!00% Electrical Test (3 Messages)
...copper foil thickness... (2 Messages)
1600 Volt Electrical Test (4 Messages)
4 March 98 Meeting, Tech Soci NepconWest (Anaheim, Calif) (1 Message)
55100 vs 31032 vs 6012 (2 Messages)
: Cleaning boards with conformal coat (2 Messages)
: FAB: Flash Gold (3 Messages)
??????TQFP FOOT PRINT SAME AS PQFP??????? (3 Messages)
Address of SSThal (2 Messages)
Admin Comment: [TN] MATERIAL FOR SALE (1 Message)
ALERT: Document in "" was suspended; (1 Message)
Alpha 564 replacement (3 Messages)
Alphalevel as replacement for electroplated Ni/Au (3 Messages)
AlphaLevel as replacement for Electroplated Nickel Gold (4 Messages)
ANSI/IPC-A-610 Revision B - Section 4.1 (3 Messages)
Apology to all (1 Message)
ass'y (2 Messages)
Assembly - Component Mounting (2 Messages)
Assembly - Solder reflow (2 Messages)
Assembly/Solderability (1 Message)
ASSY: Intermittent Short (5 Messages)
ASSY: IPC Benchmark Study (2 Messages)
ASSY: Level III Testing (1 Message)
ASSY: PARTS SOLDERABILITY (5 Messages)
ASSY:Preventive Maintenance Cleaning of PWB Assemblies (3 Messages)
ASSY:PVA equipment (2 Messages)
ASSY:PVA equipment -Reply (2 Messages)
ATTN: BUY stamp mark inks (1 Message)
Automatic Spray Fluxers (2 Messages)
bare board test witness marks (2 Messages)
Bare board testing nd it's impact on assembly (6 Messages)
bare board witness marks (1 Message)
BGA package dimensions (2 Messages)
BGA Re-balling (1 Message)
BGA SIR Patterns (5 Messages)
Bonded heatsinks (2 Messages)
Capacitance Formulas in IPC 317 (1 Message)
Carbon film screening (2 Messages)
CARBON INK (2 Messages)
Carbon Ink Vs. Gold Finish (5 Messages)
carbon ink/film (1 Message)
Causes & Corrective Actions for Solder Balls (5 Messages)
Chip Resistor Value (1 Message)
Chip resistors (3 Messages)
Chip-Scale Process and Assembly (1 Message)
circuit board trace repair (5 Messages)
clarification of wording (2 Messages)
Completly Clean (3 Messages)
Completly Clean - Handbook Info (1 Message)
Component Land Design (2 Messages)
Component Land Design - Charles (1 Message)
Conductor width (2 Messages)
Confirmation of Receipt (1 Message)
Conformal Coating Dewetting (4 Messages)
Conformal Coating equipment (1 Message)
Contact resistance (7 Messages)
copper etching (7 Messages)
copper etching -Reply (4 Messages)
Copper foil thickness (3 Messages)
Copper Foil Weight (1 Message)
Copper sulfate crystals (8 Messages)
Copper sulfate crystals -Reply (1 Message)
Corrosion after electroless tin finish (1 Message)
corrosivity HASL v GOLD (1 Message)
Data Conversion, <*.tif> to photoplotter (3 Messages)
Deburring machine (1 Message)
Delamination (3 Messages)
Delco (1 Message)
DES: Fusing limits of tracks (1 Message)
DI water (2 Messages)
dielectric constant (6 Messages)
Direct plating vs Electroless copper (1 Message)
Double Reflow: Component Weight vs. Pad Contact Area Rat io (2 Messages)
Double Reflow: Component Weight vs. Pad Contact Area Ratio (2 Messages)
Drill Drawing (4 Messages)
Drill format question (5 Messages)
Dross Reduction (1 Message)
DTP Measurements source (1 Message)
Durability of Circuit Boards (1 Message)
early SMT (1 Message)
electrodialytic processes (1 Message)
Electroless basket MFG. (2 Messages)
