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| Date: | Fri, 2 Aug 2019 14:31:46 -0400 |
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We are experiencing a bout of QFNs that jump off the pads, even off the
assembly during reflow.
The parts are handled in accordance with J-STD-033.
The boards are complex multilayer sequential lamination with thousands of
vias, blind, buried, and through hole. All exposed vias are filled and
plated,with ENIG finish.
We bake the boards 10 hrs at 105C.
Solder paste is FCT WS159 . . . I know, I know. The Peregrine parts don't
solder well unless the flux is crazy active.
Any ideas on why about 2-5 percent of the parts jump off the pads or
assembly completely?
Can this be just a solderability problem?
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