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January 1997

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Subject:
From:
"Eidschun Engineering, Inc." <[log in to unmask]>
Date:
Mon, 20 Jan 1997 12:59:34 -0400
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Hi Technetters!!

     We received this e-mail and thought we would pass it along to anybody
who might like to respond.


>Return-Path: <[log in to unmask]>
>From: [log in to unmask]
>Date: Sat, 18 Jan 1997 13:44:32 -0500 (EST)
>To: [log in to unmask]
>Subject: science fair
>
>         I'm in the 6th grade and my school is having a science fair. The
>question I'm researching is: "How does copper plating take place?" I was
>wondering if you could send me some information I could use in my report or
>experiment.
>
>E-Mail: [log in to unmask]
>Home: RR3, Box 309 Horseshoe Lane Vestal, NY  
>
>

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