"Tinning house" (5 Messages)
"Wet" Soldermask (1 Message)
3D Stereoscopes (2 Messages)
55110E (4 Messages)
<No subject> (1 Message)
<none> (4 Messages)
Ablebond??? (1 Message)
Absorption mechanism of PTH (2 Messages)
ACF vs Soldering (1 Message)
Adhesive applicatiion equipment on flex rigid boards (1 Message)
Adhesive applicatiion equipment on flex rigid boards. (6 Messages)
ADMIN: IPC Chat (5 Messages)
ADMIN: IPCchat - good news (1 Message)
ADMIN: IPCchat session announcement (2 Messages)
ADMIN: TechNet problem (1 Message)
ADMIN: What is Eric's Number (1 Message)
Alumina Oxide Surface Prep (2 Messages)
Aluminum oxide scrubbers (1 Message)
ANSI/IPC-R-700c (1 Message)
Area Code Change 310---->>>> 562 (1 Message)
Aspect Ratio (1 Message)
Aspect Ratios (5 Messages)
Aspect Ratios -Reply (2 Messages)
ASS:Wave Solder Board Support (1 Message)
ASSEM: Copper Choride problem (6 Messages)
ASSEM: Re: JEDEC Info. (1 Message)
Assem: under stencil cleaner (2 Messages)
Assembly (3 Messages)
Assembly: ESD (3 Messages)
Assembly: ESD -Reply (1 Message)
ASSM: Top fillet formation (1 Message)
ASSY (3 Messages)
ASSY : Ionic Contamination on FR2 (5 Messages)
ASSY : pretinning of fine-pitch devices (3 Messages)
ASSY: adhesive pads (1 Message)
ASSY: Desiccant Quantity for 15 Year Storage of VMEs (2 Messages)
ASSY: Fine Pitch Solder Joint Inspection Method? (6 Messages)
ASSY: Florida Cirtech (WS120 and WS130) (1 Message)
ASSY: IR Reflow of Thru-Hole Components (8 Messages)
ASSY: J-STD-001 vs. IPC-A-610 (4 Messages)
ASSY: Jumpers and cuts (3 Messages)
ASSY: Low Tin Level in Wave Solder (10 Messages)
ASSY: Manix Component Counter (or similar) (2 Messages)
ASSY: Manix Mfg Component Counter (or similar) (1 Message)
ASSY: Moire Interferometry (2 Messages)
ASSY: MTBF for Components, relating to ESD (1 Message)
ASSY: OSP coatings (5 Messages)
ASSY: Pre-tinning of Gold Leads (5 Messages)
Assy: Press Fit (2 Messages)
assy: Press In (1 Message)
Assy: Rigid Flex (2 Messages)
ASSY: Solder Paste Process Control (1 Message)
Assy: Solder Skip (3 Messages)
ASSY: thermocouple adhesive (7 Messages)
ASSY: TSOP with Alloy 42 lead frame field failures (3 Messages)
ASSY: TSOP/PLCC reliability (1 Message)
ASSY:J-STD-001 vs. IPC-A-610 (1 Message)
ASSY:Mil-std 55110?? (3 Messages)
ASSY:solder paste qual (1 Message)
Assy:TopLine (9 Messages)
AW: Re: dielectrics for dif materials (1 Message)
backfilling holes at press (1 Message)
BGA :ASSY/REWORK (3 Messages)
BGA's machines (1 Message)
blanks boards (1 Message)
Breakaway holes (1 Message)
Breakaway holes and V-groove scoring (1 Message)
Buried Capacitance / Resistance (3 Messages)
Call for Speakers in London (1 Message)
Can somebody give me some advice? (2 Messages)
CIMS (1 Message)
Circo Flex (1 Message)
cleaners for RMA flux (5 Messages)
Compressors (2 Messages)
Conductive foam (5 Messages)
conformal coating help (6 Messages)
Conformal Coating Suppli (1 Message)
Conformal Coating Supplier (1 Message)
conformal coating vendor request (2 Messages)
Connector placement (2 Messages)
Contact pads (1 Message)
Controlled Impedance (5 Messages)
controlled impedance p.c.b's (2 Messages)
convection rates (4 Messages)
Copper (2 Messages)
Copper scopping in solder (1 Message)
Creep Rupture testing on BGA (1 Message)
current carrying capacity (2 Messages)
current in screened silver circuits (4 Messages)
defect ppm data (1 Message)
Depanelising Ceramic Substrate (1 Message)
DES- Gerber formats? (1 Message)
DES/FAB:switchpad contacts (2 Messages)
DES: Ag polmer via holes (1 Message)
DES: Ag polmer via holes - contact (1 Message)
DES: Heat Rise Calculations For Flex Part II (1 Message)
DES: Internodal Capacitance & Inductance (1 Message)
DES: package style ? (1 Message)
Des: temp rise (current) (1 Message)
