Good morning Bev,
It is good to see you back. One thing for you to consider (and for the
rest of you to be aware of), IPC has an initiative called the IPC
Educational Foundation (ipcef.org). This initiative is to address the
critical shortage of engineers and technicians for the electronics
manufacturing industry. They are working on setting up cirricula of study
and student chapters in a number of locations. I believe Tracy Riggan, IPC
Staff, is the liaison and Colette Buscemi is the leader of the Foundation.
Something to think about.
*Douglas Pauls *| Principal Materials and Process Engr | Advanced
Operations Engineering
*COLLINS AEROSPACE*
400 Collins Road NE, MS 108-101, Cedar Rapids, IA 52498 USA
*Tel:* +1 319 295 2109 | *Mobile: *+1 319 431 3773
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On Fri, Aug 16, 2019 at 6:17 AM Bev Christian <[log in to unmask]>
wrote:
> Thank you all! Here what I have now, which you may or may nor find useful
> 😊. I have not put in all the full names after the acronyms yet.
>
> Standards Organizations
> ISO – International Standards Organization
> IEC – International Electrotechnical Commission
> JISSO
> CE
> DIN
> CSA
> UL
> IPC
> ASTM International
> SAE International
> International Aerospace Quality Group
> NADCAP
>
>
> Industry Organizations (for companies/individuals)
> IPC
> SMTA – Surface Mount Technology Association
> IMAPS- International Microelectronics Assembly and Packaging Society
> ISHM - International Society for Hybrid Microelectronics
> IEEE -
> CPCA - China Printed Circuits Association
> HKPCA - Hong Kong Printed Circuits Association
> TPCA - Taiwan Printed Circuits Association
> JPCA – Japan Printed Circuits Association
> JEITA - Japan Electronics and Information Technology Industries
> Association
> EIPC – European Institute of Printed Circuits
>
>
> Other
> IRDS –International Roadmap for Devices and Systems
>
>
> Consortium
> iNEMI - International National Electronics Manufacturing Initiative
> CALCE - Computer Aided Life Cycle Analysis
> CAVE - Center for Advanced Vehicle and Extreme Environment Electronics
> HDPUG - High Density Packaging User Group
> Universal Consortium
>
>
> Major North American Conferences
> IPC APEX
> ECTC
> SMTAI
> IMAPS
> IWLPC – International Wafer Level Packaging Conference
> IEEE – Holmes Conference
>
>
> Other World Electronics Shows/Conferences
> Proditronica
> CPCA - China Printed Circuits Association Show
> HKPCA - Hong Kong Printed Circuits Association Show
> TPCA - Taiwan Printed Circuits Association Show
> JISSO Protec
>
> Regards,
> Bev
>
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Yuan-chia Joyce Koo
> Sent: August 16, 2019 6:45 AM
> To: [log in to unmask]
> Subject: Re: [TN] AW: I'm baaack!
>
> additional link - see update:
>
> https://urldefense.proofpoint.com/v2/url?u=https-3A__www.ieee.org_about_news_2019_ieee-2Dand-2Dinternational-2Droadmap-2D&d=DwIFaQ&c=ilBQI1lupc9Y65XwNblLtw&r=lTRDjB8ojaf7ZaJ9DHeDAm7e-HFP9fxIkv6fRnV49HE&m=xhRcVU3d0GjFxHrFcGPP1HiBbukTDunikHEzpzutyLc&s=Yx95GgrDw-Wf3NdAziqJEin6VVHMRkIj2rp7N8Vr-2k&e=
> for-devices.html
> enjoy.
> jk
> On Aug 16, 2019, at 6:41 AM, Yuan-chia Joyce Koo wrote:
>
> > forgot ITRS changed to new name. Students should be aware of the next
> > gen trend (5-15 years) roadmap to ensure their career is on the sound
> > footing and have the skill ready to enter the new market.
> >
> https://urldefense.proofpoint.com/v2/url?u=https-3A__en.wikipedia.org_wiki_&d=DwIFaQ&c=ilBQI1lupc9Y65XwNblLtw&r=lTRDjB8ojaf7ZaJ9DHeDAm7e-HFP9fxIkv6fRnV49HE&m=xhRcVU3d0GjFxHrFcGPP1HiBbukTDunikHEzpzutyLc&s=hMLJVLnybyCGc2MKpF54x9iD5p8SJz2Oy3G1EecLfu8&e=
>
> > International_Roadmap_for_Devices_and_Systems
> > IMHO.
> > jk
> > On Aug 16, 2019, at 2:51 AM, Grossmann, Günter wrote:
> >
> >> Hi Bev
> >>
> >> Wellcome back.
