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August 2019

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Subject:
TYPE III vs TYPE V vias
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Wed, 21 Aug 2019 08:40:59 -0500
Content-Type:
text/plain
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text/plain (10 lines) 
Greetings,
We are using thermal vias in large power device pads to carry heat through
the board to the back side.
We specified TYPE V hole filling with non-conductive, but some of the holes
are open.
If some of the vias are only partially filled, does that automatically make
it TYPE III?
Is the same MATERIAL used for TYPE III and Type V via filling?
(for the record, it is green and looks like soldermask material)

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