ิbromide spec. (1 Message)
0402's under BGA problems? (3 Messages)
0603 Pad Design Modifications (1 Message)
0612 vs. 1206 (2 Messages)
0612 vs. 1206 - Low Inductance Caps w/ attachment (1 Message)
0612 vs. 1206 -Reply (2 Messages)
40mil BGA: Masking of vias (1 Message)
: European Union (5 Messages)
: Flooring, Conductive or Anti-Static (4 Messages)
: How to Tin Actel-CQ132 (8 Messages)
: Looking for an address (5 Messages)
: Wave Solder Conveyor Chain (1 Message)
<No subject> (8 Messages)
<TN>: What is the maximum temperature for using Gold? (1 Message)
A Request Concerning Virus Email... (1 Message)
About ISO 9001 code. (1 Message)
ADVANCED REWORK CLASS (1 Message)
Aluminum wire bonding (2 Messages)
Any idea on how to best solder to Paldium-Silver-Platinum termina tions usually found on Coil Craft Inductors (1 Message)
Any Info on Solder Preforms with 0.100" centers held tog ether by Kapton? (2 Messages)
Any Info on Solder Preforms with 0.100" centers held tog... (2 Messages)
Any Info on Solder Preforms with 0.100" centers held together by Kapton? (4 Messages)
Ass'y: Zevatech pick & place users (1 Message)
assembly company for sale (1 Message)
ASSY: Microvias in BGA pads (1 Message)
Assy: Stencil Printing Adhesive for 0603 Components (2 Messages)
Atlanta Designers Council Meeting [4/8, 8:00am] (1 Message)
Atmospheric conditions for reflow ovens using RMA fluxes... (1 Message)
Automated Selective Soldering (5 Messages)
Bar Coding on films (1 Message)
BAR CODING SOFTWARE (3 Messages)
Bench top Etching machine (1 Message)
Benchmark data on Raw Material entering your plants (1 Message)
benchmark on component placement (2 Messages)
BGA REPAIR/REWORK II (1 Message)
BGA REWORK/REPAIR (2 Messages)
BGA Sockets (4 Messages)
Bga solder ball failure. (3 Messages)
BGA Substrate Price & Toolings cost (1 Message)
Black Ni/Au pads (1 Message)
Boston Area IPC Designer's Council Meeting 3/10: GenCAM (1 Message)
Bottom side parts falling off during wave (3 Messages)
Cadence Allegro database File (2 Messages)
CCMail Conversion (2 Messages)
CCMail Conversion and the "OTHER" technet (1 Message)
CEI 52-4 Specification (2 Messages)
Change in current densities in a Macdermid Tin-lead bath (1 Message)
Chip Resistor Corrosion (4 Messages)
chromate conversion coating (2 Messages)
Cigarette smoke, PCBs & its harmful effects? (6 Messages)
Circuit Card Cleanliness (5 Messages)
CircuiTree Info (4 Messages)
Cleaner in the PTH process (1 Message)
Comparative Tracking Index? (5 Messages)
Component Solderability Tester (2 Messages)
Confirmation=Protection (1 Message)
Conformal coating (2 Messages)
Conformation of message (1 Message)
Corfin Tab Finishing (2 Messages)
countersink hole (3 Messages)
countersink hole -Reply (1 Message)
Cpk value (3 Messages)
Cross section Lab (5 Messages)
crystal legs breaking (2 Messages)
Data collection/SPC (1 Message)
Data on Acrylic vs Adhesiveless flex materials (3 Messages)
Degolding Policy (2 Messages)
DEK Stencil Printer Autoflex tooling pin breakage (3 Messages)
DI Water Heater (6 Messages)
Dielectric loss (1 Message)
Different current densities in the Macdermid tin-lead bath (1 Message)
