We are setting up a R & D facility which will be involved in
MCM-L fabrication and chip scale packaging techniques. Our
immediate concern is an Exposure unit capable of doing
.003" lines/spaces in resists .001 - .0015" thk., and also
capable of exposing .004" dia. vias in a photodefined dielectric.
    I would appreciate any recommendations regarding equipment
specifications and processing tips.

    NOTE: Speed of processing is not a requirement and I would
          like to stay away from the high power(7/8 kw) units
          that require chillers or some additional cooling scheme.

               Thank you for your consideration and time

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