Great Question!
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Jack Crawford, IPC Project Manger - Assembly
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>>> Paul Terranova <[log in to unmask]> 03/18/98 09:10AM >>>
Jan,
Is there really a Chipnet? How can those of us interested subscribe to
this forum? I've been looking for other forums similar to Technet
related to the microelectronics industry. If anyone else has any other
good recommendations, please let me know. Thanks.
Paul Terranova
Analytical and Environmental Test Services Lab
Worldwide Module Components Group
Digital Equipment Corp
200 Forest Street
Mail Stop: MRO3-1/D2
Marlboro, MA 01752-3085
' Phone: (508)467-3109
* Fax: (508)467-6796
* Email: [log in to unmask]
-----Original Message-----
From: Jan Vercammen [SMTP:[log in to unmask]]
Sent: Monday, March 16, 1998 9:16 AM
To: [log in to unmask]
Subject: [TN] leadframe materials
hello,
I have a few questions concerning package leadframe materials of
integrated
circuit packages. I have subscrided only recently to ChipNet and
I will
submit the same questions there. However, some of the
subscribers on TechNet
may have valuable info on the subject.
-1- are non-copper materials (e.g.Invar, Kovar or Alloy-42 which
are Fe-Ni
alloys) still used alot for leadframe design of surface
mount devices?
What is the percentage of copper leadframes on the market
today?
-2- is there a finish used for copper leadframes and, if so,
what materials
are used and what is the covered thickness?
-3- who has information on or can list references or literature
on the complex
permeability of non-copper leadframe materials ( (e.g.Invar,
Kovar or
Alloy-42)
All help, however small is appreciated.
regards,
Jan Vercammen
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################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700
ext.311
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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