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January 1997

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Subject:
Re: Thermal relief gap width
From:
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Date:
Wed, 29 Jan 1997 12:01:48 -0500 (EST)
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Nick

IPC-D-275 states that the clear area should be no less than 0.010 inch. This
number takes into account the difficulties in etching and the subsequent
inspection of a large copper plane. 

This requirement meets general board manufacturing capabilities . However,
you may be able to find some specialized fabricators that can do better.

Regards,

Gary Ferrari
IPC Staff

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