To all technet users , 

     Recently a friend of mine encountered spot soldermask peeling  on the
copper
area particularly more serious with 0.8mm/1.0mm laminate thickness and
especially 
more pronounced with via hole panel.The abnormal case is the spot peeling
happened
sometimes on the top or bottom location of panel of either solder/component
side ,% on both top/bottom location of panel of solder/component side is low .

They are using brushing followed by chemical treatment for surface cleaning
running
at 1m/min .Can anyone please advise and help out on this . I suspect it to
be the 
poor drying of the surface cleaning line but I need someone who are expert to
highlight on the following :-
  
In order to run at 1 to 1.5m/min , what should be
     i.No of air knife be used/Special design needed
     ii.Distance travelled in the drying chamber
     iii.Volume of the hot air
     iv.Temperature setting 

Any feedbacks is welcome .Thanks .

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