DES: trace layout (4 Messages)
Design issues (current carrying variables) (3 Messages)
Design Standards for BGA (6 Messages)
Dielectric Constant of FR-4 and Getek (1 Message)
dielectrics for dif materials (3 Messages)
Direct metallization (1 Message)
Direct metallization for MIL grade PCBs. (2 Messages)
direct plating (1 Message)
Dispenser for solder preforms (1 Message)
DOC:IEC Component value code (6 Messages)
Drill Spindle Runout (2 Messages)
Dry Film Solder Mask (2 Messages)
Dry Film Soldermask (2 Messages)
dynamic spindle runout (1 Message)
E-Mail addresses (7 Messages)
Edmund Scientific Catalog (2 Messages)
Effects of temp on growth rate of tin oxide and Cu-Sn IM (1 Message)
Effects of temp on growth rate of tin oxide and Cu-Sn IMC (1 Message)
Employment (1 Message)
Entek Plus Cu-106A (3 Messages)
epoxy screening 0603's (2 Messages)
epoxy vs. solder paste (2 Messages)
Exposed circuits (4 Messages)
Exposed circuits -Reply (1 Message)
Fab (6 Messages)
FAB - Defective units on panelized PWBs (4 Messages)
FAB - Matte masks (1 Message)
FAB -Reply (2 Messages)
FAB Clear LPI (1 Message)
fab SM questions (2 Messages)
FAB-Dish downs in copper circuits (6 Messages)
FAB: (3 Messages)
FAB: Carbon Ink vs. Gold Contact Fingers (2 Messages)
FAB: Ceramic Alternative (1 Message)
FAB: Clean before solder mask (2 Messages)
FAB: Clear LPISM (2 Messages)
FAB: Core Filling (1 Message)
FAB: CU/Invar/Cu suppliers (1 Message)
FAB: CU/Invar/Cu suppliers -Reply (2 Messages)
FAB: Cupric chloride regeneration with sodium chlorate (2 Messages)
FAB: Deburr (1 Message)
Fab: Drill Entry Questions (1 Message)
FAB: Electrolytic plating propogation rate testers (2 Messages)
FAB: Embedded High Density (1 Message)
FAB: exposed copper? (1 Message)
Fab: Extended Material Cure Cycles (2 Messages)
Fab: Finish LPI thickness on circuits (7 Messages)
FAB: Hole filling (1 Message)
FAB: Horizontal versus vertical etching (6 Messages)
FAB: Immersion tin coating (1 Message)
fab: immersion tin coatings (5 Messages)
FAB: IPC Printed Circuits Expo (4 Messages)
FAB: Panelization Software (1 Message)
FAB: Plating distribution/ATE/AOI (1 Message)
FAB: prepreg fill (1 Message)
FAB: Rick Taormino; diazo film and LPI solder mask (1 Message)
FAB: Supplier: Job Opportunities Posting (1 Message)
Fab: To Equipment Mfr's & Field Serv Org's (1 Message)
FAB: Woven Kevlar (1 Message)
FAB:ASS: Solder Balling Resist Trials (1 Message)
FAB:ASS: Solder Finish Symposium, UK (1 Message)
FAB:ASSY: Solder ball free solder resist ?? (1 Message)
FAB:Cedal ADDARA PRESS LAMINATOR (2 Messages)
FAB:cross grain construction (4 Messages)
FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING (1 Message)
FAB:Roller swelling (3 Messages)
Fabrication (1 Message)
Fabrication of Large Printed Circuit Boards (3 Messages)
Fabrication of Printed Circuit Boards (6 Messages)
fiducial recognition problems (3 Messages)
Filling clearance holes in thick metal innerlayer planes (1 Message)
final cleaning of pwb's (1 Message)
Flex (2 Messages)
flexible circuit (1 Message)
Flexible Soldermask (2 Messages)
Floating waste water treatment sludge (7 Messages)
Flying Probe Testers, Another voice heard! (1 Message)
FOOTPRINT PQFP208 (2 Messages)
FR4 moisture absorption rate (1 Message)
FR4 processing and properties (1 Message)
Freezing electroless tin: oxide, IMC, whiskers, and pest (2 Messages)
Fuji Tape leaf covers (1 Message)
GEN- ISO and Calibration (1 Message)
GEN: Book Review (2 Messages)
GEN: Book Review for Flex (1 Message)
GEN: CMI After Etch (1 Message)
GEN: Condor Nonsense (3 Messages)
GEN: Condor Nonsense -Reply (1 Message)
GEN: Electrowinning Units (2 Messages)
GEN: Electrowinning Units (Long) (1 Message)
GEN: ISO and Calibration (6 Messages)
GEN: Lead Coplanarity Spec?? (5 Messages)
