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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 18 Mar 1998 20:33:01 -0800 |
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Talk to Tamarack Scientific in Santa Ana, CA.
Charles Busa wrote:
>
> We are setting up a R & D facility which will be involved in
> MCM-L fabrication and chip scale packaging techniques. Our
> immediate concern is an Exposure unit capable of doing
> .003" lines/spaces in resists .001 - .0015" thk., and also
> capable of exposing .004" dia. vias in a photodefined dielectric.
> I would appreciate any recommendations regarding equipment
> specifications and processing tips.
>
> NOTE: Speed of processing is not a requirement and I would
> like to stay away from the high power(7/8 kw) units
> that require chillers or some additional cooling scheme.
>
> Thank you for your consideration and time
>
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Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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