Differential Impedance (1 Message)
DIP Inserters (2 Messages)
double-sided reflow (6 Messages)
Dull Solder Bump (1 Message)
Dummy BGA Components (3 Messages)
Dynamic Dimension or Mechanical Analysis? (1 Message)
Effect of Surface Finish on RF Boards (4 Messages)
electrical clearance (3 Messages)
Electrical Clearance vs. Solder ball (1 Message)
ENHANCED AgPd (3 Messages)
Entek Cu56 (1 Message)
EOC formula (1 Message)
Epoxy around SMT Components (3 Messages)
Epoxy vs Polyimide data (2 Messages)
ESD Posters in Chinese... (1 Message)
ESD posters in Chinese??? (5 Messages)
ESD questions (4 Messages)
Estimated cost for soldering and tooling. (1 Message)
Etchant for Copper Assuming Sn/Pb Resist (1 Message)
Etching Silver & Nickel (1 Message)
European Union (23 Messages)
European Union -Reply (3 Messages)
Exposure Lamps (2 Messages)
feature to feature tolerance (1 Message)
Fibers (1 Message)
Flash Gold and Switch Contacts (9 Messages)
Flex circuit assembly (1 Message)
Flex circuit flatness - Is the solution out there ? (7 Messages)
flex circuits (6 Messages)
flex circuits (kapton) (6 Messages)
flex circuits -Reply (3 Messages)
Fluxless Soldering (9 Messages)
forces on pads (1 Message)
FR4 Density (3 Messages)
FR4 temperature susceptibility (1 Message)
gold bond/aluminum pad intermetallic (2 Messages)
Gold Plated Surface Mount Pads (1 Message)
Gold Wire Bonding (1 Message)
Good Paper: metallic electromigration (1 Message)
Happy99.exe Virus (1 Message)
HASL Flux (4 Messages)
HASS Processes (1 Message)
Hello.....? (3 Messages)
Help needed to set up an PCB plant (1 Message)
Help!! Big problem (solder resist vs die attach) (2 Messages)
How to get water out? (3 Messages)
How to Import. (2 Messages)
IBM Information about Happy99 virus (1 Message)
IC programming (4 Messages)
Immersion Ni/Au & Solder Mask (3 Messages)
Information Please (3 Messages)
Information System (1 Message)
Ink and Thinner for marking of ICs (1 Message)
intrusive reflow (2 Messages)
Ionic Contamination - Rigid and Flexible Circuits (1 Message)
IPC Acceptance Criteria forGull Wing Leads (1 Message)
IPC heel definition for J leaded PLCC's (1 Message)
IPC News Release: VISION AWARDS AT APEX (1 Message)
IPC Printed Circuits Expo 99 (3 Messages)
IPC spec for adhesive on pads (2 Messages)
IPC-4101 / 26 (4 Messages)
IPC-4101 / 26 -Reply (1 Message)
IPC-4101 Help (2 Messages)
Kapton Insulated Wire (2 Messages)
LAMINATE DESIGNATION (3 Messages)
Laser Rework Station (1 Message)
Layer stack diagram generator wanted (1 Message)
lead free? (1 Message)
lead free? and world standards (1 Message)
LPI Solder Mask Limitations and Capabilities (5 Messages)
LPI Tented Vias for BGA's (4 Messages)
LPI Tented Vias for BGA's...Part II (3 Messages)
Meisei Corp Contact (1 Message)
Mil-2000A and IPC (3 Messages)
MIL-P-55110 continuance (5 Messages)
MIL-P-55110 replacement? (3 Messages)
MIL-S-13949 (2 Messages)
MIL-STD-105D (2 Messages)
Minimum Ni thickness (2 Messages)
Moisture sensing chips suppliers (3 Messages)
Multipack vs single board defect levels (1 Message)
My Wave Solder ....... Freudian Slip (1 Message)
My Wave Solder is getting fixed... (4 Messages)
My Wave Solder is getting fixed... -Reply (1 Message)
