Anna wrote:
>Hello
>I have a question about the standard. When we measure the copper
>thickness in holes and blind vias we use a lins for 200X magnification.
>What says the standard about this? We have the IPC from 1982 and it says
>that we should measure at 100X. At this magnification is hard to se
>properly. Thank you for your help.
>
>E.mail- [log in to unmask]
>--

Anna

IPC-HF-318A, Rev. A, Dec. 91 says:

"... foil and plating integrity at a magnification of 100X, +-5%. Referee examinations
shall be accomplished at a magnification of 200X, +-5%."

Best regards

Simon

------------------------------------------------------------------------------------
Optiprint AG
Simon Huetter           Tel.:   +41 71 878 77 77
Dipl. El. Ing. HTL      Fax.:   +41 71 878 77 66
R&D                     e-mail:  [log in to unmask]
------------------------------------------------------------------------------------
http://www.optiprint.ch
------------------------------------------------------------------------------------

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################