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March 1998

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Wed, 18 Mar 1998 20:33:01 -0800
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"TechNet E-Mail Forum." <[log in to unmask]>, Tom Colton <[log in to unmask]>
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Tom Colton <[log in to unmask]>
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Talk to Tamarack Scientific in Santa Ana, CA.


Charles Busa wrote:
>
> We are setting up a R & D facility which will be involved in
> MCM-L fabrication and chip scale packaging techniques. Our
> immediate concern is an Exposure unit capable of doing
> .003" lines/spaces in resists .001 - .0015" thk., and also
> capable of exposing .004" dia. vias in a photodefined dielectric.
>     I would appreciate any recommendations regarding equipment
> specifications and processing tips.
>
>     NOTE: Speed of processing is not a requirement and I would
>           like to stay away from the high power(7/8 kw) units
>           that require chillers or some additional cooling scheme.
>
>                Thank you for your consideration and time
>
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