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March 1998

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Subject:
Re: NON-THERMALLY RELEIVED VIAS
From:
Robisan1 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 2 Mar 1998 19:57:34 EST
Content-Type:
text/plain
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text/plain (28 lines) 
Thanks for the additional info.  The bad news is that
anytime you have "wedge voids" , you have a large
threat to reliability unless the electrolytic copper plating
has "healed" those areas with sufficient good copper
plating so that they will not open during thermal excursions.

Wedge voids and the often present "pink ring" have been
discussed in detail on technet with all iterations of causes
and remedies.  Almost all processes can be the cause of
the breakdown between prepreg/inner layer bonding which
allows liquid processing chemicals to be trapped within the
wedge and poisen subsequent processes.

Susan Mansilla
Robisan Lab

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