Hi Stu,
I would recommend that you investigate the use of a dual dot:
    _______
   |_______|
   |   |
      ()|   |()   where () denotes the dot location
   |_______|
   |_______|

The dots only need to be on the periphery of the component with little
adhesvie under the part.
I've used the dual dot configuration on all chip devices down to 0805
with no issues related to residue or moisture entrapment.

If you'd like contact me offline.

Steve Sauer
[log in to unmask]

Subject: [TN] 0612 vs. 1206


     The EEs at my company are proposing using 0612 and 0508 chip
     components instead of the traditional 1206 and 0805 styles. They
have
     electrical reasons to have the end metallization on the long
dimension
     instead of on the short ends. A problem comes up with SMT glue dot
     since the pads on the board are then only .020 apart on the long
     dimension. The glue dot will probably infringe on the pad area.

     We have several suggestions on how to handle this issue including
     intentionally putting glue on the pad area. I, with my Quality
     Standard hat on, say that we should not do that. Others suggest a
     sculpted pad to allow a wider space in the middle for the glue dot.

     Another idea was to have 4 corner pads but 1) the Mentor CAD system
     only allows for 2 pads on a 2 contact component and 2) the EEs want
as
     much part to pad contact as possible.

     Does anyone have experience and input on this question?

     TIA,

     Stu Korringa
     Smiths Industries
     Grand Rapids, Mi 49512
     616-241-8189
     [log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################