Yes resisters, and caps can be on there side.Page 129 IPC-A-610B,provided
the following are met: chip comp. is surrounded by taller comp., no more
then five chip comp. on each assembly are mounted sideways, and chip comp.
demensions are length(L)<3.05mm,  and width(w)<1.52mm. we never rework them
anymore, unless a customer would request otherwise, and in the past 4or 5
years they haven't.
-----Original Message-----
From: ryu <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Tuesday, March 02, 1999 1:30 AM
Subject: [TN] benchmark on component placement


>Does you company allow chip component to be placed up-side down, or on
>it's side( vertical)?
>If the answer is yes, what is maximum quantity you will allow for each
>defect on each board?
>So far I have heard  that many OEM company, like IBM and Seagate do
>allow this kind of misplaced component on their boards.  but I have not
>yet see a solid document from either of the company.   I decided to
>bring up this question to the group, and see if we can do a quick
>benchmark within the group on tihs subject.  Thanks for the time reading
>this.
>
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