> >>
> >> Association: IEEE
> >>
> >> Event in the US: Holmes conference
> >>
> >> Best regards
> >>
> >> Günter
> >>
> >>
> >> Günter Grossmann
> >> Scientist
> >> Empa
> >> Swiss Federal Laboratories for Materials Science and Technology
> >> Ãœberlandstrasse 129
> >> 8600 Dübendorf
> >> Switzerland
> >> Tel +41 58 765 42 79
> >> [log in to unmask]
> >>
> https://urldefense.proofpoint.com/v2/url?u=http-3A__www.empa.ch&d=DwIFaQ&c=ilBQI1lupc9Y65XwNblLtw&r=lTRDjB8ojaf7ZaJ9DHeDAm7e-HFP9fxIkv6fRnV49HE&m=xhRcVU3d0GjFxHrFcGPP1HiBbukTDunikHEzpzutyLc&s=hyg8O2Re48V5KtMT4yQqBWkxIHQQpfVTpkB010VgLpo&e=
> >>
> >> Diese Mitteilung ist ausschliesslich für die als Empfänger
> >> aufgeführte Person(en) oder Firma bestimmt. Sie kann persönliche
> >> und/oder vertrauliche Informationen enthalten. Sollten Sie diese
> >> Mitteilung irrtümlicherweise erhalten haben, bitten wir Sie, uns
> >> umgehend per E-Mail zu informieren, sämtliche Ausdrucke zu vernichten
> >> und die E-Mail-Dateien zu löschen.
> >> This message is intended for the exclusive use of the individual
> >> (s) or entity to whom it is addressed. It may contain information
> >> that is privileged and/or confidential. Should you have received this
> >> message erroneously, please notify us immediately by e-mail, destroy
> >> any printouts and delete all electronic files contained in this
> >> message.
> >>
> >>
> >> -----Ursprüngliche Nachricht-----
> >> Von: TechNet <[log in to unmask]> Im Auftrag von
> >> [log in to unmask]
> >> Gesendet: Donnerstag, 15. August 2019 17:54
> >> An: [log in to unmask]
> >> Betreff: Re: [TN] I'm baaack!
> >>
> >> TechNetters,
> >>
> >> Hello!
> >>
> >>
> >>
> >> When I moved and changed internet service provider Bell Canada
> >> killed my Sympatico email account and thus my access to TechNet.
> >> We have moved to Paris (Ontario, Canada, that is) and downsized.
> >> I am still working part time for the High Density Packaging User
> >> Group (HDPUG) as a project facilitator. I am also now an Adjunct
> >> Associate Professor in the Department of Mechanical Engineering and
> >> Mechatronics at the University of Waterloo.
> >>
> >>
> >>
> >> I mention the latter because I have a question for this esteemed
> >> group. I am teaching a course on electronics manufacturing this
> >> fall, thanks in part to info supplied by Joe Fjelstad, Dr. Ron
> >> Lasky and Dr. Michael Mayer. I am trying to put together a few
> >> slides about organizations and events the student should know
> >> about. Here is what I have so far:
> >>
> >>
> >>
> >> Standards Organizations
> >>
> >> IEC
> >>
> >> IPC
> >>
> >> ASTM
> >>
> >> EOS/ESD Association, Inc.
> >>
> >>
> >>
> >> Associations
> >>
> >> IPC
> >>
> >> SMTA
> >>
> >> CPCA - China Printed Circuits Association
> >>
> >> HKPCA - Hong Kong Printed Circuits Association
> >>
> >> TPCA - Taiwan Printed Circuits Association
> >>
> >> JPCA - Japan Printed Circuits Association
> >>
> >> EIPC - European Institute of Printed Circuits
> >>
> >> ASM
> >>
> >>
> >>
> >>
> >>
> >> Consortium
> >>
> >> iNEMI - International National Electronics Manufacturing Initiative
> >>
> >> CALCE - Computer Aided Life Cycle Analysis
> >>
> >> CAVE - Center for Advanced Vehicle and Extreme Environment
> >> Electronics
> >>
> >> HDPUG - High Density Packaging User Group
> >>
> >> Universal Consortium
> >>
> >>
> >>
> >> Major North American Conferences
> >>
> >> IPC APEX
> >>
> >> ECTC
> >>
> >> SMTAI
> >>
> >>
> >>
> >> I would appreciate suggestions that you think I should add to
> >> these lists.
> >>
> >>
> >>
> >>
> >>
> >> Regards,
> >>
> >> Bev Christian
> >
>
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