I was told by Gary Ferrari to use Taiyo Solder Mask.  Make a dot pattern
for just the via's.  Do a double pass over the via's, then solder mask
the rest of the board.  Do this same procedure on the second side as
well.  Then cure the solder mask as usual.

The board house I was working with said it would never work, but I got
them to try it and they were shocked at the great results we got.  Every
via was completely tented/plugged.  We have .014"  via's, so you might
have to play around with the process for .016" via's.

Good Luck!!

Thanks,
Kathy Palumbo
> ----------
> From:         Ron Payne[SMTP:[log in to unmask]]
> Sent:         Wednesday, March 18, 1998 7:58 AM
> To:   [log in to unmask]
> Subject:      [TN] tenting vias
>
> We have 0.016 vias and are considering tenting vias both sides with
> soldermask. What is the recommended method for doing this and getting
> complete tenting without breaks or bulging out?
>
> We do not want dry film on the entire board.
>
> Thanks......Ron
>
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