TECHNET Archives

August 2019

TechNet@IPC.ORG
Options: Hide Table of Contents

<> (9 Messages)
[log in to unmask] (1 Message)
Bev Christian (3 Messages)
Bhanu Sood (1 Message)
Brian Chandler (1 Message)
Campbell, Murray (1 Message)
Carroll (US), Thomas A (2 Messages)
Dave Schaefer (6 Messages)
David Hillman (6 Messages)
Decker, Scott Collins (3 Messages)
Douglas Pauls (4 Messages)
Dwight Mattix (6 Messages)
Ed Rios (1 Message)
Edward Rios (1 Message)
Eray CANLI (1 Message)
Giamis, Andy (1 Message)
Gmail - Dick (1 Message)
Graham Collins (3 Messages)
Grossmann, Günter (4 Messages)
Guy Ramsey (3 Messages)
Jack Olson (7 Messages)
Jerry Dengler (1 Message)
lduso - Diamond-MT.com (1 Message)
Lee Hitchens (1 Message)
Leland Woodall (1 Message)
Mike Kirschner (1 Message)
Peter Swanson (3 Messages)
Richard Kraszewski (2 Messages)
Robert Kondner (4 Messages)
Russell Kido (1 Message)
Stadem, Richard D (7 Messages)
Stephen Pierce (2 Messages)
Steve Golemme (1 Message)
Steve Gregory (5 Messages)
Steve Smith (1 Message)
Tan Geok Ang (6 Messages)
Wayne Thayer (3 Messages)
Yuan-chia Joyce Koo (8 Messages)

