Hello Techneters,

I would like to solicit you comments, experiences, suggestions and
hopefully success stories concerning the processing of Immersion
Nickel/Gold with respect to LPI Solder Mask adhesion.
Presently, we solder mask first then send out to subcontractors for
Immersion Nickel/Gold. We use Tayio PSR4000AD as well as PSR4000BN. From
time to time we see peelers, leakers whatever you would like to call it.
The same solder mask performs fine in HASL and Entek enviroments. I'am
stumped. Are any of you runing a 6 sigma process reguarding this?

Areas in question include;
* Surface prep prior to LPI
* LPI mask itself ...ie manufacturer?
* Exposure and Development
* Final Cure
* Immersion Nickel/Gold
   Type/Manufactures
   Operation parameters ... ie temperature, concentrations, pH, time
   Thickness of Nickel deposit
* Should we Immersion Nickel/Gold before mask?
* Mystery or Magic?

Thank You,
Robert Jordan
408-738-0693  x1116

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