, 3 Jan 1997 07:57:00 -0600

74 lines

Re: qualification plan for BGA soldering process.

George Franck Jr

Fri, 3 Jan 1997 09:26:32 -0500

79 lines

qualification plan for BGA soldering process.

OBRIEN GERARD

Thu, 2 Jan 97 17:04:41 -0500

47 lines

New Thread

qualification plan for BGA soldering process. -Reply

qualification plan for BGA soldering process. -Reply

Michael Campos

Fri, 03 Jan 1997 17:51:53 -0500

113 lines

New Thread

Query

Query

<>

Wed, 8 Jan 97 03:29:25 CST

45 lines

New Thread

Quick Turn Boards

Quick Turn Boards

Gregg Frazier

Wed, 01 Jan 1997 15:32:57 +0000

38 lines

New Thread

RAW CARD MFG PROCESS

RAW CARD MFG PROCESS

<>

Wed, 22 Jan 1997 05:42:54 EST

58 lines

Raw card MFG process

<>

Tue, 21 Jan 1997 19:06:55 EST

46 lines

New Thread

Re : Re: Woven Kevlar

Re: Re : Re: Woven Kevlar

<>

Mon, 6 Jan 1997 13:38:33 -0500

86 lines

Re : Re: Woven Kevlar

Guenter Grossmann

Mon, 6 Jan 1997 11:29:08 +0100

62 lines

New Thread

RE dielectric values for dif

RE dielectric values for dif

Andrew P Magee

Thu, 23 Jan 1997 09:14:00 -0800

79 lines

RE dielectric values for dif

<>

Thu, 23 Jan 1997 10:14:42 +0000

51 lines

New Thread

Re Re:Solder blow-out in soldered PTH assemblies

Re Re:Solder blow-out in soldered PTH assemblies

Guenter Grossmann

Mon, 6 Jan 1997 10:15:23 +0100

84 lines

New Thread

Re [2]: lifed pads

Re [2]: lifed pads

Jack Crawford

Tue, 21 Jan 1997 15:13:04 -0500

97 lines

New Thread

Re: Aspect Ratios

re: Re: Aspect Ratios

<>

Fri, 3 Jan 1997 07:52:02 -0500

61 lines

New Thread

Re: FAB-Dish downs in copper circuits

Re:Re: FAB-Dish downs in copper circuits

DAVY.J.G-

Tue, 28 Jan 1997 09:27:56 -0500

45 lines

New Thread

Re:Post Baking Process - Bravo!

Re:Re:Post Baking Process - Bravo!

DAVY.J.G-

Mon, 27 Jan 1997 15:20:36 -0500

41 lines

New Thread

Reflow of Through-hole

Re: Reflow of Through-hole

<>

Tue, 14 Jan 97 16:56:06 MDT

91 lines

Reflow of Through-hole

<>

Tue, 14 Jan 1997 15:28:31 -0500 (EST)

52 lines

New Thread

Reflow Soldering of PTH Connectors

RE: Reflow Soldering of PTH Connectors

Wander, Nicholas G RV

Mon, 27 Jan 97 12:39:00 CST

71 lines

Re: Reflow Soldering of PTH Connectors

<>

Fri, 24 Jan 1997 09:38:07 -0500 (EST)

46 lines

Re: Reflow Soldering of PTH Connectors

ddhillma

Fri, 24 Jan 97 04:42:15 cst

85 lines

Reflow Soldering of PTH Connectors

gabriela

Tue, 23 Jan 1996 23:43:25 +0000

50 lines

New Thread

Reliability issues and failure modes of Plastic packages

Reliability issues and failure modes of Plastic packages

Oliver Kierse

Mon, 27 Jan 97 09:30:45 GMT

41 lines

New Thread

Reliability Testing

Re: Reliability Testing

ddhillma

Fri, 03 Jan 97 15:15:25 cst

110 lines

Re: Reliability Testing

<>

Thu, 2 Jan 1997 18:09:33 -0500

110 lines

Reliability Testing

Bob Willis

02 Jan 97 03:22:34 EST

61 lines

New Thread

removing RMA flux

RE: removing RMA flux

OPPENHEIMER

25 Jan 97 14:32:16 EST

34 lines

Re: removing RMA flux

<>

Fri, 24 Jan 1997 14:47:50 -0500 (EST)

35 lines

Re: removing RMA flux

<>

Thu, 23 Jan 1997 15:58:35 -0500 (EST)

