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January 1997

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Subject:
From:
Bob Poirier <[log in to unmask]>
Date:
Tue, 28 Jan 1997 09:24:04 -0800
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Andrew, could you be a little more specific on what you mean by holes
in the solder mask? I am not sure what you are trying to describe. Is the
solder mask peeling or is the surface attacked?

>>> "Andrew Buonviri" <[log in to unmask]> 01/24/97
07:22pm >>>




We just got a batch of boards back from our assembler today with holes
in
the soldermask.  The mask used was Taiyo Green LPI.  Our assembler
has
recently started using a no-clean process, and I'm wondering if that
might
have had an effect on the soldermask and caused it to weaken... either
that
or the boards just got a bad batch of mask to begin with.  Anyone have
any
ideas?

Andy Buonviri
[log in to unmask]


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