Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 31 Mar 1998 10:34:11 +0100 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Anna wrote:
>Hello
>I have a question about the standard. When we measure the copper
>thickness in holes and blind vias we use a lins for 200X magnification.
>What says the standard about this? We have the IPC from 1982 and it says
>that we should measure at 100X. At this magnification is hard to se
>properly. Thank you for your help.
>
>E.mail- [log in to unmask]
>--
Anna
IPC-HF-318A, Rev. A, Dec. 91 says:
"... foil and plating integrity at a magnification of 100X, +-5%. Referee examinations
shall be accomplished at a magnification of 200X, +-5%."
Best regards
Simon
------------------------------------------------------------------------------------
Optiprint AG
Simon Huetter Tel.: +41 71 878 77 77
Dipl. El. Ing. HTL Fax.: +41 71 878 77 66
R&D e-mail: [log in to unmask]
------------------------------------------------------------------------------------
http://www.optiprint.ch
------------------------------------------------------------------------------------
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
|
|
|