JEDEC
Graham Collins
Senior Process Engineer
Sunsel Systems
(902) 444-7867
On 8/16/2019 8:17 AM, Bev Christian wrote:
> Thank you all! Here what I have now, which you may or may nor find useful 😊. I have not put in all the full names after the acronyms yet.
>
> Standards Organizations
> ISO – International Standards Organization
> IEC – International Electrotechnical Commission
> JISSO
> CE
> DIN
> CSA
> UL
> IPC
> ASTM International
> SAE International
> International Aerospace Quality Group
> NADCAP
>
>
> Industry Organizations (for companies/individuals)
> IPC
> SMTA – Surface Mount Technology Association
> IMAPS- International Microelectronics Assembly and Packaging Society
> ISHM - International Society for Hybrid Microelectronics
> IEEE -
> CPCA - China Printed Circuits Association
> HKPCA - Hong Kong Printed Circuits Association
> TPCA - Taiwan Printed Circuits Association
> JPCA – Japan Printed Circuits Association
> JEITA - Japan Electronics and Information Technology Industries Association
> EIPC – European Institute of Printed Circuits
>
>
> Other
> IRDS –International Roadmap for Devices and Systems
>
>
> Consortium
> iNEMI - International National Electronics Manufacturing Initiative
> CALCE - Computer Aided Life Cycle Analysis
> CAVE - Center for Advanced Vehicle and Extreme Environment Electronics
> HDPUG - High Density Packaging User Group
> Universal Consortium
>
>
> Major North American Conferences
> IPC APEX
> ECTC
> SMTAI
> IMAPS
> IWLPC – International Wafer Level Packaging Conference
> IEEE – Holmes Conference
>
>
> Other World Electronics Shows/Conferences
> Proditronica
> CPCA - China Printed Circuits Association Show
> HKPCA - Hong Kong Printed Circuits Association Show
> TPCA - Taiwan Printed Circuits Association Show
> JISSO Protec
>
> Regards,
> Bev
>
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Yuan-chia Joyce Koo
> Sent: August 16, 2019 6:45 AM
> To: [log in to unmask]
> Subject: Re: [TN] AW: I'm baaack!
>
> additional link - see update:
> https://www.ieee.org/about/news/2019/ieee-and-international-roadmap-
> for-devices.html
> enjoy.
> jk
> On Aug 16, 2019, at 6:41 AM, Yuan-chia Joyce Koo wrote:
>
>> forgot ITRS changed to new name. Students should be aware of the next
>> gen trend (5-15 years) roadmap to ensure their career is on the sound
>> footing and have the skill ready to enter the new market.
>> https://en.wikipedia.org/wiki/
>> International_Roadmap_for_Devices_and_Systems
>> IMHO.
>> jk
>> On Aug 16, 2019, at 2:51 AM, Grossmann, Günter wrote:
>>
>>> Hi Bev
>>>
>>> Wellcome back.
>>>
>>> Association: IEEE
>>>
>>> Event in the US: Holmes conference
>>>
>>> Best regards
>>>
>>> Günter
>>>
>>>
>>> Günter Grossmann
>>> Scientist
>>> Empa
>>> Swiss Federal Laboratories for Materials Science and Technology
>>> Ãœberlandstrasse 129
>>> 8600 Dübendorf
>>> Switzerland
>>> Tel +41 58 765 42 79
>>> [log in to unmask]
>>> www.empa.ch
>>>
>>> Diese Mitteilung ist ausschliesslich für die als Empfänger
>>> aufgeführte Person(en) oder Firma bestimmt. Sie kann persönliche
>>> und/oder vertrauliche Informationen enthalten. Sollten Sie diese
>>> Mitteilung irrtümlicherweise erhalten haben, bitten wir Sie, uns
>>> umgehend per E-Mail zu informieren, sämtliche Ausdrucke zu vernichten
>>> und die E-Mail-Dateien zu löschen.
>>> This message is intended for the exclusive use of the individual
>>> (s) or entity to whom it is addressed. It may contain information
>>> that is privileged and/or confidential. Should you have received this
>>> message erroneously, please notify us immediately by e-mail, destroy
>>> any printouts and delete all electronic files contained in this
>>> message.
>>>
>>>
>>> -----Ursprüngliche Nachricht-----
>>> Von: TechNet <[log in to unmask]> Im Auftrag von
>>> [log in to unmask]
>>> Gesendet: Donnerstag, 15. August 2019 17:54
>>> An: [log in to unmask]
>>> Betreff: Re: [TN] I'm baaack!
>>>
>>> TechNetters,
>>>
>>> Hello!
>>>
>>>
>>>
>>> When I moved and changed internet service provider Bell Canada
>>> killed my Sympatico email account and thus my access to TechNet.
>>> We have moved to Paris (Ontario, Canada, that is) and downsized.
>>> I am still working part time for the High Density Packaging User
>>> Group (HDPUG) as a project facilitator. I am also now an Adjunct
>>> Associate Professor in the Department of Mechanical Engineering and
>>> Mechatronics at the University of Waterloo.
>>>
>>>
>>>
>>> I mention the latter because I have a question for this esteemed
>>> group. I am teaching a course on electronics manufacturing this
>>> fall, thanks in part to info supplied by Joe Fjelstad, Dr. Ron
>>> Lasky and Dr. Michael Mayer. I am trying to put together a few
>>> slides about organizations and events the student should know
>>> about. Here is what I have so far:
>>>
>>>
>>>
>>> Standards Organizations
>>>
>>> IEC
>>>
>>> IPC
>>>
>>> ASTM
>>>
>>> EOS/ESD Association, Inc.
>>>
>>>
>>>
>>> Associations
>>>
>>> IPC
>>>
>>> SMTA
>>>
>>> CPCA - China Printed Circuits Association
>>>
>>> HKPCA - Hong Kong Printed Circuits Association
>>>
>>> TPCA - Taiwan Printed Circuits Association
>>>
>>> JPCA - Japan Printed Circuits Association
>>>
>>> EIPC - European Institute of Printed Circuits
>>>
>>> ASM
>>>
>>>
>>>
>>>
>>>
>>> Consortium
>>>
>>> iNEMI - International National Electronics Manufacturing Initiative
>>>
>>> CALCE - Computer Aided Life Cycle Analysis
>>>
>>> CAVE - Center for Advanced Vehicle and Extreme Environment
>>> Electronics
>>>
>>> HDPUG - High Density Packaging User Group
>>>
>>> Universal Consortium
>>>
>>>
>>>
>>> Major North American Conferences
>>>
>>> IPC APEX
>>>
>>> ECTC
>>>
>>> SMTAI
>>>
>>>
>>>
>>> I would appreciate suggestions that you think I should add to
>>> these lists.
>>>
>>>
>>>
>>>
>>>
>>> Regards,
>>>
>>> Bev Christian
|
