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March 1999

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Subject:
zincate dip for solder bumping?
From:
Phil Hersey <[log in to unmask]>
Reply To:
Phil Hersey <[log in to unmask]>
Date:
Mon, 29 Mar 1999 08:33:44 -0800
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Does anyone know anything about "zincate" dip for sensitizing aluminum for
electroplating?  Atotech has such a bath and evidently it makes aluminum
plateable.  If so, I can envision a process to solder bump even already
singulated die by zincating the bond pads and then solder dipping.

Resp.
Phil Hersey, Carson City Nevada USA

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