36 lines

RE: removing RMA flux

DAVY.J.G-

Thu, 23 Jan 1997 10:04:54 -0500

76 lines

Re: removing RMA flux

<>

Thu, 23 Jan 1997 08:15:31 -0500

69 lines

removing RMA flux

OPPENHEIMER

22 Jan 97 21:15:47 EST

36 lines

New Thread

Repeat: Retinning

Re: Repeat: Retinning

<>

Mon, 27 Jan 97 10:42:55

72 lines

Repeat: Retinning

<>

Sun, 26 Jan 1997 18:32:53 -0500 (EST)

40 lines

New Thread

Resource Planning and Execution Systems Meeting

Resource Planning and Execution Systems Meeting

Anthony Hilvers

Thu, 23 Jan 1997 13:22:21 -0600 (CST)

58 lines

New Thread

reverse pulse plating system

Re[2]: reverse pulse plating system

<>

Fri, 24 Jan 97 09:00:47 MST

53 lines

Re: reverse pulse plating system

Thomas E. Waznis

23 Jan 97 19:32:12 -0800

59 lines

RE: REVERSE PULSE PLATING SYSTEM

<>

Thu, 23 Jan 1997 11:53:37 EST

60 lines

Re: reverse pulse plating system

ddsulliv

Thu, 23 Jan 97 08:14:33 cst

112 lines

REVERSE PULSE PLATING SYSTEM

<>

Thu, 23 Jan 1997 07:34:03 EST

53 lines

reverse pulse plating system

<>

Thu, 23 Jan 1997 17:34:25 +0500

46 lines

New Thread

reverse pulse plating system -Reply

Re: reverse pulse plating system -Reply

<>

Fri, 24 Jan 1997 00:01:34 -0500 (EST)

37 lines

reverse pulse plating system -Reply

David Anderson

Thu, 23 Jan 1997 11:30:48 -0600

70 lines

New Thread

Re[2]: ASSY: J-STD-001 vs. IPC-A-610

RE: Re[2]: ASSY: J-STD-001 vs. IPC-A-610

Goldman, Patricia J.

Mon, 13 Jan 97 08:33:00 PST

124 lines

New Thread

Re[2]: ASSY: thermocouple adhesive

Re: Re[2]: ASSY: thermocouple adhesive

Eduardo E Wong

Sat, 11 Jan 1997 02:28:10 PST

120 lines

New Thread

Re[2]: E-Mail addresses

Re: Re[2]: E-Mail addresses

<>

Fri, 24 Jan 1997 14:23:17 -0500

99 lines

New Thread

Re[2]: FAB: Horizontal versus vertical etching

Re: Re[2]: FAB: Horizontal versus vertical etching

Luis Rivera

Thu, 30 Jan 1997 07:27:16 +600 CDT

154 lines

New Thread

Re[2]: Laser via source

RE: Re[2]: Laser via source

Thomas, Kevin

Fri, 31 Jan 1997 10:07:00 -0700

130 lines

New Thread

Re[2]: Ni Resins for Gold Plating

Re: Re[2]: Ni Resins for Gold Plating

<>

Wed, 15 Jan 1997 08:12:43 +0000

169 lines

New Thread

Re[2]: Post Baking Process

Re: Re[2]: Post Baking Process

R_R_HOLMES

Tue, 28 Jan 97 07:37:47 EST

100 lines

RE: Re[2]: Post Baking Process

Campbell, Todd @ GSC

Tue, 28 Jan 97 08:12:00 PST

95 lines

New Thread

Re[2]: Stripping photo resist problem

Re: Re[2]: Stripping photo resist problem

Michael Barmuta

Fri, 24 Jan 1997 09:21:28 -0800

159 lines

New Thread

Re[3]: FAB-Dish downs in copper circuits

Re: Re[3]: FAB-Dish downs in copper circuits

<>

Tue, 28 Jan 1997 16:54:27 -0600 (CST)

49 lines

New Thread

Rigid Laminate stabilty

Re: Rigid Laminate stabilty

freedom

Fri, 31 Jan 1997 16:19:59 -0800

81 lines

Rigid Laminate stabilty

Ed Cosper

Fri, 31 Jan 1997 11:04:08 -0600

59 lines

New Thread

Roku Roku Sangyo, Ltd.

Roku Roku Sangyo, Ltd.

