forgot ITRS changed to new name.  Students should be aware of the  
next gen trend (5-15 years) roadmap to ensure their career is on the  
sound footing and have the skill ready to enter the new market.   
https://en.wikipedia.org/wiki/ 
International_Roadmap_for_Devices_and_Systems
IMHO.
jk
On Aug 16, 2019, at 2:51 AM, Grossmann, Günter wrote:

> Hi Bev
>
> Wellcome back.
>
> Association: IEEE
>
> Event in the US: Holmes conference
>
> Best regards
>
> Günter
>
>
> Günter Grossmann
> Scientist
> Empa
> Swiss Federal Laboratories for Materials Science and Technology
> Überlandstrasse 129
> 8600 Dübendorf
> Switzerland
> Tel +41 58 765 42 79
> [log in to unmask]
> www.empa.ch
>
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> -----Ursprüngliche Nachricht-----
> Von: TechNet <[log in to unmask]> Im Auftrag von  
> [log in to unmask]
> Gesendet: Donnerstag, 15. August 2019 17:54
> An: [log in to unmask]
> Betreff: Re: [TN] I'm baaack!
>
> TechNetters,
>
> Hello!
>
>
>
> When I moved and changed internet service provider Bell Canada  
> killed my Sympatico email account and thus my access to TechNet.   
> We have moved to Paris (Ontario, Canada, that is) and downsized.  I  
> am still working part time for the High Density Packaging User  
> Group (HDPUG) as a project facilitator. I am also now an Adjunct  
> Associate Professor in the Department of Mechanical Engineering and  
> Mechatronics at the University of Waterloo.
>
>
>
> I mention the latter because I have a question for this esteemed  
> group.  I am teaching a course on electronics manufacturing this  
> fall, thanks in part to info supplied by Joe Fjelstad, Dr. Ron  
> Lasky and Dr. Michael Mayer.  I am trying to put together a few  
> slides about organizations and events the student should know  
> about. Here is what I have so far:
>
>
>
> Standards Organizations
>
> IEC
>
> IPC
>
> ASTM
>
> EOS/ESD Association, Inc.
>
>
>
> Associations
>
> IPC
>
> SMTA
>
> CPCA - China Printed Circuits Association
>
> HKPCA - Hong Kong Printed Circuits Association
>
> TPCA - Taiwan Printed Circuits Association
>
> JPCA - Japan Printed Circuits Association
>
> EIPC - European Institute of Printed Circuits
>
> ASM
>
>
>
>
>
> Consortium
>
> iNEMI - International National Electronics Manufacturing Initiative
>
> CALCE - Computer Aided Life Cycle Analysis
>
> CAVE - Center for Advanced Vehicle and Extreme Environment Electronics
>
> HDPUG - High Density Packaging User Group
>
> Universal Consortium
>
>
>
> Major North American Conferences
>
> IPC APEX
>
> ECTC
>
> SMTAI
>
>
>
> I would appreciate suggestions that you think I should add to these  
> lists.
>
>
>
>
>
> Regards,
>
> Bev Christian