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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 16 Mar 1998 15:15:50 +0100 |
Content-Type: | text/plain |
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hello,
I have a few questions concerning package leadframe materials of integrated
circuit packages. I have subscrided only recently to ChipNet and I will
submit the same questions there. However, some of the subscribers on TechNet
may have valuable info on the subject.
-1- are non-copper materials (e.g.Invar, Kovar or Alloy-42 which are Fe-Ni
alloys) still used alot for leadframe design of surface mount devices?
What is the percentage of copper leadframes on the market today?
-2- is there a finish used for copper leadframes and, if so, what materials
are used and what is the covered thickness?
-3- who has information on or can list references or literature on the complex
permeability of non-copper leadframe materials ( (e.g.Invar, Kovar or
Alloy-42)
All help, however small is appreciated.
regards,
Jan Vercammen
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