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March 1999

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Subject:
From:
"Dr. Jerome S Sallo" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 22 Mar 1999 16:44:30 EST
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Another option for the elimnation of adhesive in flexible circuits is a
product made by reel to reel vacuum deposition onto polyimide film followed by
electrodeposition of copper. The product is available from Gould in a variety
of copper and polyimide film thickness Copper as thin as 0.2 microns is
available as are thichnesses up to one ounce.  Contact me off line for more
information
Jerry Sallo
[log in to unmask]
760 346 6717

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