Good to hear from you Bev. See below in 'red'.



Regards,

Russell Kido



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Thursday, August 15, 2019 8:54 AM
To: [log in to unmask]
Subject: Re: [TN] I'm baaack!



TechNetters,



Hello!







When I moved and changed internet service provider Bell Canada killed my Sympatico email account and thus my access to TechNet.  We have moved to Paris (Ontario, Canada, that is) and downsized.  I am still working part time for the High Density Packaging User Group (HDPUG) as a project facilitator. I am also now an Adjunct Associate Professor in the Department of Mechanical Engineering and Mechatronics at the University of Waterloo.







I mention the latter because I have a question for this esteemed group.  I am teaching a course on electronics manufacturing this fall, thanks in part to info supplied by Joe Fjelstad, Dr. Ron Lasky and Dr. Michael Mayer.  I am trying to put together a few slides about organizations and events the student should know about. Here is what I have so far:







Standards Organizations



IEC



IPC



ASTM



EOS/ESD Association, Inc.







Associations



IPC



SMTA



CPCA - China Printed Circuits Association



HKPCA - Hong Kong Printed Circuits Association



TPCA - Taiwan Printed Circuits Association



JPCA - Japan Printed Circuits Association



EIPC - European Institute of Printed Circuits



ASM



IMAPS





Consortium



iNEMI - International National Electronics Manufacturing Initiative



CALCE - Computer Aided Life Cycle Analysis



CAVE - Center for Advanced Vehicle and Extreme Environment Electronics



HDPUG - High Density Packaging User Group



Universal Consortium







Major North American Conferences



IPC APEX



ECTC



SMTAI



IMAPS



I would appreciate suggestions that you think I should add to these lists.











Regards,



Bev Christian