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Subject:	Re: Unidentified subject!
From:	[log in to unmask]
Date:	Tue, 21 Jan 1997 07:01:31 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (50 lines)


     One method is to utilize the TGA (Thermogravimetric Analysis) or 
     reference the IPC-TM-650 Method 2.6.3
     
     D.Drake
     Sperry-Sun Drilling Services


______________________________ Reply Separator _________________________________
Subject: Unidentified subject!
Author:  [log in to unmask] at Internet-Mail
Date:    1/21/97 12:37 AM


>Message was resent -- Original recipients were:
To:
[log in to unmask]
--------------
Dear technet users,


     How do we find out the amount of moisture content in a printed circuit     
board 


Regds 

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