Hi Don,

Didn't I ask almost the exact same question this morning?

Anyways, here is what I have found out so far.  I get this info from CyberOptics who says that they have
done research with a lot of companies who use their equipment.  The limits they recommended are +/- 20% for
warning limits & +/- 40% for failure limits.  These limits are only based on the experience of the
companies that use their equipment.  I would be interested if anyone knows of any scientific research on
the solder strength and such.  Would anyone be willing to share any technical papers with the rest of us?

Rob


Hope this helps...

Don E Steffen wrote:

>      Techno's
>
>      We have a General Scanning GC8200 3D Laser Paste Inspection System for
>      our SMT lines.  We are trying to develope the methods and tolerances
>      in order to establish warning and failure limits for each of our
>      boards.
>
>      I would like to know if anyone has any recommedations in percentage of
>      the paste height, volume, and area for limits they set for the Warning
>      and Failure limits. How were these limits derived? We started wide
>      +/-30% and then started to narrow the limits!
>
>      Has there been anyone then take the next step after establishing these
>      limits and performed Vibration or Shock Test?
>
>      Appreciate any help you can provide!
>
>      Donn Steffen
>      Quality Engineer
>      VDO-CS
>
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