I am interested in the reasoning in selecting point geometry used to
contact gold over nickel pads on SMD boards. In some cases customers are
requesting  (high spring force, hardened steel pointed probes) and
others are requesting round gold pleated moderate spring force probes. 

The application is the same SMD pads with gold, what are the
considerations in testing these pads.
What are the different considerations for point geometry for different
surfaces.

I am most interested in why sharp hard points, rather than domed gold
contacts, are used for gold pads?

Is pad damage not an issue?  Is the problem simple related to dirty
boards?

Thanks in advance.

---------------------------------------------
Edward G. Shea          |  Tel (909)981-1810
Test Connections Inc.   |  Fax (909)981-3015
Upland CA. 91786        |  [log in to unmask]
---------------------------------------------

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