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March 1999

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Subject:
STENCIL WEAR
From:
Edward Brunker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 Mar 1999 10:38:36 GMT
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
     Hi,
     Has anyone done any studies for the change of depth of solder paste
     with wear on the stencil. Metal blade squeegees damage the stencil
     over a period of time, yielding an uneven surface in the form of
     furrows in the direction of travel. Any uneveness in the stencil is
     going to hold the blades that much further off the board giving more
     solder paste.
     Any comments?
     Regards
     Edward Brunker

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