Thank you all! Here what I have now, which you may or may nor find useful 😊. I have not put in all the full names after the acronyms yet.
Standards Organizations
ISO – International Standards Organization
IEC – International Electrotechnical Commission
JISSO
CE
DIN
CSA
UL
IPC
ASTM International
SAE International
International Aerospace Quality Group
NADCAP
Industry Organizations (for companies/individuals)
IPC
SMTA – Surface Mount Technology Association
IMAPS- International Microelectronics Assembly and Packaging Society
ISHM - International Society for Hybrid Microelectronics
IEEE -
CPCA - China Printed Circuits Association
HKPCA - Hong Kong Printed Circuits Association
TPCA - Taiwan Printed Circuits Association
JPCA – Japan Printed Circuits Association
JEITA - Japan Electronics and Information Technology Industries Association
EIPC – European Institute of Printed Circuits
Other
IRDS –International Roadmap for Devices and Systems
Consortium
iNEMI - International National Electronics Manufacturing Initiative
CALCE - Computer Aided Life Cycle Analysis
CAVE - Center for Advanced Vehicle and Extreme Environment Electronics
HDPUG - High Density Packaging User Group
Universal Consortium
Major North American Conferences
IPC APEX
ECTC
SMTAI
IMAPS
IWLPC – International Wafer Level Packaging Conference
IEEE – Holmes Conference
Other World Electronics Shows/Conferences
Proditronica
CPCA - China Printed Circuits Association Show
HKPCA - Hong Kong Printed Circuits Association Show
TPCA - Taiwan Printed Circuits Association Show
JISSO Protec
Regards,
Bev
-----Original Message-----
From: TechNet <[log in to unmask]> On Behalf Of Yuan-chia Joyce Koo
Sent: August 16, 2019 6:45 AM
To: [log in to unmask]
Subject: Re: [TN] AW: I'm baaack!
additional link - see update:
https://www.ieee.org/about/news/2019/ieee-and-international-roadmap-
for-devices.html
enjoy.
jk
On Aug 16, 2019, at 6:41 AM, Yuan-chia Joyce Koo wrote:
> forgot ITRS changed to new name. Students should be aware of the next
> gen trend (5-15 years) roadmap to ensure their career is on the sound
> footing and have the skill ready to enter the new market.
> https://en.wikipedia.org/wiki/
> International_Roadmap_for_Devices_and_Systems
> IMHO.
> jk
> On Aug 16, 2019, at 2:51 AM, Grossmann, Günter wrote:
>
>> Hi Bev
>>
>> Wellcome back.
>>
>> Association: IEEE
>>
>> Event in the US: Holmes conference
>>
>> Best regards
>>
>> Günter
>>
>>
>> Günter Grossmann
>> Scientist
>> Empa
>> Swiss Federal Laboratories for Materials Science and Technology
>> Ãœberlandstrasse 129
>> 8600 Dübendorf
>> Switzerland
>> Tel +41 58 765 42 79
>> [log in to unmask]
>> www.empa.ch
>>
>> Diese Mitteilung ist ausschliesslich für die als Empfänger
>> aufgeführte Person(en) oder Firma bestimmt. Sie kann persönliche
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>> umgehend per E-Mail zu informieren, sämtliche Ausdrucke zu vernichten
>> und die E-Mail-Dateien zu löschen.
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>>
>> -----Ursprüngliche Nachricht-----
>> Von: TechNet <[log in to unmask]> Im Auftrag von
>> [log in to unmask]
>> Gesendet: Donnerstag, 15. August 2019 17:54
>> An: [log in to unmask]
>> Betreff: Re: [TN] I'm baaack!
>>
>> TechNetters,
>>
>> Hello!
>>
>>
>>
>> When I moved and changed internet service provider Bell Canada
>> killed my Sympatico email account and thus my access to TechNet.
>> We have moved to Paris (Ontario, Canada, that is) and downsized.
>> I am still working part time for the High Density Packaging User
>> Group (HDPUG) as a project facilitator. I am also now an Adjunct
>> Associate Professor in the Department of Mechanical Engineering and
>> Mechatronics at the University of Waterloo.
>>
>>
>>
>> I mention the latter because I have a question for this esteemed
>> group. I am teaching a course on electronics manufacturing this
>> fall, thanks in part to info supplied by Joe Fjelstad, Dr. Ron
>> Lasky and Dr. Michael Mayer. I am trying to put together a few
>> slides about organizations and events the student should know
>> about. Here is what I have so far:
>>
>>
>>
>> Standards Organizations
>>
>> IEC
>>
>> IPC
>>
>> ASTM
>>
>> EOS/ESD Association, Inc.
>>
>>
>>
>> Associations
>>
>> IPC
>>
>> SMTA
>>
>> CPCA - China Printed Circuits Association
>>
>> HKPCA - Hong Kong Printed Circuits Association
>>
>> TPCA - Taiwan Printed Circuits Association
>>
>> JPCA - Japan Printed Circuits Association
>>
>> EIPC - European Institute of Printed Circuits
>>
>> ASM
>>
>>
>>
>>
>>
>> Consortium
>>
>> iNEMI - International National Electronics Manufacturing Initiative
>>
>> CALCE - Computer Aided Life Cycle Analysis
>>
>> CAVE - Center for Advanced Vehicle and Extreme Environment
>> Electronics
>>
>> HDPUG - High Density Packaging User Group
>>
>> Universal Consortium
>>
>>
>>
>> Major North American Conferences
>>
>> IPC APEX
>>
>> ECTC
>>
>> SMTAI
>>
>>
>>
>> I would appreciate suggestions that you think I should add to
>> these lists.
>>
>>
>>
>>
>>
>> Regards,
>>
>> Bev Christian
>
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