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March 1999

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From:
Dan Brandler <[log in to unmask]>
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Date:
Tue, 30 Mar 1999 15:32:14 -0800
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Hello,

Since many of the solder joints are for the passive components ( SMT chip resistors and capacitors),
integrating the passive components into the PWB is a way of reducing the number of solder joints.
Furthermore, chip scale packaging and flip chip technology lessen the amount expose solder on the surface
of the board.  While this doesn't completely eliminate solder, we are moving in the right direction.

Dan Brandler, Ohmega Technologies, Inc.

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