I understand that the number of times that a printed circuit board is
exposed to the reflow process must be kept to a minimum.  I have never
seen, however,  information regarding the maximum number of times that a
board can be reflowed while maintaining solder joint/component
integrity.

A common practice, at my work location, is to expose board assemblies to
the reflow process in order to remove large components as the boards
exit the oven, while the solder is still liquidous.

In order to stop the above practice, I need some data to prove that this
practice is detrimental to PCB quality.   Does anyone have reliability
data regarding excessive reflow operations?

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