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January 1997

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Subject:
Soldermask Peeling
From:
"Andrew Buonviri"<[log in to unmask]>
Date:
Fri, 24 Jan 1997 15:47:19 -0400
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We just got a batch of boards back from our assembler today with holes in
the soldermask.  The mask used was Taiyo Green LPI.  Our assembler has
recently started using a no-clean process, and I'm wondering if that might
have had an effect on the soldermask and caused it to weaken... either that
or the boards just got a bad batch of mask to begin with.  Anyone have any
ideas?

Andy Buonviri
[log in to unmask]


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