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January 1997

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Subject:
Tenting Process
From:
Hawk Chen <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Tue, 14 Jan 1997 11:23:09 +0800
Content-Type:
text/plain
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text/plain (25 lines) 
Hi My Dear Friends:

   Now, we are on the intersection of tenting process(negative,
no panel plating) and traditional process (panel plating + 
pattern plating).

   Are there somebody experience to this two kinds of process,
Which one is better, why? 


Hawk Chen
Gloria R & D Chief

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