Daan, sometimes when different development groups work on similar documents an
occasional conflict can creep in.  While it was the goal for the 610 task group to
follow the requirements of J-001, the item you site below, and a couple of others,
unfortunately made it into the published B versions of both documents.  The C
revisions of both these documents are well along in their development process.  The
leaders of both the task groups put together a review group to assure that no
conflicts will exist when they are next published.

Regarding the conflict that currently exist, you and your customer/supplier will need
to make a decision whether to use J-001 or 610 requirements.  If you'd like to
contact me off-net I'll be back in the office after 2:00 p.m. central time next
Monday and I'll be glad to discuss what is proposed for the C revs of both documents.
 Jack

==========================================
APEX - the industry's premier trade show in Electronics
Manufacturing, March 12-16, 2000, Long Beach, California.
More information on website www.ipc.org/html/apex.htm
-----------
Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]
847-790-5393
fax 847-509-9798

>>> "d. terstegge" <[log in to unmask]> 03/19/99 03:33AM >>>
Hello Technet,

Today I was looking for specifications regarding the amount of SMT glue that is
allowed on the soldering pads.
The ANSI-J-STD001A and B both mention (in 6.2.9 and in 6.1.6) that "Adhesive
materials shall not flow onto, or obscure, areas to be soldered". The word "shall"
means that the requirement is only mandatory for Class 3 products.
IPC-A-610 revision B mentions in paragraph 10.1 that (for class 3) it is only a
defect when there is less than 75 % minimum end joint width.
I always understood that IPC-A-610 is a "pictorial interpretive document", so I don't
understand the discrepancy ?
Which of the specs is right ?

Daan Terstegge
Signaal Communications
Unclassified

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