We are in the process of determining the most efficient way to run our smt
process.  Right now we only have a half line and are looking at adding the
back half of the line.  Our current process takes us through reflow first,
flip the product, then move the product to the beginning of the line and
then run the bottom side (curing).  If we use this current process with the
second half of the line, we will need to flip the product over before it
reaches the hand insertion line.  Our thoughts are can we run bottom
(curing) first, flip the product, and then run top side (reflow)?  This
will require us to only flip the product once.  Are there any issues with
running curing first and then running reflow?  After the glue is cured, it
will be passing through the oven during reflow at a higher temperature than
the curing temperature.  Will the reflow temperature have any effect on the
glue?

Rob Williams

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