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Subject:
FW: IPC-TM-650 - 2.6.8, 06/04 Rev: E, D-33a, Thermal stress, Plated Through Holes
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Date:
Fri, 23 Aug 2019 11:28:52 +0000
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Fellow TechNetters:

   I did not receive any feedback on my first inquiry.   Therefore, I submit my request below again.

Victor,

From: Hernandez, Victor G
Sent: Thursday, August 22, 2019 10:14 AM
To: TechNet E-Mail Forum
Cc: Hernandez, Victor G
Subject: IPC-TM-650 - 2.6.8, 06/04 Rev: E, D-33a, Thermal stress, Plated Through Holes

Fellow TechNetters:

   Is it valid/acceptable/permissible/allowable to conduct the above stated Test Method on a raw board with a final surface finish of LF HASL?
All comments and suggestion welcomed.....

Victor,

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