Need info (4 Messages)
New IPC E-Mail Forum (1 Message)
New Workshop/Exam Date Added to Designer Certification Calendar! (1 Message)
Ni Plating for wire bond (1 Message)
Ni/Au "black pad" problem (7 Messages)
No Clean Flux Compatability (3 Messages)
No Clean Flux Compatibility (1 Message)
No Clean Qualification cleanliness Requirements (1 Message)
No lead alloys for HAL (1 Message)
Off subject (1 Message)
Omikron (2 Messages)
OSP/FLUX, ETC. COMPATIBILITY (2 Messages)
Other email forums? (4 Messages)
Paste Height & Volume Tolerences... (1 Message)
Paste Height and Volume Tolerances (3 Messages)
Paste Viscosity (5 Messages)
PBGA accelerated thermal cycling (3 Messages)
PCB Baking (2 Messages)
PCB Facility (1 Message)
PCB scoreline breaking. (3 Messages)
PCB Stress measurement (2 Messages)
PCMCIA's materials for Ceramic BGA application (2 Messages)
Photo Definable Dielectric Suppliers (5 Messages)
Photopolymerized Conducting Polymers (2 Messages)
PHOTORESIST BOOK (3 Messages)
Pick & Place - Contact Systems vs. Multitroniks (1 Message)
Pin in paste (2 Messages)
Portable Oxygen Measurement (2 Messages)
Practice Bds (2 Messages)
Printing, Placement, and Reflow SPC (2 Messages)
Process capability of surface mount machine (4 Messages)
Project Costs (2 Messages)
PTV/PTH model (3 Messages)
Quality Assurance Standards & specs (2 Messages)
Quiet on the electronic front.... (2 Messages)
Re [TN] Hydrocarbons in reflow ovens (3 Messages)
ReChips (1 Message)
Recommendations for paste printers, chip shooter, reflow oven? (2 Messages)
ReFlexKapton (1 Message)
Reply RE: countersink hole (1 Message)
Reply, RE: De-Warping Procedure (1 Message)
Reply, RE: Warp and Twist (1 Message)
Reply, RE: Warp and Twist -Reply (1 Message)
Results from Bill Birch (1 Message)
REVOLVING DARKROOM DOOR (1 Message)
Rework through conformal coating (1 Message)
RF PCMCIAs and Cleanliness (7 Messages)
RF Testing (2 Messages)
Rotary Lead Trimmers? (3 Messages)
RS274X format & Cadence Allegro (2 Messages)
RS274X format... (13 Messages)
RTV for electronics (1 Message)
RTV for SMT components (9 Messages)
RV: Looking for an addres (3 Messages)
San Diego Area IPC Designers Council meeting 4/22 : DTF technology (2 Messages)
school project (2 Messages)
Search Engines (1 Message)
Search Engines Survey: Results (2 Messages)
SEMI Acquires Chip Scale International (1 Message)
shadowing of SMD in wave solder (1 Message)
Shear Testing of Virgin BGAs (1 Message)
SIGNOFF (1 Message)
SIGNOFF TECHNET (2 Messages)
Silicone Conformal Coating (4 Messages)
Silver Migration (8 Messages)
SIR test (4 Messages)
SMT 'fishbone' Cause-Effect diagram (5 Messages)
SMT Adhesives for stenciling? (1 Message)
SMT DFM (2 Messages)
Smt process (7 Messages)
SMT, replace solder with conductive epoxy? (6 Messages)
Solder Attachment (4 Messages)
Solder Attachment [Au plating in...] (4 Messages)
Solder ball with Bismuth for BGA (1 Message)
Solder Filled Vias - Motorola PLD 1.5 Power Surface Mount (1 Message)
Solder Filled Vias - Motorola PLD 1.5 Power Surface Mount Packag (1 Message)
Solder fillet (1 Message)
Solder Fumes (20 Messages)
Solder Fumes... (3 Messages)
