Ted (and everyone else)

We are precleaning chemically and vacuum baking the substrate.  We coat with an 
exit temperature equivelant to 140 F.  The panels are coated and printed in a 
clean room held at 70 F and 45 to 50% RH.  We are using the mfg. suggested 
exposure or slightly lower.  They are developed within the hour.  The entire 
product cycle is only two days.  These panels are copper plated with only a few 
microns of acid copper.

I have good results with other resists.  We have several part numbers which 
require sub 2 mil features on half ounce copper.

I am hoping someone with experiance using this resist has suggestions or the 
answer.

Thanks

Chuck
______________________________ Reply Separator _________________________________
Subject: Re: Stripping photo resist problem
Author:  [log in to unmask] at ccUnix
Date:    1/23/97 2:47 PM


[log in to unmask] wrote:
> 
> HI
> 
> I know that some of you out there are having excellant results using the 
Morton
> MX series photo resist for pattern plating.  I am experimenting with this
> material and I to have resolved some remarkably small and difficult patterns. 
> 
> But I need some advise that the Morton rep's can't seem to give me.  How do 
you
> guys strip this stuff.  I use Alkastrip AQI in my stripper (Monoethanolamine) 
at
> 7% at 120 F. for the regular resist.  I have tried raising the concentration 
to
> 10% and the temperature up to 132 F. and there is still resist.  I tried 5 % 
> NaOH at 125 F., this improved the situation but there is still some residual 
> resist on these panels.
> 
> I will appreciate any thoughts.  Thanks in advance. 
> 
> Chuck Brummer
> Acuson
> (818) 734-4930
> [log in to unmask]
Dear Chuck:

Not sure if I can help regarding the specific dry film you are using, 
but what is your cleaning process prior to resist lam?  Do you have any 
problems developing this film?  Lastly, what environment is the resist 
exposed to after developing prior to resist stripping?

Ted Stern

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