Ed:  In a former life I worked for DOD, was the program manager for a Navy
field repair program (2M) and I have, since then, continued to be involved in
repair to a greater or lesser degree.  Ralph's earlier advice was good.  Check
out the new (soon to be printed) IPC-7711 and IPC-7721 documents (which
replace the former IPC-R-700 Repair Manual).  If you are in a hurry for
information, talk to a fellow named Dan Foster at Pace Inc. in Laurel MD
(301/490-9860) or Jeff Ferry at Circuit Repair Corp. Rowley MA (508/948-7937).
Both have been technical leaders in development of the new IPC documents
mentioned and both are extremely well qualified to discuss the technical
aspects of trace repair.  I think both companies have conducted quality
assurance studies on circuit trace repair (bond strength, peel strength, etc.)
but I'm not sure what type of environmental stresses (if any) were associated
with their tests.  Some of the things that we (DOD) required in the past, and
some of the things you no doubt did, have been superseded by newer/better
materials and techniques and the results are really quite good.
Regards, Jim Moffitt

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