Hi
We have had a similar problem but with thicker boards, 3.2 mm.
We have run some test increasing the drying but the results have been the
same.
To solve the problem we put the thicker boards in an oven for 3 hours at
110
°C just before HAL.

Hope this helps

A.Daniel

----------
> From: tonghh <[log in to unmask]>
> To: [log in to unmask]
> Subject: Spot peel-soldermask
> Date: martes 21 de enero de 1997 13:37
> 
>      To all technet users , 
> 
>      Recently a friend of mine encountered spot soldermask peeling  on
the
> copper
> area particularly more serious with 0.8mm/1.0mm laminate thickness and
> especially 
> more pronounced with via hole panel.The abnormal case is the spot peeling
> happened
> sometimes on the top or bottom location of panel of either
solder/component
> side ,% on both top/bottom location of panel of solder/component side is
low .
> 
> They are using brushing followed by chemical treatment for surface
cleaning
> running
> at 1m/min .Can anyone please advise and help out on this . I suspect it
to
> be the 
> poor drying of the surface cleaning line but I need someone who are
expert to
> highlight on the following :-
>   
> In order to run at 1 to 1.5m/min , what should be
>      i.No of air knife be used/Special design needed
>      ii.Distance travelled in the drying chamber
>      iii.Volume of the hot air
>      iv.Temperature setting 
> 
> Any feedbacks is welcome .Thanks .
> 
>
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