Subject

From Sorted by Sender, Alphabetically

Date
New Sender <>
Forum Up and Running
<>
Mon, 26 Aug 2019 18:04:24 +0000
IPC-TM-650 - 2.6.8, 06/04 Rev: E, D-33a, Thermal stress, Plated Through Holes
<>
Thu, 22 Aug 2019 15:13:48 +0000
FW: IPC-TM-650 - 2.6.8, 06/04 Rev: E, D-33a, Thermal stress, Plated Through Holes
<>
Fri, 23 Aug 2019 11:28:52 +0000
PWB Prior Conditioning Bake Document prior to Thermal Stress 2.6.8E
<>
Fri, 23 Aug 2019 17:35:36 +0000
PWB Prior Conditioning Bake Document prior to Thermal Stress 2.6.8E
<>
Mon, 26 Aug 2019 10:28:57 +0000
PWB Solderability Testing, IPC-J-STF-003C or IPC-TM-650 2.4.12 or IPC-TM-650 2.4.13
<>
Mon, 26 Aug 2019 18:44:14 +0000
Re: Second question for English
<>
Mon, 5 Aug 2019 10:02:47 +0000
FW: TM-650 2.6.8, Thermal Stress, Plated Through Holes, 2x thru 6x.
<>
Mon, 26 Aug 2019 18:30:28 +0000
TM-650 2.6.8, Thermal Stress, Plated Through Holes.
<>
Mon, 26 Aug 2019 10:17:37 +0000
New Sender [log in to unmask]
Re: I'm baaack!
[log in to unmask]
Thu, 15 Aug 2019 15:54:22 +0000
New Sender Bev Christian
Re: AW: I'm baaack!
Bev Christian
Fri, 16 Aug 2019 07:17:32 -0400
Test
Bev Christian
Mon, 19 Aug 2019 08:34:30 -0400
Re: Test
Bev Christian
Mon, 19 Aug 2019 10:44:46 -0400
New Sender Bhanu Sood
Re: Minimum PCB thickness for press-fit technology?
Bhanu Sood
Thu, 22 Aug 2019 18:20:42 -0400
New Sender Brian Chandler
Re: Minimum PCB thickness for press-fit technology?
Brian Chandler
Fri, 23 Aug 2019 07:23:12 -0500
New Sender Campbell, Murray
Table 6.1 conductor spacing
Campbell, Murray
Thu, 22 Aug 2019 17:05:21 +0000
New Sender Carroll (US), Thomas A
Re: I'm baaack!
Carroll (US), Thomas A
Thu, 15 Aug 2019 16:20:55 +0000
Re: PDF of Navy WS-6536
Carroll (US), Thomas A
Thu, 22 Aug 2019 21:39:40 +0000
New Sender Dave Schaefer
ENIG PCB Shelf Life
Dave Schaefer
Tue, 13 Aug 2019 13:45:56 -0500
Re: ENIG PCB Shelf Life
Dave Schaefer
Tue, 13 Aug 2019 15:58:21 -0500
Re: TYPE III vs TYPE V vias
Dave Schaefer
Thu, 22 Aug 2019 12:39:08 -0500
Re: TYPE III vs TYPE V vias
Dave Schaefer
Wed, 28 Aug 2019 09:24:26 -0500
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Dave Schaefer
Wed, 28 Aug 2019 16:01:13 -0500
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Dave Schaefer
Fri, 30 Aug 2019 09:14:34 -0500
New Sender David Hillman
Element Quiz Answer
David Hillman
Fri, 23 Aug 2019 15:11:43 -0500
Element Quiz Answer
David Hillman
Fri, 30 Aug 2019 12:01:33 -0500
Element Quiz Question
David Hillman
Fri, 23 Aug 2019 09:49:35 -0500
Element Quiz Question
David Hillman
Fri, 30 Aug 2019 08:49:32 -0500
Re: [External] Re: [TN] TYPE III vs TYPE V vias
David Hillman
Wed, 28 Aug 2019 09:09:15 -0500
Re: [External] [TN] electroplated tin-lead
David Hillman
Mon, 5 Aug 2019 08:10:17 -0500
New Sender Decker, Scott Collins
Re: [External] [TN] electroplated tin-lead
Decker, Scott Collins
Mon, 5 Aug 2019 13:59:37 +0000
Re: [External] [TN] Minimum PCB thickness for press-fit technology?
Decker, Scott Collins
Thu, 22 Aug 2019 21:37:07 +0000
Re: [External] [TN] Minimum PCB thickness for press-fit technology?
Decker, Scott Collins
Thu, 22 Aug 2019 22:25:18 +0000
New Sender Douglas Pauls
Re: [External] Re: [TN] AW: I'm baaack!
Douglas Pauls
Fri, 16 Aug 2019 07:03:59 -0500
Re: [External] [TN] Egnlish wording
Douglas Pauls
Fri, 2 Aug 2019 10:41:16 -0500
Re: [External] [TN] Test
Douglas Pauls