Electroless Copper wastetreatment (3 Messages)
Electroless Nickel / gold (4 Messages)
electroless nickel vs electrolytic nickel (1 Message)
Electroless nickel vs. electrolytic nickel (1 Message)
Electronic Devices - Age Limits (3 Messages)
Electroplated Tin Finish (2 Messages)
ElectroStatics revamps website related to Static Electricty in printed circuit board manufacturing and other electronics markets. (was Re: [TN] Re Air Ion Level Measurement) (1 Message)
eless Pd (2 Messages)
ENTEK 106A OSP Remaining (1 Message)
Environmental tests for press-fit components (1 Message)
Ergonomic Inspection Equipment/Scopes (1 Message)
Ergonomic issues in Final I (1 Message)
Ergonomic issues in Final Inspection (10 Messages)
ESD (10 Messages)
European Help! (8 Messages)
Exposure Frames (2 Messages)
Exposure Units (1 Message)
Exposure units ? (4 Messages)
FAB - Barrel Cracking (2 Messages)
FAB - Heat-sink (1 Message)
FAB/DES: Electronic data interchange (EDI) (8 Messages)
fab/design EDI (1 Message)
FAB: Electroless Nickel/Immersion Gold for rotary contac ts (1 Message)
FAB: Electroless Nickel/Immersion Gold for rotary contacts (2 Messages)
FAB: French PCB Specifications (1 Message)
FAB: Hydraulic press "how to" reference material (3 Messages)
FAB: Hydraulic press "how to" reference material -Reply (1 Message)
FAB: IPC-4101 vs Mil-S-13949 (2 Messages)
FAB: laboratory electroless nickel (4 Messages)
FAB: laboratory electroless nickel -Reply (1 Message)
FAb: Solderlevel (2 Messages)
FAb: Solderlevel -Reply (5 Messages)
FAB:Special Process (1 Message)
FAR Chrystal catellation termination Solder Joint Criteri (1 Message)
footprint (2 Messages)
FR4 Relative Permittivity (3 Messages)
FR4 vs Polyimide (3 Messages)
Free European Solder Finish Seminar (1 Message)
Fuji SMT Equip. (1 Message)
Gas Tight Testing (1 Message)
GDS Translator (6 Messages)
Gen #2: 1997 IPC Roadmap (1 Message)
Gen: 1997 IPC Roadmap (1 Message)
Gen: dpmo (2 Messages)
Gen: SMTA/IMAPS EXPO '98 Dallas (1 Message)
Gen: Solder ppm (1 Message)
Gen: Use of SMT devices (7 Messages)
Gen: Use of SMT devices -Reply (1 Message)
Gerber Question - Thanks (1 Message)
GLASS ARTWORK (5 Messages)
Gold -Finger Bevel Issue (2 Messages)
Gold Flash vs Gold Plate on PCB connector Fingers (5 Messages)
Gold Porosity (5 Messages)
Goldfingers (1 Message)
Grainy copper deposit. (3 Messages)
Grainy copper deposit. -Reply (2 Messages)
Greater Boston IPCDC Chapter meeting 25-Mar 6pm (1 Message)
Haloing Measurement (2 Messages)
HANDBOOK OF PRINTED CIRCUIT (3 Messages)
HASL thickness Specification (2 Messages)
HASL Thickness Specs. (1 Message)
Heavy metals (4 Messages)
Hole Pattern Accuracy (1 Message)
holes in aluminium (1 Message)
hot air knife (1 Message)
How to reduce Kirkendall void? (3 Messages)
Immersion Gold (3 Messages)
Immersion Gold -Reply (1 Message)
Immersion Gold -Reply - Reliabillity Test [joints] (1 Message)
Immersion gold on flexible circuits (3 Messages)
IMMERSION NICKEL GOLD SPECS (1 Message)
IMPEDANCE vs DK/Er vs Frequency (5 Messages)
Incircuit testing low residue cca's (2 Messages)
Information about laminate type (3 Messages)
Ink marking & Copper thickness device (1 Message)
Innerlayers cleaning (3 Messages)
Innerlayers cleaning-reply (1 Message)