Gen: Looking for Bachi Inc. and Meteor Inc. (2 Messages)
Gen: Obsoleted Military Documents (1 Message)
GEN: PWB Contract Manufacturers (1 Message)
GEN: Shelf life for components... (4 Messages)
GEN: Vision Engineering; Just gotta vent (2 Messages)
GEN: Where in the world is Ralph Hersey? (4 Messages)
GEN: Where in the world is Ralph Hersey? -Reply (1 Message)
Gold as Etch Resist (7 Messages)
Gold wiring bonding (2 Messages)
handling silver halide wastes (1 Message)
heat capacity (2 Messages)
Hooray for Bob Mesick! (1 Message)
how much force to apply on pcb? (1 Message)
Hull Cell criteria (4 Messages)
I found them !! (1 Message)
IEC 1112 (2 Messages)
IEC 249-2-9-FVO-EP-CP (2 Messages)
IEEE WEBSITE? (3 Messages)
ImageFlex (2 Messages)
immersion tin (3 Messages)
Immersion Tin coatings (1 Message)
Info: AT Brackets - GLOBE? (4 Messages)
Inner Layer Core Prep (1 Message)
IPC Chart on Hi Density Interconnect (1 Message)
IPC Chat (3 Messages)
IPC CHAT -Reply (1 Message)
IPC Convention, San Jose, CA March '97 (1 Message)
IPC Convention, San Jose, CA March '97 (fwd) (1 Message)
IPC Printed Cts Expo (1 Message)
IPC Source for PWB Products/Services (1 Message)
IPC-D-356 (4 Messages)
IPC-D-356 and IPC356A (1 Message)
IPC-D-356 Netlist Testing (1 Message)
IPC-RB-276 (1 Message)
IPC-RB-276 is OBSOLETE! (2 Messages)
IPC-RB-276 is OBSOLETE! -Reply (5 Messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply (4 Messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply -Reply (1 Message)
IPC-SM-840 (4 Messages)
ipc356 netlist (1 Message)
IPCchat (1 Message)
IPCchat session announcement (4 Messages)
Is the use of Masking Tape an ESD Event ?? (3 Messages)
ISO and calibration (1 Message)
JEDEC Info. (1 Message)
Job listing (1 Message)
LA, Calif meeting (1 Message)
lab facilities for SEM testing (6 Messages)
Labs (1 Message)
Laser via source (6 Messages)
lifed pads (2 Messages)
Manufacturing Engineer Seeking Employment. (3 Messages)
Marking (11 Messages)
Marking -Reply (1 Message)
marking ink (1 Message)
Masking Tape and ESD Damage (2 Messages)
measuring paste height (10 Messages)
melf's (3 Messages)
melf's, J-STD-001, IPC-610 (5 Messages)
MIL Std. -2000- ??? (2 Messages)
missing components (3 Messages)
Mixed Tech Assy (1 Message)
MTBF/ESD/EOS (1 Message)
Need HELP with Mydata machines (4 Messages)
Nepcon West'97 (3 Messages)
New Substrate Materials for P-BGA (3 Messages)
Ni Resins for Gold Plating (4 Messages)
No clean Fluxes (1 Message)
No messages (1 Message)
NO MORE RULE MESSAGES! (1 Message)
NO SUBJECT (1 Message)
Off topic subject - do not read for technical info. (1 Message)
offset stripline (1 Message)
Optimizing for Fine Pitch Devices in SMT (2 Messages)
ORC exposure machine (3 Messages)
other forums (2 Messages)
package style ? (6 Messages)
Panelization Software (fwd) (1 Message)
Paper Phenolic Assemblies (1 Message)
paraCHAT (2 Messages)
PEM Reliability (2 Messages)
Phone request (3 Messages)
Photo-initiation (7 Messages)
Phototool dimensional stability (5 Messages)
Plasma (5 Messages)
Plastic Package Hemeticity (1 Message)
plastic package hermeticity (7 Messages)
Plotter manufacturers for PCB (1 Message)
Post Baking Process (8 Messages)
Post Baking Process - Bravo! (1 Message)
pqfp208 footprint land pattern (1 Message)
Probimer 74 (1 Message)
Proto-type Quick Turn Boards (5 Messages)
Proto-type Quick Turn Boards -Reply (3 Messages)
Proto-type Quick Turn Boards -Reply -Reply (1 Message)
PWB manufacturing question? (1 Message)
qualification plan for BGA soldering process. (4 Messages)
qualification plan for BGA soldering process. -Reply (1 Message)
Query (1 Message)
Quick Turn Boards (1 Message)
Raw card MFG process (2 Messages)
Re : Re: Woven Kevlar (2 Messages)