Mon, 19 Aug 2019 07:39:55 -0500
Re: [External] [TN] Test
Douglas Pauls
Mon, 19 Aug 2019 07:59:32 -0500
New Sender Dwight Mattix
Re: Jumping QFNs
Dwight Mattix
Fri, 2 Aug 2019 18:34:21 +0000
Re: Jumping QFNs
Dwight Mattix
Fri, 2 Aug 2019 18:38:58 +0000
Re: TYPE III vs TYPE V vias
Dwight Mattix
Wed, 28 Aug 2019 17:41:57 +0000
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Dwight Mattix
Wed, 28 Aug 2019 17:45:18 +0000
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Dwight Mattix
Wed, 28 Aug 2019 22:58:42 +0000
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Dwight Mattix
Thu, 29 Aug 2019 14:31:50 +0000
New Sender Ed Rios
PDF of Navy WS-6536
Ed Rios
Thu, 22 Aug 2019 16:21:09 -0500
New Sender Edward Rios
Re: Dielectric constant
Edward Rios
Fri, 23 Aug 2019 10:45:50 -0500
New Sender Eray CANLI
Re: Element Quiz Question
Eray CANLI
Fri, 30 Aug 2019 16:51:15 +0300
New Sender Giamis, Andy
Re: Element Quiz Question
Giamis, Andy
Fri, 23 Aug 2019 14:53:04 +0000
New Sender Gmail - Dick
Fwd: TechNet Question - Is Flux Cross Contamination Possible from Hand Solder Iron Tips or Sponges?
Gmail - Dick
Wed, 14 Aug 2019 16:18:00 -0400
New Sender Graham Collins
Re: AW: I'm baaack!
Graham Collins
Fri, 16 Aug 2019 08:54:32 -0300
dip conformal coating
Graham Collins
Fri, 30 Aug 2019 15:13:15 -0300
Re: Test
Graham Collins
Mon, 19 Aug 2019 09:42:41 -0300
New Sender Grossmann, Günter
AW: Dielectric constant
Grossmann, Günter
Fri, 23 Aug 2019 12:24:08 +0000
AW: I'm baaack!
Grossmann, Günter
Fri, 16 Aug 2019 06:51:56 +0000
Egnlish wording
Grossmann, Günter
Fri, 2 Aug 2019 15:21:19 +0000
Second question for English
Grossmann, Günter
Fri, 2 Aug 2019 15:40:49 +0000
New Sender Guy Ramsey
electroplated tin-lead
Guy Ramsey
Fri, 2 Aug 2019 16:07:08 -0400
Jumping QFNs
Guy Ramsey
Fri, 2 Aug 2019 14:31:46 -0400
Re: [External] [TN] electroplated tin-lead
Guy Ramsey
Mon, 5 Aug 2019 09:50:28 -0400
New Sender Jack Olson
TYPE III vs TYPE V vias
Jack Olson
Wed, 21 Aug 2019 08:40:59 -0500
Re: TYPE III vs TYPE V vias
Jack Olson
Thu, 22 Aug 2019 08:51:53 -0500
Re: TYPE III vs TYPE V vias
Jack Olson
Thu, 22 Aug 2019 08:54:31 -0500
Re: TYPE III vs TYPE V vias
Jack Olson
Tue, 27 Aug 2019 17:48:51 -0500
Re: TYPE III vs TYPE V vias
Jack Olson
Wed, 28 Aug 2019 08:49:32 -0500
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Jack Olson
Wed, 28 Aug 2019 09:35:56 -0500
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Jack Olson
Thu, 29 Aug 2019 08:14:32 -0500
New Sender Jerry Dengler
Re: Test
Jerry Dengler
Mon, 19 Aug 2019 08:35:52 -0400
New Sender lduso - Diamond-MT.com
Re: dip conformal coating
lduso - Diamond-MT.com
Fri, 30 Aug 2019 22:07:51 -0400
New Sender Lee Hitchens
Re: dip conformal coating
Lee Hitchens
Fri, 30 Aug 2019 14:36:23 -0400
New Sender Leland Woodall
Re: Element Quiz Question
Leland Woodall
Fri, 23 Aug 2019 14:51:14 +0000
New Sender Mike Kirschner
Re: Dielectric constant
Mike Kirschner
Sat, 24 Aug 2019 10:06:52 -0500
New Sender Peter Swanson
Dielectric constant
Peter Swanson
Fri, 23 Aug 2019 11:59:08 +0000
Re: Dielectric constant
Peter Swanson
Fri, 23 Aug 2019 15:57:14 +0000
Re: Sustainable pcb base materials?
Peter Swanson
Wed, 14 Aug 2019 11:22:26 +0000
New Sender Richard Kraszewski
Request for Copy of a SMTA Paper
Richard Kraszewski
Tue, 20 Aug 2019 16:20:47 +0000
Re: Request for Copy of a SMTA Paper
Richard Kraszewski