Internet Message (1 Message)
Interpretation help on SEM analysis done on PCBA (3 Messages)
IPC Benchmark Studies (1 Message)
IPC chat session (1 Message)
IPC standard (3 Messages)
IPC-A-610 Questions? (4 Messages)
IPC-A-610B (1 Message)
IPC-D-275 Coupon A (2 Messages)
IPC-D-356 testing (2 Messages)
IPCchat session announcement (2 Messages)
J-001B Question Response. (1 Message)
J-STD-001B Question (2 Messages)
Justification For Environmental Controls (3 Messages)
Kester OSP (4 Messages)
l. (was Re: [TN] Innerlayers cleaning) (1 Message)
Land Pattern and Component Modeling (7 Messages)
Land Patterns, Geometries for Mentor Graphics (1 Message)
Laser Solder Ball bumping (2 Messages)
Lawrence R Blumberg/Endicott/IBM is out of the office. (1 Message)
LCCC on FR4 (5 Messages)
lead coplanarity (2 Messages)
leadframe materials (5 Messages)
Learning Curves (1 Message)
Looking for Excimer Laser (2 Messages)
Manufacturability Data for CBGA vs PBCA (2 Messages)
MATERIAL FOR SALE !!!!GREAT PRICES!!!!!!! (1 Message)
MATERIAL SOURCE: gold/tin wire solder (1 Message)
MATERIAL SOURCE: gold/tin wire solder -Reply (1 Message)
Mating Tin / Gold; SIMMs and sockets (1 Message)
Message Content Question (10 Messages)
Message Content Question -Reply (1 Message)
Microsection etching solution (4 Messages)
Microsection etching solution -Reply (4 Messages)
MIL VS IPC CROSS REF (4 Messages)
mil-c-28809 equivalent (3 Messages)
MIL-PRF-31032 (1 Message)
MIL-STD-171 (2 Messages)
Mixed assemblies and the 'weak knee' associated with HASL (1 Message)
More electroless nickel / gold (2 Messages)
Mound Flexible Circuits Closes 3/13/98 (1 Message)
Multiple Passes Through The Reflow Oven (2 Messages)
NF C20-631 (1 Message)
nitrogen requirements: component storage (1 Message)
No Attachments on the TECHNET, Please (2 Messages)
NON-THERMALLY RELEIVED VIAS (2 Messages)
oblong lands (3 Messages)
Obsolete FR2 1.60mm 35/35 panels (1 Message)
Odd Number Layup-warpage (4 Messages)
oops (2 Messages)
Organic residue in Microetch bath (3 Messages)
OSP COATED BOARDS (4 Messages)
Pad Size (1 Message)
PAGINA WEB (3 Messages)
Palladium (4 Messages)
palladium joints (1 Message)
Palladium Leads (1 Message)
Palladium plated (1 Message)
Palladium Plating... (1 Message)
Panel Thickness & Copper Weight device (2 Messages)
Panelisation software (2 Messages)
Parts Solderability (2) (5 Messages)
patterning non-photoimageables (1 Message)
PCB assy defect reporting criteria (7 Messages)
PCB assy defect reporting criteria -Reply (1 Message)
pcb fab info (4 Messages)
Pd plated boards (1 Message)
Peel force problems (3 Messages)
Photoplotting (1 Message)
Piccoli (1 Message)
Plated through hole reliability (1 Message)
Plating ? (1 Message)
Plating Effects on Current Distribution (2 Messages)
PLATING FIBER (3 Messages)
Plating thin, less than .005", via layers (3 Messages)
Plating: Shadow Defect (3 Messages)
Plisters in Multilayer (2 Messages)
Plotting problems (2 Messages)
polyimide film (2 Messages)
Post Conformal Coat Soldering (3 Messages)
Press fit tooling house for PCB assembly tools (2 Messages)
press-fit connectors (6 Messages)
PTH Positional Hole Tolerance (6 Messages)
PTH Positional Hole Tolerance -Reply (1 Message)
Pull Strengths (1 Message)