William Johnson

Thu, 16 Jan 97 22:22:50 UT

34 lines

New Thread

ROLLER SWELLING

ROLLER SWELLING

<>

Wed, 08 Jan 97 15:02:36 PST

53 lines

New Thread

Rule: Re: offset stripline

Re: Rule: Re: offset stripline

jseeger

Thu, 16 Jan 1997 17:42:24 -0500

71 lines

Re: Rule: Re: offset stripline

<>

Thu, 16 Jan 97 11:13:19 -0800

71 lines

New Thread

Rule: Re[2]: ASSY: IR Reflow of Thru-Hole Components -Reply

Rule: Re[2]: ASSY: IR Reflow of Thru-Hole Components -Reply

Dan Lorinser

Thu, 16 Jan 1997 06:43:41 -0600

67 lines

New Thread

science fair

science fair

Eidschun Engineering, Inc.

Mon, 20 Jan 1997 12:59:34 -0400

57 lines

New Thread

screen ink

screen ink

[log in to unmask]

Mon, 06 Jan 1997 12:13:23 +0800

63 lines

New Thread

SEM LabTest and Analysis Facilities

SEM LabTest and Analysis Facilities

James W Baker

31 Jan 1997 05:45:49 -0700

129 lines

New Thread

Shelf Life of Fused Tin/Lead Coated PWBs

Shelf Life of Fused Tin/Lead Coated PWBs

ddsulliv

Thu, 16 Jan 97 17:27:01 cst

53 lines

New Thread

Shelf Life of Solderable Finishes

Shelf Life of Solderable Finishes

Chris Hunt

Fri, 17 Jan 97 11:21:59 GMT

108 lines

New Thread

signup of Joe Dickson

signup of Joe Dickson

Joe Dickson

Wed, 22 Jan 1997 16:51:14 PST

42 lines

New Thread

Silver Halide Film Development

RE: Silver Halide Film Development

Murray, George @ GSC

Tue, 21 Jan 97 15:13:00 PST

101 lines

RE: Silver Halide Film Development

Bob Mesick

Thu, 16 Jan 1997 08:30:26 -0800 (PST)

47 lines

RE: Silver Halide Film Development

Goldman, Patricia J.

Wed, 15 Jan 97 13:20:00 PST

95 lines

RE: Silver Halide Film Development

Bert Ohlig

Wed, 15 Jan 97 13:55:09 UT

100 lines

Silver Halide Film Development

<>

Tue, 14 Jan 1997 19:44:54 -0500 (EST)

64 lines

New Thread

Silver Halide Film Development (Waste Mgmnt)

Silver Halide Film Development (Waste Mgmnt)

Isaac Stringer

Wed, 15 Jan 1997 17:53:40 -0800 (PST)

143 lines

New Thread

Silver Halide Film Development -Reply

RE: Silver Halide Film Development -Reply

Bob Stumpf

Wed, 15 Jan 1997 15:07:15 -0800

133 lines

New Thread

SM version of a through-hole cap

Re: SM version of a through-hole cap

Max Bernhardt

Wed, 29 Jan 1997 08:15:00 -0600

130 lines

Re: SM version of a through-hole cap

<>

Tue, 28 Jan 1997 14:49:05 -0700

163 lines

Re: SM version of a through-hole cap

<>

Tue, 28 Jan 1997 14:49:40 -0700

163 lines

Re: SM version of a through-hole cap

<>

Tue, 28 Jan 1997 14:48:15 -0700

163 lines

SM version of a through-hole cap

<>

Tue, 28 Jan 97 10:45:16 MDT

45 lines

New Thread

Software

Re: Software

<>

Thu, 2 Jan 1997 14:06:38 -0500

43 lines

Re: Software

<>

Thu, 02 Jan 97 07:53:18 EST

59 lines

Re: Software

Poh Kong Hui

Thu, 2 Jan 1997 07:57:31 +0800 (SST)

61 lines

Software

tonghh

Wed, 1 Jan 1997 19:00:46 +0800

38 lines

New Thread

Solder blow-out in soldered PTH assemblies

Re[2]: Solder blow-out in soldered PTH assemblies

KPCHAN

Sat, 04 Jan 97 09:38:32 PST

86 lines

RE: solder blow-out in soldered PTH assemblies

DAVY.J.G-

Thu, 2 Jan 1997 13:55:35 -0500

98 lines

New Thread

Solder Joint Reliability & Standards

Re: Solder Joint Reliability & Standards

VS

Wed, 22 Jan 1997 22:57:26 -0500

75 lines