Tue, 20 Aug 2019 16:33:12 +0000
New Sender Robert Kondner
Re: Jumping QFNs
Robert Kondner
Fri, 2 Aug 2019 17:23:20 -0400
Re: Jumping QFNs
Robert Kondner
Fri, 2 Aug 2019 22:48:16 -0400
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Robert Kondner
Wed, 28 Aug 2019 20:42:21 -0400
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Robert Kondner
Fri, 30 Aug 2019 16:36:09 -0400
New Sender Russell Kido
Re: I'm baaack!
Russell Kido
Thu, 15 Aug 2019 16:19:25 +0000
New Sender Stadem, Richard D
Re: Element Quiz Question
Stadem, Richard D
Fri, 30 Aug 2019 13:54:06 +0000
Re: I'm baaack!
Stadem, Richard D
Thu, 15 Aug 2019 16:58:34 +0000
Re: Test
Stadem, Richard D
Mon, 19 Aug 2019 13:27:03 +0000
Re: TM-650 2.6.8, Thermal Stress, Plated Through Holes, 2x thru 6x.
Stadem, Richard D
Mon, 26 Aug 2019 19:26:53 +0000
Re: TYPE III vs TYPE V vias
Stadem, Richard D
Thu, 22 Aug 2019 11:55:32 +0000
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Stadem, Richard D
Wed, 28 Aug 2019 15:06:23 +0000
Re: [External] [TN] Minimum PCB thickness for press-fit technology?
Stadem, Richard D
Mon, 26 Aug 2019 13:13:53 +0000
New Sender Stephen Pierce
Re: TYPE III vs TYPE V vias
Stephen Pierce
Wed, 21 Aug 2019 14:35:35 -0700
Re: TYPE III vs TYPE V vias
Stephen Pierce
Tue, 27 Aug 2019 16:33:55 -0700
New Sender Steve Golemme
Re: Jumping QFNs
Steve Golemme
Fri, 2 Aug 2019 14:45:38 -0700
New Sender Steve Gregory
Re: ENIG PCB Shelf Life
Steve Gregory
Tue, 13 Aug 2019 13:12:25 -0600
Re: Forum Up and Running
Steve Gregory
Mon, 26 Aug 2019 12:07:08 -0600
Minimum PCB thickness for press-fit technology?
Steve Gregory
Thu, 22 Aug 2019 14:05:06 -0600
Re: Request for Copy of a SMTA Paper
Steve Gregory
Tue, 20 Aug 2019 10:29:23 -0600
Re: [External] [TN] Minimum PCB thickness for press-fit technology?
Steve Gregory
Thu, 22 Aug 2019 15:50:21 -0600
New Sender Steve Smith
Re: I'm baaack!
Steve Smith
Thu, 15 Aug 2019 18:49:17 +0000
New Sender Tan Geok Ang
Re: Jumping QFNs
Tan Geok Ang
Sat, 3 Aug 2019 00:43:58 +0000
Re: Jumping QFNs
Tan Geok Ang
Sat, 3 Aug 2019 12:15:05 +0000
Re: Minimum PCB thickness for press-fit technology?
Tan Geok Ang
Fri, 23 Aug 2019 02:16:47 +0000
Re: Test
Tan Geok Ang
Mon, 19 Aug 2019 12:35:57 +0000
Re: TM-650 2.6.8, Thermal Stress, Plated Through Holes.
Tan Geok Ang
Mon, 26 Aug 2019 10:26:39 +0000
Re: TYPE III vs TYPE V vias
Tan Geok Ang
Wed, 28 Aug 2019 00:06:41 +0000
New Sender Wayne Thayer
Re: Minimum PCB thickness for press-fit technology?
Wayne Thayer
Sat, 24 Aug 2019 10:41:59 -0700
Re: TYPE III vs TYPE V vias
Wayne Thayer
Sat, 24 Aug 2019 10:55:55 -0700
Re: TYPE III vs TYPE V vias
Wayne Thayer
Tue, 27 Aug 2019 17:05:38 -0700
New Sender Yuan-chia Joyce Koo
Re: AW: I'm baaack!
Yuan-chia Joyce Koo
Fri, 16 Aug 2019 06:41:52 -0400
Re: AW: I'm baaack!
Yuan-chia Joyce Koo
Fri, 16 Aug 2019 06:45:06 -0400
Re: I'm baaack!
Yuan-chia Joyce Koo
Thu, 15 Aug 2019 14:01:34 -0400
Re: Jumping QFNs
Yuan-chia Joyce Koo
Fri, 2 Aug 2019 22:10:19 -0400
Re: PWB Prior Conditioning Bake Document prior to Thermal Stress 2.6.8E
Yuan-chia Joyce Koo
Mon, 26 Aug 2019 08:19:18 -0400
Re: Second question for English
Yuan-chia Joyce Koo
Fri, 2 Aug 2019 12:04:30 -0400
Re: TYPE III vs TYPE V vias
Yuan-chia Joyce Koo
Wed, 21 Aug 2019 10:54:45 -0400
Re: [External] Re: [TN] TYPE III vs TYPE V vias
Yuan-chia Joyce Koo
Fri, 30 Aug 2019 19:48:37 -0400

ATOM RSS1 RSS2