Punching molds (4 Messages)
PVA equipment -Reply (1 Message)
Quality Parameters for Wave Sold (4 Messages)
Quality Parameters for Wave Sold -Reply (1 Message)
Re : Request for Subscriber (1 Message)
Re TraceRepair (1 Message)
Re28809 (1 Message)
Read: clarification of wording (1 Message)
Reliability of Ceramic vs. Plastic IC Packages (2 Messages)
Repair: Maximum allowable pad and jumper wires fro repair ? (2 Messages)
REQ: HOLE LOCATION TOLERANCE (1 Message)
Request for info on Crimping standards or workmanship guidelines (2 Messages)
Response to Sam Mccorkels' question. (1 Message)
Returned mail: User unknown (1 Message)
revision (1 Message)
Reward! (2 Messages)
Rinsing blind/small vias (3 Messages)
Roku-Roku Sangyo (1 Message)
sales in the east and south of USA (1 Message)
Secondary reflow during wave (7 Messages)
SIGNOFF Technet (1 Message)
Silicone oil environments (2 Messages)
Silver Plating (1 Message)
Simple Solder Mask Question (7 Messages)
Solder splash problem. (2 Messages)
Solder surface tension measurements. (1 Message)
Solder thief (3 Messages)
Solderballs for FBGA (1 Message)
soldermask cure (5 Messages)
Soldermask Lamination (1 Message)
Specs for Wire Crimping (2 Messages)
standard (2 Messages)
Stencil homogeneity (2 Messages)
Subj: Solid Solder Deposit Technology (2 Messages)
Subscribe< > (1 Message)
Surface Mount Equipment (2 Messages)
TAB Technology (1 Message)
TAHNKS (2 Messages)
Temp/freq dependancy upon diel const & diss fact (2 Messages)
tenting via's (1 Message)
tenting vias (3 Messages)
Test Equipment Compatability (2 Messages)
Test, please ignore (1 Message)
The National Legal Video Association-survey (2 Messages)
Thermal Clad Laminate (1 Message)
Thermal plane "drill/fill/drill" vendor (1 Message)
Thermal Vias (6 Messages)
Thick Au + Solder Ball -> What happens? (1 Message)
TI 32 MM Tape (2 Messages)
Tin-Lead Plating Composition on Device Leads (2 Messages)
Tin/Lead peeling off (4 Messages)
TN:(ASSY) Palladium Plating... (1 Message)
Torque Specs (3 Messages)
TRAINING (1 Message)
UNSUBSCRIBE (1 Message)
URGENT!!!!!! Residues after Reflow (3 Messages)
Vias filled with solder for ICT testing (4 Messages)
VIAS IN SMT PADS (1 Message)
Wafter Diceing Water Req. (3 Messages)
Wave Solder Optimizer Contact (1 Message)
Wavesoldering Pallets (2 Messages)
What is FR404? (3 Messages)
What is FR404? Reply (1 Message)
What is the current price for......? (1 Message)
Why Exposed Die Paddle Degrade the Thermal Performance? (1 Message)
wrist straps (2 Messages)
[ASSY} Prebake -Reply (1 Message)
[CN] Specs for conductor spacing per volt to satisfy FactoryMutual? (2 Messages)
[DC] dielectric constant (1 Message)
[DC] Need suggestions (7 Messages)
[TN] ...copper foil thickness... (1 Message)
[TN] BGA package dimensions (1 Message)
[TN] FAB/DES: Electronic data interchange (EDI) (3 Messages)
[TN] HANDBOOK OF PRINTED CIRCUIT (1 Message)
[TN] mil-c-28809 equivalent (1 Message)
[TN] Parts Solderability (2) (6 Messages)
[TN] PTH Positional Hole Tolerance (1 Message)
[TN] Read: clarification of wording (1 Message)
[TN] Simple Solder Mask Question (1 Message)
[TN] tenting via's (1 Message)
[TN] Wafter Diceing Water Req. (1 Message)
[TN] [DC] Need suggestions (1 Message)