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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 3 Mar 1999 06:18:12 -0500 |
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Howard,
It might be that the reverse order of application would be acceptable for a wire bond?
Is this an "all gold board"?
The tab plater would likely sheer the immersion gold off anyway?
Paul Wilson
R&D Manager / Plant Chemist
Circuit Center, Inc.
4738 Gateway Circle
Dayton, OH 45440
Phone (937) 435-2131 Fax (937) 435-7698
http://www.circuitcenter.com
-----Original Message-----
From: Howard Lin [SMTP:[log in to unmask]]
Sent: Wednesday, March 03, 1999 12:07 AM
To: [log in to unmask]
Subject: [TN] Two kinds of surface finish
Dear All,
I got one inquiry from our customer on two kinds of surface finisf for
one board. They need both immersion gold and hard gold plating. Can I
dirctly apply hard gold plating over immersion gold on gold finger area?
Is there any quality issue that I should concern?
I am very appreciated for any input.
Regards,
Howard
Maxedge Electronic Corp.
[log in to unmask]
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