Solder Joint Reliability (4 Messages)
Solder Joint Strength: Butt joint v/s ... (1 Message)
Solder Resist Paste Colour (1 Message)
Solder Robbing During Reflow. (2 Messages)
Solder Shock Testing (3 Messages)
Soldering fillet (10 Messages)
Soldering fillet & a cake from Jack (1 Message)
Soldering fillet > hlp Wrnr pls (1 Message)
Soldering Paladium-Silver-Platinum terminations (1 Message)
soldering to nickel-plated copper wire (1 Message)
soldering to silver epoxy (2 Messages)
Soldermask Minimum Thickness (3 Messages)
Soltech Prisma Conveyer... (1 Message)
Specification for Laminate Based on End Usage (2 Messages)
Specifying Differential Impedance (4 Messages)
Spray Fluxers (2 Messages)
Status of IPC-L-125 (1 Message)
STENCIL WEAR (3 Messages)
Steve Day (1 Message)
Subj: Re: [TN] 8 inch floppy disks (1 Message)
subscribe (2 Messages)
subscribe. (1 Message)
Supeplasticity (1 Message)
Superplasticity (4 Messages)
Superplasticity of Sn-40Pb solder (3 Messages)
Surface Insulation Resistance (2nd Request) (1 Message)
Tape and Reel Supplies (3 Messages)
[log in to unmask], [log in to unmask] (1 Message)
telephone number (3 Messages)
Tented and Filled Vias (2 Messages)
tenting vias (1 Message)
TH de-soldering equipment (2 Messages)
The SKA Worm... (2 Messages)
The Web sites of Printed Circuit Boards Manufacturers (6 Messages)
Thermal management of RF power surface mount packages (1 Message)
Thick film supplier search (3 Messages)
Third-Party Machine Maintenance... (1 Message)
Trimmed leads (1 Message)
Trimmed Leads.. (1 Message)
Two kinds of surface finish (2 Messages)
UK PWB design qualifications? (2 Messages)
UL 796F Available for Review and Comment (1 Message)
Ultrasonics for Cleaning Modern Electronics. (1 Message)
Unsubscribe (1 Message)
Used Equipment Vendors - SoCal? (1 Message)
Vacuum Packing (1 Message)
Velcro Straps (2 Messages)
Via in pad technology (1 Message)
Vibe units (2 Messages)
Viruses...I found out who it is!! (3 Messages)
Warning! Somebody is sending Virus files! (3 Messages)
Warp and Twist (1 Message)
Warp and Twist -Reply (1 Message)
Warp and Twist values (1 Message)
Warpage report (1 Message)
wavesolder chain link problem (1 Message)
What the heck is MIL-P-13949 (5 Messages)
X ray inspection for BGA (2 Messages)
X-Ray for Bare Fabs. (2 Messages)
Zevatech Pick and Place Machines (1 Message)
zincate dip for solder bumping? (2 Messages)
[ [TN] My Wave Solder is getting fixed...] (1 Message)
[ [TN] PCB scoreline breaking.] (1 Message)
[ [TN] Soltech Prisma Conveyer...] (1 Message)
[Gen] Y2K Sales Question (1 Message)
[PCB]Anyone know that? (1 Message)
[PCB]Anyone know that? [Rent's?] (1 Message)
[TN] Assy: Stencil Printing Adhesive for 0603 Components (1 Message)
[TN] Bar Coding on films (1 Message)
[TN] Corfin Tab Finishing (2 Messages)
[TN] Dull Solder Bump (3 Messages)
[TN] European Union (1 Message)
[TN] Ni/Au "black pad" problem (1 Message)
[TN] PTV/PTH model (1 Message)
[TN] Re[2]: European Union (4 Messages)
[TN] Re[2]: [TN] Corfin Tab Finishing (1 Message)
[TN] SMT - SPC fishbone chart (1 Message)
[TN] Smt process (1 Message)
[TN] Solder Fumes (2 Messages)
[TN] Two kinds of surface finish (1 Message)