RE dielectric values for dif (2 Messages)
Re Re:Solder blow-out in soldered PTH assemblies (1 Message)
Re [2]: lifed pads (1 Message)
Reflow of Through-hole (2 Messages)
Reflow Soldering of PTH Connectors (4 Messages)
Reliability issues and failure modes of Plastic packages (1 Message)
Reliability Testing (3 Messages)
removing RMA flux (6 Messages)
Repeat: Retinning (2 Messages)
Resource Planning and Execution Systems Meeting (1 Message)
reverse pulse plating system (6 Messages)
reverse pulse plating system -Reply (2 Messages)
Rigid Laminate stabilty (2 Messages)
Roku Roku Sangyo, Ltd. (1 Message)
ROLLER SWELLING (1 Message)
Rule: Re: offset stripline (2 Messages)
Rule: Re[2]: ASSY: IR Reflow of Thru-Hole Components -Reply (1 Message)
science fair (1 Message)
screen ink (1 Message)
SEM LabTest and Analysis Facilities (1 Message)
Shelf Life of Fused Tin/Lead Coated PWBs (1 Message)
Shelf Life of Solderable Finishes (1 Message)
signup of Joe Dickson (1 Message)
Silver Halide Film Development (5 Messages)
Silver Halide Film Development (Waste Mgmnt) (1 Message)
Silver Halide Film Development -Reply (1 Message)
SM version of a through-hole cap (5 Messages)
Software (4 Messages)
solder blow-out in soldered PTH assemblies (2 Messages)
Solder Joint Reliability & Standards (3 Messages)
Solder Mask Peel Off (4 Messages)
Solder Mask Peel Off - 2 (1 Message)
Solder pallets (1 Message)
Solder Paste Plastic or Eutectic (1 Message)
Solder purification (copper removal) (2 Messages)
Solder Resist Plugs (3 Messages)
Solder Resist Plugs II (2 Messages)
Soldering Profiles (6 Messages)
Soldermask Peeling (3 Messages)
Soldermask Peeling -Reply (1 Message)
SOT23 leadframe alloy (2 Messages)
Space Qualified Solder Mask (2 Messages)
Space Qualified Solder Mask -Reply (1 Message)
Spot peel-soldermask (3 Messages)
Sputtering (1 Message)
Standard Time Data (2 Messages)
Stripping photo resist problem (7 Messages)
Subj: Center Support Wire (3 Messages)
substrate material (2 Messages)
Substrate Materials. (1 Message)
Surface Leakage Testing (2 Messages)
Surface Mount Test Points (2 Messages)
technet (1 Message)
TechNet-d Digest V97 #30 (1 Message)
temp profile (4 Messages)
temp rise (current) (1 Message)
Temperature profile (2 Messages)
Tenting Process (2 Messages)
Terra Universal Dessicant Chambers (1 Message)
Test house for ipc tm-650 tests (1 Message)
Test temperature range (6 Messages)
Test temperature range / SM reliability (1 Message)
TEST: Re: Test temperature range (2 Messages)
thanks (1 Message)
Thanks for Proto-Type house leads (1 Message)
The shape of test probes for SMD (4 Messages)
Thermal relief gap width (3 Messages)
Thermal relief gap width -Reply (1 Message)
Thermal sensitive sheet (3 Messages)
Thermal sensitive sheets (1 Message)
Time to train operators: J-STD-001 and LRNC flux (5 Messages)
Tin Coatings (4 Messages)
Tom's Apology (1 Message)
Trace Damage from Breakaway Holes (6 Messages)
Trace Damage from Breakaway Holes -Reply (1 Message)
Transmission test (1 Message)
TSOP placement (1 Message)
Unidentified subject! (9 Messages)
Unidentified subject! (Cu balance) (1 Message)
unsubscribe (1 Message)
Use of standards to ensure solder connection reliability (1 Message)
Use of the term "alumina" (1 Message)
Vacuum frames (1 Message)
vias (5 Messages)
VP precision (1 Message)
Washing Stencils (3 Messages)
WAVE SOLDERING SMT ICS (6 Messages)
Whatever happened to ?? (2 Messages)
White soldermask (8 Messages)
Who is Tom Bresnan? (4 Messages)
Who is Tom Bresnan? Son of Victor Johansen, perhaps? (1 Message)
Woven Kevlar (1 Message)
WS-609 paste clean and SM part for filter capacitor (2 Messages)
Xray technology (2 Messages)
XRF Plating thickness measurement (2 Messages)
[2] ASSY: IR Reflow of Thru-Hole Components (1 Message)